One embodiment provides a memory module. The memory module includes a plurality of rows of memory cells, with a respective row comprising one or more canary memory cells that are more susceptible to disturbance than non-canary memory cells, and a disturbance-detection circuit coupled to at least one canary memory cell of a corresponding row and configured to output a control signal in response to the disturbance to the canary memory cell exceeding a predetermined threshold.

The present disclosure includes apparatuses and methods related to refresh in memory. An example apparatus can refresh an array of memory cells in response to a portion of memory cells in an array having threshold voltages that are greater than a reference voltage.

A memory device may include a memory medium and a memory controller. The memory medium may be configured to perform a self-refresh operation and an auto-refresh operation in response to a self-refresh signal and an auto-refresh control signal, respectively. The memory controller may be configured to control the auto-refresh operation by transmitting the auto-refresh control signal to the memory medium. The memory medium includes a self-refresh controller. The self-refresh controller may be configured to control the self-refresh operation based on a self-refresh cycle varying according to an internal temperature of the memory medium and transmit the self-refresh signal to the memory controller. The memory controller may be configured to generate the auto-refresh control signal based on an auto-refresh cycle. The auto-refresh control signal may be determined by the self-refresh signal transmitted from the memory medium.

Methods, systems, and devices for refresh rate control for a memory device are described. For example, a memory array of a memory device may be refreshed according to a first set of refresh parameters, such as a refresh rate. The memory device may detect an event at the memory device associated with a reduction in data integrity. In some cases, the event may be associated with a temperature of the memory device, a voltage level detected at the memory device, an error event at the memory device, or the like. As a result of detecting the event, the memory device may adapt one or more of the set of refresh parameters, such as increasing the refresh rate for the memory array. In some cases, the memory device may adapt the set of refresh parameters by increasing a quantity of rows of the memory array that are refreshed during a refresh operation, decreasing a periodicity between refresh operations, or both.

Methods, systems, and devices for voltage adjustment based on, for example, pending refresh operations are described. A memory device may periodically perform refresh operations to refresh volatile memory cells and may at times postpone performing one or more refresh operations. A memory device may determine a quantity of pending (e.g., postponed) refresh operations, such as by determining a quantity of refresh intervals that have elapsed without receiving or executing a refresh command, among other methods. A memory device may pre-emptively adjust (or cause to be adjusted) a supply voltage associated with the memory device or memory device component based on the quantity of pending refresh operations to prepare for the current demand associated with the performing the one or more pending refresh operations. For example, the memory device may increase a supply voltage associated with one or more components to prepare for performing multiple pending refresh operations.

Methods, systems, and devices for biasing a memory cell during a read operation are described. For example, a memory device may bias a memory cell to a first voltage (e.g., a read voltage) during an activation phase of a read operation. After biasing the memory cell to the first voltage, the memory device may bias the memory cell to a second voltage greater than the first voltage (e.g., a write voltage) during the activation phase of the read operation. After biasing the memory cell to the second voltage, the memory device may initiate a refresh phase of the read operation. Based on a value stored by the memory cell prior to biasing the memory cell to the first voltage, the memory device may initiate a precharge phase of the read operation.

A semiconductor device may include: a first chip, configured to receive a command and an address; and a second chip, configured to receive the command and the address. The first chip may include: a weak cell address storage circuit configured to store a weak cell address; a refresh control circuit configured to generate a refresh address based on the weak cell address, when the second chip is selected by a chip address; and a bank in which a refresh operation is performed by the refresh address.

Disclosed herein is an apparatus that includes a memory cell array including a plurality of memory cells, a first counter circuit configured to periodically update a count value during a first operation mode, a burst clock generator configured to successively generate a burst pulse predetermined times When the count value indicates a predetermined value, and a row address control circuit configured to perform a refresh operation on the memory cell array in response to the burst pulse.

The present disclosure includes apparatuses and methods related to compute components formed over an array of storage elements. An example apparatus comprises a base substrate material and an array of memory cells formed over the base substrate material. The array can include a plurality of access transistors comprising a first semiconductor material. A compute component can be formed over and coupled to the array. The compute component can include a plurality of compute transistors comprising a second semiconductor material. The second semiconductor material can have a higher concentration of doping ions than the first semiconductor material.

Disclosed herein is an apparatus that includes a memory cell array including a plurality of memory cells, a first counter circuit configured to periodically update a count value during a first operation mode, a burst clock generator configured to successively generate a burst pulse predetermined times when the count value indicates a predetermined value, and a row address control circuit configured to perform a refresh operation on the memory cell array in response to the burst pulse.