A method of cache programming of a NAND flash memory in a triple-level-cell (TLC) mode is provided. The method includes discarding a lower page of a first programming data from a first set of data latches in a plurality of page buffers when a first group of logic states are programmed and verified. The page buffers include the first, second and third sets of data latches configured to store the lower page, a middle page and an upper page of programming data, respectively. The method also includes uploading a lower page of second programming data to a set of cache latches, transferring the lower page of the second programming data from the set of cache latches to the second set of data latches after the discarding the middle page of the first programming data, and uploading a middle page of the second programming data to the set of cache latches.

Power regulation in an integrated memory assembly having control semiconductor dies and memory semiconductor is disclosed herein. A master control die regulates power usage by the integrated memory assembly. Each control die reports information about its expected power usage to the master control die. The master control die determines a plan that meets a power criterion for the integrated memory assembly. The plan may maximize the power usage in each time period, while staying within a power budget. The plan can include selecting which of the memory dies perform a memory operation (or phase of a memory operation) during a given time period. The master control die may send a die scheduling plan to each of the other control dies. Each die scheduling plan indicates when memory operations and/or phases of memory operations are to be performed.

A nonvolatile memory device includes a memory cell array in a first semiconductor layer and including a first memory cell connected to a first word line and a first bit line and a second memory cell connected to the first word line and a second bit line; a page buffer circuit in a second semiconductor layer and including a first page buffer connected to the first bit line, and a second page buffer connected to the second bit line; and a page buffer controller in the second semiconductor layer. The page buffer controller controls the first and second page buffers so that a develop timing of a first sensing node of the first page buffer is different from a develop timing of a second sensing node of the second page buffer. The first page buffer is closer to a through electrode region than the second page buffer.

Resistive memory sensing methods and devices are described. One such method includes performing a voltage based multiple pass sensing operation on a group of cells coupled to a selected conductive line of an array of resistive memory cells. The voltage based multiple pass sensing operation can include providing an indication of those cells of the group that conduct at least a threshold amount of current responsive to one of a number of different sense voltages successively applied to the selected conductive line during each of a corresponding number of the multiple passes, and for each successive pass of the multiple passes, disabling data lines corresponding to those cells determined to have conducted the threshold amount of current in association with a previous one of the multiple passes.

A nonvolatile memory device includes a memory cell array including memory cells and a page buffer circuit. The page buffer circuit includes page buffer units and cache latches. The cache latches are spaced apart from the page buffer units in a first horizontal direction, and correspond to respective ones of the plurality of page buffer units. Each of the page buffer units includes a pass transistor connected to each sensing node and driven in response to a pass control signal. The page buffer circuit being configured to perform a data transfer operation, based on performing a first data output operation to output data, provided from a first portion of page buffer units, from a first portion of cache latches to a data input/output (I/O) line, the data transfer operation configured to dump sensed data from a second portion of page buffer units to a second portion of cache latches.

Disclosed are a nonvolatile memory device and a read method of the nonvolatile memory device. The nonvolatile memory device includes a memory cell array, a row decoder circuit, and a page buffer circuit including first latches and second latches. The page buffer circuit respectively latches first sensing values, which are based on data stored in adjacent memory cells, at the first latches and respectively latches second sensing values, which are based on data stored in selected memory cells, at the second latches at least two times.

A non-volatile memory device includes a memory cell array including memory cells respectively connected to bit lines; and a control logic unit configured to control a program operation with respect to the memory cells. The control logic unit is configured to perform a normal program verify operation with respect to the memory cells by using a normal program verify condition, during the program operation, and, based on a suspend command that is received during the program operation, perform an initial program verify operation with respect to the memory cells by using an initial program verify condition that is different from the normal program verify condition.

A memory device according to the present technology includes a memory cell array configured to include planes having a plurality of memory cells, a page buffer connected to at least one memory cell among the memory cells through a bit line and configured to perform a sensing operation of reading data stored in the at least one memory cell connected to the bit line, a common reference voltage generator configured to generate a common reference voltage, a plurality of merged buffers configured to generate a reference signal using the common reference voltage, and control logic configured to control an operation of the common reference voltage generator and the merged buffers so that page buffer control signals generated based on the reference signal are supplied to the page buffer.

According to one embodiment, a memory system includes a semiconductor memory and a controller. The semiconductor memory includes first blocks including a memory cell capable of storing data of one bit, a second block including a memory cell capable of storing data of two or more bits. The semiconductor memory stores first data in a first latch circuit, and second data in a second latch circuit, and writes the first data into one of the first blocks in page units, and the second data into one of the first blocks in page units. The semiconductor memory writes data of at least two pages into the second block, using the first data stored in the first latch circuit and the second data stored in the second latch circuit.

According to one embodiment, a memory device, includes a first memory cell, and a second memory cell adjacent to the first memory cell; and a sequencer configured to, when data is read from the first memory cell: perform a first read operation on the second memory cell; perform a second read operation on the first memory cell; perform a third read operation on the first memory cell by applying a voltage different from that applied in the second read operation to a gate of the second memory cell; and generate first data stored in the first memory cell and second data for correcting the first data, based on results of the first to third read operations.