The embodiments of the present application provide a test board, which is applied in temperature and humidity tests for a memory module, and includes: a memory slot configured to be connected with the memory module; a power supply terminal configured to supply power to the memory module; an overcurrent protection unit connected in series between the memory slot and the power supply terminal and configured to be blown when the memory module is short-circuited; and an indicating unit connected in series between the overcurrent protection unit and a ground terminal and configured to indicate a state of the overcurrent protection unit. The embodiments of the present application provide a test board capable of indicating temperature and humidity test results.

The present disclosure relates to an apparatuses and methods for memory management and more particularly to voltage or current detector for a non-volatile memory component that is coupled to a host device or to a System-on-Chip. The memory component includes a memory controller and comprises a voltage or current detector including: a comparator receiving on a voltage input a voltage value Vx; a digital to analog converter coupled to a reference voltage potential and having an output connected to other input of said comparator; a Finite State Machine receiving the output of said comparator and producing digital outputs for the inputs of said memory controller; a current to voltage converter receiving as input a current value Ix to be detected and having an output connected to said Finite State Machine.

A memory circuit includes a first driver circuit, a first column of memory cells coupled to the first driver circuit, a first current source, a tracking circuit configured to track a leakage current of the first column of memory cells, and a footer circuit coupled to the first column of memory cells, the first current source and the tracking circuit.

The present invention is directed to a nonvolatile memory device that includes a plurality of memory slices, each memory slice including one or more memory sectors and a read circuit for sensing the resistance state of a magnetic memory cell in the memory sectors. The read circuit includes first and second input nodes; a sense amplifier having first and second input terminals; a first target resistor and a balancing resistor connected in series between the first input node and the first input terminal; a multiplexer having a first input, a second input, and an output, with the first input being connected to the second input node and the output being connected to the second input terminal; a second target resistor and an offset resistor connected in series between the second input node and the second input; and first and second current sources connected to the first and second input terminals, respectively.

An apparatus and method for detecting leakage current in a non-volatile memory array. A reference current is connected to a leakage detection circuit. A reference code is determined for the leakage detection circuit coupled to a switching circuit. The reference code establishes a leakage current threshold. The reference current is disconnected from the leakage detection circuit and the switching circuit. Next, the leakage detection circuit is connected to a set of word lines of a storage block of a non-volatile memory array by way of the switching circuit. A memory current is generated within the set of word lines. A leakage code is determined for the set of word lines representing leakage current from the word lines in response to the memory current. The leakage code is compared with the reference code. If the leakage code exceeds the reference code, the storage block is deemed unusable.

A memory device that includes a plurality of non-volatile memory cells and a controller. The controller is configured to erase the plurality of memory cells, program each of the memory cells, and for each of the memory cells, measure a threshold voltage applied to the memory cell corresponding to a target current through the memory cell in a first read operation, re-measure a threshold voltage applied to the memory cell corresponding to the target current through the memory cell in a second read operation, and identify the memory cell as defective if a difference between the measured threshold voltage and the re-measured threshold voltage exceeds a predetermined amount.

A variety of applications can include devices or methods that provide read processing of data in memory cells of a memory device without predetermined read levels for the memory cells identified. A read process is provided to vary a selected access line gate voltage over time, creating a time-variate sequence where memory cell turn-on correlates with programmed threshold voltage. Total string current of data lines of a group of strings of memory cells of the memory device can be monitored during a read operation of selected memory cells of the strings to which a ramp voltage with positive slope is applied to an access line coupled to the selected memory cells. Selected values of the change of the total current with respect to time, from the monitoring of the total current, are determined. Read points to capture data are based on the determined selected values. Additional devices, systems, and methods are discussed.

A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

A memory device comprises a memory array; a word line driver circuit including a charge pump circuit configured to generate a program voltage target to be applied to a word line to program a memory cell of the memory array, and a control loop to activate the charge pump circuit using a control signal according to a comparison of a pump circuit output voltage to the program voltage target; a sensor circuit that compares a duty cycle of the control signal to a specified duty cycle after the charge pump circuit output reaches the program voltage target, and provides an indication of current generated by the charge pump circuit according to the duty cycle; and logic circuitry that generates a fault indication when the current generated by the charge pump circuit is greater than a specified threshold current.

A method of testing a non-volatile memory (NVM) array includes heating the NVM array to a target temperature. While the NVM array is heated to the target temperature, a current distribution is obtained by measuring a plurality of currents of a subset of NVM cells of the NVM array, each NVM cell of the NVM array is programmed to one of a logically high state or a logically low state, and first and second pass/fail (P/F) tests on each NVM cell of the NVM array are performed. A bit error rate is calculated based on the current distribution and the first and second P/F tests.