A system includes multiple memory banks that store data. The system also includes an address path coupled to the memory banks that provides a row address to the memory banks. The system further includes a command address input circuit coupled to the address path that refreshes a first set of memory banks via the address path and, when the command address input circuit refreshes the first set of memory banks, activates a row of a second set of memory banks to store the data or read the data from the row of the second set of memory banks via the address path.

A memory circuit, comprises a first set of memory cells configured to operate in a direct access mode or in a refresh mode and a second set of memory cells configured to operate in the direct access mode and in the refresh mode. The memory circuit further comprises a controller configured to receive a write request and to execute the write request for a set of memory cells being in direct access mode; and to buffer the write request for later execution for a set of memory cells being in refresh mode.

A base chip including first to Nth delay units coupled in series, where N is a natural number equal to or larger than 2, wherein when the number of stacked chips over the base chip is 1, the base chip is suitable for delaying a refresh signal, and generating first to Xth delayed refresh signals using the first to Xth delay units among the first to Nth delay units, where X is a natural number having a relation of N>X1, and when the number of stacked chips over the base chip is 2, the base chip is suitable for delaying the refresh signal, and generating first to Yth delayed refresh signals using the first to Yth delay units among the first to Nth delay units, where Y is a natural number having a relation of NY>X.

A memory circuit (100), comprises a first set of memory cells (102a; 202a) configured to operate in a direct access mode or in a refresh mode and a second set of memory cells (102b; 202b) configured to operate in the direct access mode and in the refresh mode. The memory circuit (100) further comprises a controller (104) configured to receive a write request and to execute the write request for a set of memory cells being in direct access mode; and to buffer the write request for later execution for a set of memory cells being in refresh mode.

A base chip including first to Nth delay units coupled in series, where N is a natural number equal to or larger than 2, wherein when the number of stacked chips over the base chip is 1, the base chip is suitable for delaying a refresh signal, and generating first to Xth delayed refresh signals using the first to Xth delay units among the first to Nth delay units, where X is a natural number having a relation of N>X1, and when the number of stacked chips over the base chip is 2, the base chip is suitable for delaying the refresh signal, and generating first to Yth delayed refresh signals using the first to Yth delay units among the first to Nth delay units, where Y is a natural number having a relation of NY>X.

A memory circuit (100), comprises a first set of memory cells (102a; 202a) configured to operate in a direct access mode or in a refresh mode and a second set of memory cells (102b; 202b) configured to operate in the direct access mode and in the refresh mode. The memory circuit (100) further comprises a controller (104) configured to receive a write request and to execute the write request for a set of memory cells being in direct access mode; and to buffer the write request for later execution for a set of memory cells being in refresh mode.

In various examples, refreshing a bank can include receiving a refresh command, wherein the refresh command comprises selector bits and receiving mode register bits from the mode registers. Refreshing a bank can also include refreshing a number of banks from the plurality of banks utilizing the mode register bits and the selector bits.

A memory includes a local control circuitry that manages refresh transactions using a set of sense amplifiers separate from those used for access (read and write) transactions. The local control circuitry interrupts refresh transactions to prioritize access requests, thereby offering improved memory performance. The local control circuitry also divides refresh transactions into phases and periods based on whether the refresh transaction requires access to bitlines used for read and write access. This division allows the local control circuitry to interleave and interrupt refresh transactions with access transactions in a manner that minimizes access interference.

An integrated circuit (IC) memory device includes an array of storage cells configured into multiple banks. Interface circuitry receives refresh commands from a host memory controller to refresh the multiple banks for a first refresh mode. On-die refresh control circuitry selectively generates local refresh commands to refresh the multiple banks in cooperation with the host memory controller during a designated hidden refresh interval in a second refresh mode. Mode register circuitry stores a value indicating whether the on-die refresh control circuitry is enabled for use during the second refresh mode. The interface circuitry includes backchannel control circuitry to transmit a corrective action control signal during operation in the second refresh mode.

A memory device includes a plurality of memory banks. The memory device receives a linked activation command along with a bank address which specifies a first one of the memory banks. While an access operation is performed on the first memory bank responsive to the linked activation command, a refresh operation is performed on a second memory bank responsive to the linked activation. The first and the second memory banks are part of a bank link group. A second linked activation command may be received a time after first linked activation command which is less than a refresh delay tRFCL as long as the second linked activation command is to a different bank link group.