Methods, systems, and devices for refresh rate control for a memory device are described. For example, a memory array of a memory device may be refreshed according to a first set of refresh parameters, such as a refresh rate. The memory device may detect an event at the memory device associated with a reduction in data integrity. In some cases, the event may be associated with a temperature of the memory device, a voltage level detected at the memory device, an error event at the memory device, or the like. As a result of detecting the event, the memory device may adapt one or more of the set of refresh parameters, such as increasing the refresh rate for the memory array. In some cases, the memory device may adapt the set of refresh parameters by increasing a quantity of rows of the memory array that are refreshed during a refresh operation, decreasing a periodicity between refresh operations, or both.

A modified 1C1T cell detects when the charge in the memory cell drops below a predetermined voltage due to leakage and asserts a refresh signal indicating that refresh needs to be performed on those memory cells associated with the modified 1C1T memory cell. The associated memory cells may be a row, a bank, or other groupings of memory cells. Because temperature affects leakage current, the modified memory cell automatically adjusts for temperature.

A method for performing a refresh operation on a memory cell efficiently is provided. A semiconductor device including a normal memory cell and a trigger memory cell that determines whether the refresh operation is performed or not is used. Specific data is written to the trigger memory cell, and the data is read from the trigger memory cell at predetermined timing. When the read data agrees with the written specific data, no special operation is performed. When the read data does not agree with the written specific data, a refresh operation is performed automatically.

Disclosed herein is an apparatus that includes a memory cell array including a plurality of memory cells, a first counter circuit configured to periodically update a count value during a first operation mode, a burst clock generator configured to successively generate a burst pulse predetermined times when the count value indicates a predetermined value, and a row address control circuit configured to perform a refresh operation on the memory cell array in response to the burst pulse.

A semiconductor device may include a refresh control circuit which may generate test addresses that are counted based on a refresh signal and a detection clock signal and may senses logic levels of internal data corresponding to the test addresses to generate a sense signal. The semiconductor device may include a memory circuit may include a plurality of word lines which are selected by the test addresses and may output the internal data stored in memory cells connected to the word lines. The semiconductor device may include an address storage circuit may divide each of the test addresses into a main group and a sub-group to store the main groups and the sub-groups of the test addresses. The address storage circuit may store the sub-groups which are inputted at a point of time that the sense signal is generated, regarding the stored main groups having the same level combination.

A high retention time memory element is described that has dual gate devices. In one example, the memory element has a write transistor with a metal gate having a source coupled to a write bit line, a gate coupled to a write line, and a drain coupled to a storage node, wherein a value is written to the storage node by enabling the gate and applying the value to the bit line, and a read transistor having a source coupled to a read line, a gate coupled to the storage node, and a drain coupled to a read bit line, wherein the value of the storage node is sensed by applying a current to the source and reading the sense line to determine a status of the gate.

An apparatus may include an address counter to provide first address information and second address information. The first address information may include a first number of bits and the second address information may include a second number of bits that is smaller than the first number of bits. The address counter may perform a first updating operation. The first updating operation being such that the first address information is updated from a first initial value to a first final value. The address counter may also perform a second updating operation, the second updating operation being such that the second address information is updated from a second initial value to a second final value. In addition, the address counter may also perform the second updating operation at least twice per the first updating operation being performed once.

A method for performing a refresh operation on a memory cell efficiently is provided. A semiconductor device including a normal memory cell and a trigger memory cell that determines whether the refresh operation is performed or not is used. Specific data is written to the trigger memory cell, and the data is read from the trigger memory cell at predetermined timing. When the read data agrees with the written specific data, no special operation is performed. When the read data does not agree with the written specific data, a refresh operation is performed automatically.

The present disclosure includes apparatuses and methods related to compute components formed over an array of storage elements. An example apparatus comprises a base substrate material and an array of memory cells formed over the base substrate material. The array can include a plurality of access transistors comprising a first semiconductor material. A compute component can be formed over and coupled to the array. The compute component can include a plurality of compute transistors comprising a second semiconductor material. The second semiconductor material can have a higher concentration of doping ions than the first semiconductor material.

A semiconductor device may include: a first chip, configured to receive a command and an address; and a second chip, configured to receive the command and the address. The first chip may include: a weak cell address storage circuit configured to store a weak cell address; a refresh control circuit configured to generate a refresh address based on the weak cell address, when the second chip is selected by a chip address; and a bank in which a refresh operation is performed by the refresh address.