A microelectromechanical resonator includes a resonator member suspended over a surface of a substrate by at least one anchor that is connected to the substrate. The resonator member includes outer and inner frames that are concentrically arranged and mechanically coupled by support structures extending therebetween. Related apparatus and gyroscopes are also discussed.

An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.

An extensional mode electrostatic microelectromechanical systems (MEMS) gyroscope is described. The MEMS gyroscope operates in an extensional mode. The MEMS gyroscope comprises a vibrating ring structure that is electrostatically excited in the extensional mode.

A vibrator in a vibrating gyroscope includes a circular annular portion, a rectangular annular portion, and joining portions. The rectangular annular portion is disposed adjacent to an outer side of the circular annular portion. The joining portions join the circular annular portion and the rectangular annular portion. The rectangular annular portion includes linear beam portions. The joining portions join the circular annular portion and the center portions of the beam portions to each other.

A vibrator in a vibrating gyroscope includes a circular annular portion, a rectangular annular portion, and joining portions. The rectangular annular portion is disposed adjacent to an outer side of the circular annular portion. The joining portions join the circular annular portion and the rectangular annular portion. The rectangular annular portion includes linear beam portions. The joining portions join the circular annular portion and the center portions of the beam portions to each other.

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.

A gyroscope package, system and method for use in a downhole tool suitable are provided. The gyroscope package, system and method includes a housing coupleable with a downhole tool, a gyroscope body within the housing, and an inductive-type MEMS gyroscope. The MEMS gyroscope includes a magnetic shield disposed around the inductive-type MEMS gyroscope to magnetically shield the inductive-type MEMS gyroscope.

A gyroscope package, system and method for use in a downhole tool suitable are provided. The gyroscope package, system and method includes a housing coupleable with a downhole tool, a gyroscope body within the housing, and an inductive-type MEMS gyroscope. The MEMS gyroscope includes a magnetic shield disposed around the inductive-type MEMS gyroscope to magnetically shield the inductive-type MEMS gyroscope.

A vibrating structure gyroscope includes a permanent magnet, a structure arranged in a magnetic field of the permanent magnet and arranged to vibrate under stimulation from at least one primary drive electrode and a drive system that includes: one primary drive electrode arranged at least one primary sense electrode arranged to sense motion in the vibrating structure and a drive control loop controlling the primary drive electrode dependent on the primary sense electrode. The structure also includes a compensation unit arranged to receive a signal from the drive system representative of a gain in the drive control loop and arranged to output a scale factor correction based on that signal. As the magnet degrades (e.g. naturally over time as the material ages), the magnetic field weakens. To compensate for this, the primary drive control loop will automatically increase the gain.