A semiconductor storage device of an embodiment includes a control circuit configured to execute a writing sequence in which a loop including a program operation that writes data to memory cells and a program verify operation that verifies the data written in the memory cells is repeated a plurality of times by increasing a program voltage by a predetermined step-up voltage each time, the control circuit being capable of executing reading verify that verifies the data written in the memory cells in the writing sequence, and the control circuit detects characteristic variation of a characteristic that causes disturbance, and determines whether to perform the reading verify based on a result of the detection.

An electronic device is provided. A memory device controls a signal for setting a voltage level of a bit line. The memory device includes a plurality of memory cells, a peripheral circuit configured to perform a plurality of program loops for programming selected memory cells among the plurality of memory cells, and a sense signal controller configured to determine, during a program operation on a first memory cell among the selected memory cells, a bit line set-up time of a bit line coupled to the first memory cell based on at least one of a state of second memory cells adjacent to the first memory cell and a number of program loops performed on the first memory cell, the first memory cell having a threshold voltage higher than a pre-verify voltage and lower than a main verify voltage.

A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.

An example memory sub-system includes a memory device and a processing device, operatively coupled to the memory device. The processing device is configured to identify a set of embedded servo cells stored on the memory device; determine a read voltage offset by performing read level calibration based on the set of embedded servo cells; and apply the read voltage offset for reading a memory page associated with the set of embedded servo cells.

Provided herein may be a memory device and a method of operating the same. The memory device may include a memory cell array, a plurality of page buffer groups, and a program operation controller. The memory cell array may include a plurality of memory cells. The page buffer groups may be coupled to the plurality of memory cells through a plurality of bit line groups, and may be configured to perform bit line precharge operations on the plurality of bit line groups. The program operation controller may be configured to control the plurality of page buffer groups to perform the bit line precharge operations initiated at different time points during a program operation on the plurality of memory cells, and to adjust an interval between initiation time points of the bit line precharge operations depending on a progress of the program operation.

One or more blocks at the memory device are programed. The one or more blocks are associated with a block family and with one or more dice of a die group. A voltage offset bin associated with the die group and the block family is determined based on a subset of dice of the die group. Metadata associated with the memory device is appended to include a record associating the die group and the block family with the voltage offset bin.

One or more blocks at the memory device are programed. The one or more blocks are associated with a block family and with one or more dice of a die group. A voltage offset bin associated with the die group and the block family is determined based on a subset of dice of the die group. Metadata associated with the memory device is appended to include a record associating the die group and the block family with the voltage offset bin.

A semiconductor storage apparatus programming a memory cell through improved ISPP is introduced. A NAND flash memory programming method includes a step of selecting a page of a memory cell array and applying a programming pulse based on the ISPP to the selected page. The programming pulse applied by the ISPP includes a sacrificial programming pulse for which a program verification becomes unqualified due to an initial programming pulse and a last programming pulse having an increment larger than any increment of other programming pulses.

There are provided a memory system and an operating method thereof. A memory system includes: a plurality of storage regions, each including a plurality of memory cells; and a controller configured to provide a plurality of read retry sets, determine an applying order of the plurality of read retry sets based on characteristics of a read error occurred in a first storage region among the plurality of storage regions, and apply at least one of the read retry sets, based on the applying order, for a read retry operation performed on the first storage region.

A fail detecting method of a memory system including a nonvolatile memory device and a memory controller, the fail detecting method including: counting, by the memory controller, the number of erases of a word line connected to a pass transistor; issuing a first erase command, by the memory controller, when the number of erases reaches a reference value; applying a first voltage, by the nonvolatile memory device, in response to the first erase command, that causes a gate-source potential difference of the pass transistor to have a first value; detecting, by the memory controller, a leakage current in a word line, after the applying of the first voltage; and determining, by the memory controller, the word line as a fail when a leakage voltage caused by the leakage current is greater than a first threshold value.