A transducer assembly includes a ring wall, a first arm, a second arm, a magnet, and a Hall effect sensor. The ring wall defines a bore. The first and second arms are disposed within the bore and include first and second proximal and distal ends, respectively. The first and second proximal ends are coupled to and extend from first and second interior locations of the ring wall, respectively. The second interior location is spaced from the first interior location. The magnet is disposed within the bore and is fixedly coupled to the first arm. The Hall effect sensor is disposed within the bore and is fixedly coupled to the second arm. The Hall effect sensor is spaced from the magnet and is configured to detect movement of the magnet resulting from compression of the ring wall. Methods are also provided.

A system and a method can use a magnetic field sensor to measure rotation angles of a ferromagnetic object in the form of a screw having screw threads. The magnetic field sensor can use a plurality of correction coefficients to improve an accuracy of the measured rotation angles of the ferromagnetic object. The magnetic field sensor can be disposed to a side of the screw.

A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.

A magnetic field sensor includes a lead frame, a semiconductor die, a conductive coil, a mandrel, and a non-conductive mold material. The lead frame has a first surface, a second opposing surface, at least one slot, and a plurality of leads. The semiconductor die has a first surface in which a magnetic field sensing element is disposed and a second opposing surface attached to the first surface of the lead frame. The conductive coil is secured to the second surface of the lead frame and configured to operate as a back bias magnet to provide a magnetic field used to detect movement of a target. The coil is would around the mandrel and the mandrel is comprised of a ferromagnetic material. The non-conductive mold material encloses the die, the conductive coil, the mandrel, and at least a portion of the lead frame.

Disclosed is a magnetic encoder, a method and system for detecting an absolute electrical angle, and a readable storage medium. The magnetic encoder includes a magnetoresistance sensor, a magnetic field auxiliary coil and a coil current control circuit electrically connected with the magnetic field auxiliary coil, the magnetoresistance sensor being a planar component, the coil current control circuit being configured to supply current to the magnetic field auxiliary coil, to allow the magnetic field auxiliary coil to generate an auxiliary magnetic field, the auxiliary magnetic field influencing the magnetic field component in the first direction and the magnetic field component in the second direction, forming a resultant magnetic field, and the magnetoresistance sensor being configured to detect the resultant magnetic field and the component of the 2-dimension magnetic field generated by the magnet.

A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.

A rotation angle detection device, including: a rotor; a stator including one bias magnetic field generation portion (BMFGP) and magnetic detection elements; and a rotation angle calculation processor calculating a rotation angle of the rotor from detection signals of the detection elements, wherein a surface of the rotor has convex and concave portions (CCPs), which change in “x” (“x”≥1) cycles for a mechanical angle of 360, and a shape of the CCPs make the detection elements possible to obtain a sine wave, and wherein “a” (“a”≥2) detection elements are arranged along a circumferential direction of the stator at equal intervals for one cycle of the CCPs—so as to be opposed to the surface of the rotor, and the BMFGP extends in the circumferential direction for one cycle of the CCPs so as to overlap with the “a” detection elements.

A method for manufacturing a sensor for an automotive vehicle, the sensor includes an integrated circuit and a magnetic element. The method includes the steps of arranging the integrated circuit in a housing of a support zone of a leadframe formed in a metal base plate; the leadframe including branches constituting electrical tracks, electrically connecting the integrated circuit to the branches, placing the magnetic element against the support zone in line with the integrated circuit and at a predetermined fixed distance from the integrated circuit so as to form a space between the magnetic element and the integrated circuit, overmolding the assembly formed by the support zone, the integrated circuit and the magnetic element with a polyepoxide material so as to obtain an internal overmolding, overmolding the internal overmolding with a thermoplastic material so as to obtain the sensor.

Methods and apparatus for an orientation insensitive speed sensor. Magnetic field sensing elements can be located on a circle, for example, to generate first and second channel signals which can be combined to generate an output signal. The location of the magnetic field sensing elements reduces the effects of stray fields. Embodiments can include true power own state processing to determine target position during start up.

A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.