A 3D object sensing system includes an object positioning unit, an object sensing unit, and an evaluation unit. The object positioning unit has a rotatable platform and a platform position sensing unit. The object sensing unit includes two individual sensing systems which each have a sensing area. A positioning unit defines a positional relation of the individual sensing systems to one another. The two individual sensing systems sense object data of object points of the 3D object and provide the object data the evaluation unit. The evaluation unit includes respective evaluation modules for each of the at least two individual sensing systems, an overall evaluation module and a generation module.

Various surface and structural defects are currently inspected visually. This method is labor intensive, requiring large maintenance man hours, and is prone to errors. To streamline this process, herein is described an automated inspection system and apparatus based on several optical technologies that drastically reduces inspection time, provides accurate detection of defects, and provides a digital map of the location of defects. The technology uses a sensor that includes a pattern projection generator for generating a pattern image on the structural surface and a camera for detecting the pattern image generated by the pattern projection generator on the structural surface. Furthermore, the technology utilizes an image processing and correction apparatus for performing a pattern image and structural surface defect map correction and generate a distortion corrected defect map for a surface scan area on the structure that is incident on the sensor.

Embodiments of the present invention may be used to perform measurement of surfaces, such as external and internal surfaces of the human body, in full-field and in 3-D. Embodiments of the present invention may include an electromagnetic radiation source, which may be configured to project electromagnetic radiation onto a surface. The electromagnetic radiation source may be configured to project the electromagnetic radiation in a pattern corresponding to a spatial signal modulation algorithm. The electromagnetic radiation source may also be configured to project the electromagnetic radiation at a frequency suitable for transmission through the media in which the radiation is projected. An image sensor may be configured to capture image data representing the projected pattern. An image-processing module may be configured to receive the captured image data from the image sensor and to calculate a full-field, 3-D representation of the surface using the captured image data and the spatial signal modulation algorithm. A display device may be configured to display the full-field, 3-D representation of the surface.

A bump inspection device images a wafer that includes a plurality of bumps arranged in parallel to each other. Each of the bumps is elongated along a first direction that is along a substrate surface. The bump inspection device includes: a laser-light source that emits laser light in a direction that is inclined relative to the substrate surface; a camera that images the substrate surface onto which the laser light is emitted; and a direction adjusting portion that adjusts an arrangement relation between the direction in which the laser light is emitted and an orientation of the wafer to allow the first direction to become inclined relative to the direction in which the laser light is emitted, in a plan view. The camera images the wafer while the first direction is inclined relative to the direction in which the laser light is emitted, in a plan view.

A positioning device combining mark point positioning and intelligent reverse positioning and method thereof, comprising a binocular camera, a third camera, and a laser; the laser is used for emitting laser projection, the binocular camera is used for acquiring images with laser lines and reflective mark points on the surface of the scanned object, and the third camera is used for acquiring images with coding points and mark points in the peripheral environment; the method comprises the following steps of: S1. calibrating parameters of each camera under different scanning modes, and enabling the parameters of each camera to synchronously and correspondingly transform when the scanning modes are switched; S2. judging and switching the scanning mode into a mark point mode or an intelligent reverse tracking mode through the scanning scene. The two positioning modes are flexibly switched, and the use of a user is facilitated.

A three-dimensional shape measuring apparatus includes a stage that includes a translation stage part having a placement surface on which a measurement object is placed and capable of translating the placement surface; an illuminator that includes independently controllable and two-dimensionally-arranged projection devices, and illuminates the measurement object, which is placed on the stage, with measuring light having a predetermined projection pattern having alternating light-and-dark intervals; a photoreceptor that receives measuring light reflected by the measurement object illuminated by the illuminator, and to generate a projection pattern image; and a movement controller that controls the translational movement of the translation stage part by a moving pitch smaller than the minimum width of the projection pattern which can be projected on the stage by independently controlling the projection devices of the illuminator.

A processing system (10) and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner (14) by a conveyance device (12). Data from the X-ray scanning is transmitted to control system (18). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system (10) to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.

A method for measuring the deformation of a reflective surface of an object is provided. The measuring device includes a lighting pattern containing spots of light, a camera and an image-analyzing device, the lighting pattern and the camera being arranged so that, in the measurement position, the virtual or real image of the lighting pattern is visible to the detector of the camera via the surface, the image being representative of the deformation of the lit region. The method comprises the following steps: measuring a distance between the images of two spots of light; computing the ratio between this measured distance and a reference distance; computing, from this ratio, the enlargement in a defined direction; computing the deformation of the reflective surface in the defined direction.

A method includes emitting a laser including a plurality of laser points onto a surface of a conveyor belt, capturing a plurality of first images of the surface of the conveyor belt during a first cycle of the conveyor belt, creating a first three-dimensional image of the surface of the conveyor belt during the first cycle, each of a plurality of locations of the surface of the conveyor belt in the first three-dimensional image being assigned first position data, capturing a plurality of second images of the surface of the conveyor belt during a second cycle of the conveyor belt; creating a second three-dimensional image of the surface during the second cycle, each of the plurality of locations of the surface in the second three-dimensional image being assigned second position data; and determining whether a difference between the first and second position data exceeds a predetermined threshold.

The present disclosure provides a scanning control method and apparatus, a system, a storage medium, and a processor. The control method includes: controlling a scanner to preliminarily scan a to-be-scanned object according to a predetermined path to obtain a scanned model of the to-be-scanned object; determining second predetermined positions of the scanner corresponding to respective first predetermined positions of the to-be-scanned object according to the scanned model; and controlling the scanner to scan, at least at part of the second predetermined positions, the to-be-scanned object at the corresponding first predetermined positions until a three-dimensional model is obtained. According to the control method, scanning positions of the scanner are determined according to the scanned model obtained by preliminary scanning and positions of the to-be-scanned object, and part of the scanning positions are selected for scanning.