G01B11/0675

Process-induced displacement characterization during semiconductor production

A controller is configured to perform at least a first characterization process prior to at least one discrete backside film deposition process on a semiconductor wafer; perform at least an additional characterization process following the at least one discrete backside film deposition process; determine at least one of a film force or one or more in-plane displacements for at least one discrete backside film deposited on the semiconductor wafer via the at least one discrete backside film deposition process based on the at least the first characterization process and the at least the additional characterization process; and provide at least one of the film force or the one or more in-plane displacements to at least one process tool via at least one of a feed forward loop or a feedback loop to improve performance of one or more fabrication processes.

Systems and devices for sensing corrosion and deposition for oil and gas applications, and related methods

Sensing systems include a tube defining a Fabry-Perot cavity and an optical fiber including a distal end disposed within the Fabry-Perot cavity and a proximal end. A corrodible material caps the Fabry-Perot cavity. Devices for sensing corrosion of downhole equipment include an optical fiber with a corrodible material disposed over a distal end of the optical fiber. Systems for sensing a condition in equipment include an optical fiber with a fiber Bragg grating proximate a distal end thereof and a mass of sensor material coupled to the distal end of the optical fiber. The mass of sensor material is suspended from above the fiber Bragg grating. Other systems for sensing a condition in a wellbore include an optical fiber and a plurality of fiber Bragg gratings along a length thereof. A plurality of sensor materials are coupled to the optical fiber and surround respective fiber Bragg gratings.

Fountain solution thickness measurement using an optical grating surface in a digital lithography printing system

According to aspects of the embodiments, there is provided a method of measuring the amount of fountain solution employed in a digital offset lithography printing system. Fountain solution thickness is measured using a diffractive optical element (DOE) configured with grating surfaces varying in a periodic fashion to hold an amount of fountain solution. When radiated with a light source the combination of the grating surface and the fountain solution therein reduces the scattering of the surface structure (“contrast”) that gives rise to a diffraction pattern. The diffractive optical element can be placed on the printing blanket of the lithography printing system or on a separate substrate.

OPTICAL PROFILOMETER
20170314914 · 2017-11-02 ·

A system comprising a light source, and a retention device configured to receive and retain a sample for measurement. The system includes a detector. An optical path couples light between the light source, the sample when present, and the detector. An optical objective is configured to couple light from the light source to the sample when present, and couple reflected light to the detector. A controller is configured to automatically control focus and/or beam path of the light directed by the optical objective to the sample when present. The detector is configured to output data representing a film thickness and a surface profile of the sample when present.

Thickness determination of web product by mid-infrared wavelength scanning interferometry

Non-contacting caliper measurements of free-standing sheets detect mid-IR interferometric fringes created by the reflection of light from the top and bottom surfaces of the sheet. The technique includes directing a laser beam at a selected angle of incidence onto a single spot on the exposed outer surface and scanning the laser beam through a selected wavelength range as the laser beam is directed onto the exposed outer surface and measuring the intensity of an interference pattern that forms from the superposition of radiation that is reflected from the exposed outer surface and from the inner surface. Alternatively, the intensity of an interference pattern formed from the superposition of radiation that is directly transmitted through the web and radiation that is transmitted through the web after internal reflections from the internal surfaces of the web. Thickness can be extracted from the fringe separation in the interference pattern.

Detection Device and Detection Method
20170284791 · 2017-10-05 ·

The present invention provides a detection device and a detection method. The detection device comprises a light source module, a receiving module, an image generation module and a judgment module. The light source module is configured to emit light towards a film at a predetermined angle, the receiving module is configured to receive interference light formed by first reflected light reflected by an upper surface of the film and second reflected light reflected by a lower surface of the film, the image generation module is configured to generate an equal thickness interference fringe image according to the interference light, and the judgment module is configured to judge whether thickness of the film is uniform according to the equal thickness interference fringe image. The detection device can perform high accuracy detection on uniformity of the thickness of a film, thereby facilitating improving display quality of a display panel.

SPECTROSCOPIC MEASURING APPARATUS AND METHOD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE MEASURING METHOD

A spectroscopic measuring apparatus and method are provided. The apparatus includes a first light source, object, microlens, and imaging lenses, an optical fiber, a spectrometer and a position controller. The object lens to allows light from the first light source to be incident on a stage configured to support a measurement object. The microlens is disposed between the object lens and the stage. The imaging lens images light reflected from the measurement object. The optical fiber has an input terminal disposed on a first image plane of the imaging lens. The spectrometer is disposed at an output terminal of the optical fiber. The position controller controls positions of the object lens, the microlens, and the optical fiber, and adjusts the position of the object lens so that a focus of the object lens is positioned at a virtual image position of a virtual image generated by the microlens.

Inline inspection of the contact between conductive traces and substrate for hidden defects using white light interferometer with tilted objective lens

Embodiments include devices, systems and processes for using a white light interferometer (WLI) microscope with a tilted objective lens to perform in-line monitoring of both resist footing defects and conductive trace undercut defects. The defects may be detected at the interface between dry film resist (DFR) footings and conductive trace footing found on insulating layer top surfaces of a packaging substrate. Such footing and undercut defects may other wise be considered “hidden defects”. Using the WLI microscope with a tilted objective lens provides a high-throughput and low cost metrology and tool for non-destructive, non-contact, in-line monitoring.

Method of authenticating a polymer film by thickness measurement with a white light interferometer
09739597 · 2017-08-22 · ·

A method of authenticating a polymer film comprises measuring the thickness of a layer therein by white light interferometry and/or measuring the birefringence of a layer therein. The method, and devices to carry out the method, may be used in security applications, for example to test for counterfeit bank notes.

Testing apparatus and testing method

Disclosed are a testing apparatus and a testing method. When the testing apparatus is used to test a sample (11) to be tested, a first detection apparatus (21) and a second detection apparatus (22) can be switched by means of an objective lens switching apparatus (20), so as to acquire height information and structure information of the sample (11) to be tested. In the process, the sample (11) to be tested does not need to be transferred between testing apparatuses, thus, not only is pollution potentially created in the process of transferring the sample (11) to be tested avoided, and the probability of the sample (11) to be tested being polluted in the testing process reduced, but also a region to be tested of the sample (11) to be tested does not need to be determined repeatedly, improving the testing speed for the sample (11) to be tested.