Technology is disclosed for applying a positive temperature coefficient (Tco) voltage to a control terminal of a dummy select transistor. The dummy select transistor resides on a NAND string having non-volatile memory cells and a regular select transistor. The dummy select transistor is typically ON (or conductive) during memory operations such as selected string program, read, and verify. In an aspect, the positive Tco voltage is applied to the control terminal of a dummy select transistor during a program operation. Applying the positive Tco voltage during program operations reduces or eliminates program disturb to the dummy select transistor. In some aspects, the dummy select transistor is used to generate a gate induced drain leakage (GIDL) current during an erase operation. In some aspects, the dummy select transistor is a depletion mode transistor.

A memory system includes a plurality of blocks of memory blocks, each including a plurality of memory cells. The method for programming the memory system includes during a program process, performing a first program operation to program a first memory block, waiting for a delay time after the first program operation is completed, after waiting for the delay time, performing an all-level threshold voltage test to determine if threshold voltages of the first memory block are greater than corresponding threshold voltages, and performing a second program operation to program the first memory block according to a result of the all-level threshold voltage test.

A method for conducting a read-verification operation on a target memory cell in a three-dimensional (3D) memory device includes removing fast charges of the target memory cell at a read-prepare step and measuring a threshold voltage of the target memory cell at a sensing step. Removing the fast charges of the target memory cell includes applying a prepare voltage (V.sub.prepare) on an unselected top select gate (Unsel_TSG) of an unselected memory string, applying a first off voltage (V.sub.off) on a selected word line (Sel_WL) associated with the target memory cell, and applying a pass voltage (V.sub.pass) on an unselected word line (Unsel_WL).

A memory device includes bit lines coupled to a memory block, a page buffer group selecting the bit lines in response to page buffer signals, applying a precharge voltage to selected bit lines from among the bit lines, and applying a ground voltage to unselected bit lines during a program verify operation, and a page buffer controller outputting the page buffer signals to selectively apply the precharge voltage to the bit lines according to an order of read operations on a logical page during the program verify operation.

An apparatus includes a plurality of solid-state storage elements, a plurality of control lines coupled to the plurality of solid-state storage elements, and control circuitry in communication with the plurality of control lines. The control circuitry is configured to during a first phase of a control line pre-charging stage, charge one or more unselected control lines of the plurality of control lines using a regulated charging current for a period of time based at least in part on a predicted parasitic capacitance associated with the programming state of the control lines, and during a second phase of the control line pre-charging stage, charge the one or more unselected bit lines to an inhibit voltage level using an unregulated charging current.

A semiconductor memory device includes memory cells, a first circuit that includes a first latch group including first and second data latch circuits and a second latch group including third and fourth data latch circuits, and a control circuit configured to control a write operation during which first and second data to be written into the memory cells are stored in the first and second data latch circuits, respectively, wherein the first and second data are also stored in the third and fourth data latch circuits, respectively, while the first and second data stored in the first and second data latch circuits, respectively, are being written in the memory cells.

A control circuit connected to non-volatile memory cells applies a programming signal to a plurality of the non-volatile memory cells in order to program the plurality of the non-volatile memory cells to a set of data states. The control circuit performs program verification for the non-volatile memory cells, including applying bit line voltages during program verification based on word line position and data state being verified.

A memory device includes a sense amplifier (SA) latch coupled to a sense node. A dynamic latch (DL) is connected to the SA latch and coupled to sense node. A sense line includes the sense node and is selectively connected to the SA latch, the DL, and a bit line that is coupled to a memory cell string. Control logic is coupled to the SA latch and the DL, and to: cause a pre-program verify voltage to boost the sense node; and, in response to detecting a high bit value stored in SA latch, cause a voltage to turn on set transistor(s) of DL so that a first bias voltage or a second bias voltage is stored at a latch transistor. The first bias voltage is useable for slow programming of a selected memory cell and the second bias voltage is useable for fast programming of the selected memory cell.

A memory device includes a cell group including a plurality of non-volatile memory cells capable of storing data and a control circuit configured to perform plural program loops for storing the data, each program loop including a program voltage application operation and a verification operation. During the respective program loop, the control circuit performs the verification operation for an N target level, an N−1 target level lower than the N target level, and an N+1 higher than the N target level, in response to the program voltage application operation for the N target level. When a quantity of non-volatile memory cells having threshold voltages over the N+1 target level satisfies a preset criterion, the control circuit skips a next verification for a target level lower than the N+1 target level, in response to a next program voltage application operation for the N+1 target level.

Embodiments of the present disclosure relate to a memory device and an operating method of the memory device. According to embodiments of the present disclosure, a memory device may include a plurality of memory cells, a plurality of word lines, and a plurality of bit lines, wherein the memory device may determine, when programming a first memory cell among the plurality of memory cells to a target program state, a precharge time based on a number of times that a program voltage is applied to a first word line connected to the first memory cell among the plurality of word lines, and may precharge the plurality of bit lines during the precharge time when executing a verify operation on the first memory cell.