An example method that includes receiving, by a computing device, a geometry of the component that includes a plurality of locations on a surface of the component; determining, by the computing device, a respective target thickness of the coating for each respective location of the plurality of locations based on a target coated component geometry and the geometry of the component; and determining, by the computing device, a number of passes or velocity of a coating device for each respective position of a plurality of positions to achieve the respective target thickness for each respective location.

A thickness measuring apparatus that measures a thickness of a workpiece held by a chuck table. The thickness measuring apparatus includes plural image sensors that detect intensity of light spectrally split on each wavelength basis by plural diffraction gratings and generate a spectral interference waveform and a thickness output unit that outputs thickness information from the spectral interference waveform generated by the plural image sensors. The thickness output unit includes a reference waveform recording section in which spectral interference waveforms corresponding to plural thicknesses are recorded as reference waveforms and a thickness deciding section that compares plural spectral interference waveforms generated by the plural image sensors with the reference waveforms recorded in the reference waveform recording section and decides the thickness corresponding to each spectral interference waveform from the reference waveform that corresponds to the spectral interference waveform in the waveform shape.

A substrate inspection system is provided to monitor characteristics of a substrate, while the substrate is disposed within (or being transferred into/out of) a processing unit of a liquid dispense substrate processing system. The inspection system is integrated within a liquid dispense substrate processing system and includes one or more optical sensors of a reflectometer (such as a spectrometer or laser-based transceiver) configured to obtain spectral data from a substrate. A controller is coupled to receive the spectral data from the optical sensors(s). The one or more optical sensors (or one or more optical fibers coupled to the rest of the optical sensor hardware) are coupled at locations within the substrate processing system. The controller analyzes the spectral data received from the optical sensors(s) to detect characteristic(s) of the substrate including, but not limited to, film thickness (FT), refractive index changes, and associated critical dimension (CD) changes.

A target measurement device is provided. The target measurement device includes a fixing ring, a main body, and a transceiver. The fixing ring has a first surface. The main body is over the first surface of the fixing ring. The transceiver is coupled to the main body. The transceiver is at least movable between a center of the fixing ring to an edge of the fixing ring from a top view perspective. A method for measuring a target is also provided.

Techniques include receiving a design of an integrated computational element (ICE) including specification of a substrate and a plurality of layers, their respective target thicknesses and complex refractive indices, complex refractive indices of adjacent layers being different from each other, and a notional ICE fabricated in accordance with the ICE design being related to a characteristic of a sample; forming at least some of the layers of a plurality of ICEs in accordance with the ICE design using a deposition source, where the layers of the ICEs being formed are supported on a support that is periodically moved relative to the deposition source during the forming; monitoring characteristics of the layers of the ICEs during the forming, the monitoring of the characteristics being performed using a timing of the periodic motion of the support relative to the deposition source; and adjusting the forming based on results of the monitoring.

The invention relates to a sensor device for examining the coating of a disc as part of a coating process. The sensor device comprises a first optical sensor system for determining the layer thickness of the coating applied to the disc, and comprises a rotation apparatus. The invention is characterized in that the first optical sensor system is designed to simultaneously identify at least one first position-based measured value and one second position-based measured value, the first and the second position-based measured value describing the distance between the sensor systems and the surface of the disc. As a result of this, the sensor system is configured such that the first position-based measured value of a coated region of the disc and the second position-based measured value of an uncoated region of the disc are identified. Furthermore, the first optical sensor system comprises at least one linear guide, which extends from the central region to the edge. In addition, a control and analysis apparatus is provided for calculating the layer thickness of the disc at the position of the first position-based measured value with the aid of the first and the second position-based measured value. Furthermore, the invention relates to a coating for a disc, comprising inspecting the coating for determining the layer thickness of the coating applied to the disc.

A method for measuring the thickness of coatings on metal substrates comprises illuminating a sample comprising a substrate and a coating with light waves of varying wavelengths from a light source, receiving the light waves reflected by the sample at a light collector, diffracting the light waves into a plurality of component wavelengths with a grating, detecting the light intensities of the plurality of component wavelengths at a detector array, generating a reflectance spectral curve using the detected light intensities for each of the plurality of component wavelengths, calculating the thickness of the coating from the reflectance spectral curves of the component wavelengths.

A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.

Embodiments described herein provide apparatus, software applications, and methods of a coating process, such as an Electron Beam Physical Vapor Deposition (EBPVD) of thermal barrier coatings (TBCs) on objects. The objects may include aerospace components, e.g., turbine vanes and blades, fabricated from nickel and cobalt-based super alloys. The apparatus, software applications, and methods described herein provide at least one of the ability to detect an endpoint of the coating process, i.e., determine when a thickness of a coating satisfies a target value, and the ability for closed-loop control of process parameters.

Embodiments described herein provide apparatus, software applications, and methods of a coating process, such as an Electron Beam Physical Vapor Deposition (EBPVD) of thermal barrier coatings (TBCs) on objects. The objects may include aerospace components, e.g., turbine vanes and blades, fabricated from nickel and cobalt-based super alloys. The apparatus, software applications, and methods described herein provide at least one of the ability to detect an endpoint of the coating process, i.e., determine when a thickness of a coating satisfies a target value, and the ability for closed-loop control of process parameters.