Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.

A memory system and a data processing system including the memory system may manage a plurality of memory devices. For example, the data processing system may categorize and analyze error information from the memory devices, acquire characteristic data from the memory devices and set operation modes of the memory devices based on the characteristic data, allocate the memory devices to a host workload, detect a defective memory device among the memory devices and efficiently recover the defective memory device.

A semiconductor memory device includes a memory cell array and an address decoder. The memory cell array includes a plurality of memory blocks, each of the plurality of memory blocks includes a plurality of dynamic memory cells coupled to word-lines and bit-lines, each of the plurality of memory blocks are divided into a plurality of row blocks by row block identity bits of a row address, and each of the of row blocks includes a plurality of sub-array blocks arranged in a first direction. The address decoder changes a physical row address of a memory cell that stores or outputs data based on a column address received with a write command or a read command.

A semiconductor memory module includes a volatile memory device, a nonvolatile memory device, data buffers, and a controller. The controller outputs first data read from the volatile memory device or the nonvolatile memory device to an external device through the data buffers, and writes second data received from the external device through the data buffers in the volatile memory device or the nonvolatile memory device. The controller performs a failover operation depending on a failover request that includes fail information indicating a position of a failed data buffer among the data buffers. In the failover operation, the controller conveys third data associated with the failed data buffer to the external device through a failover data buffer among the data buffers.

The disclosure is related a method for testing a magnetic memory device and a test apparatus are provided. In some exemplary embodiments, the method includes at least the following steps. The magnetic memory device is initialized by applying a first magnetic field to force write a first data to the magnetic memory device. Then, a second magnetic field is applied to the magnetic memory device. Second data may be obtained from the magnetic memory device by performing a chip probing process. Accordingly, performance of the magnetic memory device may be determined based on the second data.

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.

A method of managing errors in a plurality of storage drives includes receiving, at a memory controller coupled to at least one storage medium in an SSD, a read command from a host interface. The method also includes retrieving, from the storage medium, read data corresponding to a plurality of data chunks to be retrieved in response to the read command, and determining that at least one data chunk of the plurality of data chunks is unable to be read, the at least one data chunk corresponding to a failed data chunk. And in response to determining the failed data chunk, sending to the host interface the read data including the failed data chunk or excluding the failed data chunk. And in response to the read command sending to the host interface status information about all data chunks.

A method of managing errors in a plurality of storage drives includes receiving, at a memory controller coupled to at least one storage medium in an SSD, a read command from a host interface. The method also includes retrieving, from the storage medium, read data corresponding to a plurality of data chunks to be retrieved in response to the read command, and determining that at least one data chunk of the plurality of data chunks is unable to be read, the at least one data chunk corresponding to a failed data chunk. And in response to determining the failed data chunk, sending to the host interface the read data including the failed data chunk or excluding the failed data chunk. And in response to the read command sending to the host interface status information about all data chunks.

Methods, systems, and apparatuses for redundancy in a memory array are described. A memory array may include some memory cells that are redundant to other memory cells of the array. Such redundant memory cells may be used if a another memory cell is discovered to be defective in some way; for example, after the array is fabricated and before deployment, defects in portions of the array that affect certain memory cells may be identified. Memory cells may be designated as redundant cells for numerous other memory cells of the array so that a total number of redundant cells in the array is relatively small fraction of the total number of cells of the array. A configuration of switching components may allow redundant cells to be operated in a manner that supports redundancy for numerous other cells and may limit or disturbances to neighboring cells when accessing redundancy cells.

A semiconductor system includes a first semiconductor device and a first semiconductor device. The first semiconductor device outputs a clock, a chip selection signal and addresses. The second semiconductor device generates a masking signal from the addresses inputted in synchronization with a first pulse of the clock in response to the chip selection signal and decodes internal addresses generated from the addresses inputted in synchronization with a second pulse of the clock to select a word line. The second semiconductor device controls a connection between an address decoder and a fuse circuit in response to the masking signal. The address decoder selects the word line.