Ultra-low power methods and sensor devices are provided for determining the presence and magnitude of electromagnetic radiation or other signals. The sensor devices and methods provide both qualitative and quantitative analyses and can be deployed in remote locations for continuous monitoring over years without requiring a replacement power supply.

The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

The invention relates to a method for fabricating a thermal detector (1), comprising the following steps: forming a first stack (10), comprising a thermal detector (20), a mineral sacrificial layer (15) and a thin encapsulation layer (16) having a lateral vent (17.1); forming a second stack (30), comprising a thin sealing layer (33) and a getter portion (34); eliminating the mineral sacrificial layer (15); assembling by direct bonding the thin sealing layer (33), brought into contact with the thin encapsulation layer (16) and blocking the lateral vent (17.1), the getter portion (34) being located in the lateral vent (17.1).

An interleaved photon detection array for sampling a physical sample including a plurality of photon detectors, which may be arranged in close proximity to each other. Photon detection array includes at least a first photon detector having at least a first signal detection parameter. Interleaved photon detection array includes at least a second photon detector having at least a second signal detection parameter. Signal detection parameters of the first signal detector and the second signal detector may be heterogeneous. Interleaved photon detection array includes a control circuit coupled to the plurality of photon detectors. Control circuit receives signals from the plurality of photon detectors and renders an image of a physical sample. Additional imaging technology such as ultrasound may be combined with photon detection array.

A getter assembly is provided and includes a first canister, an internal can including getter, and a second canister. The internal can is disposable in the first canister to occupy a first position at which the getter is hermetically sealable and second positions at which the getter is exposed to an exterior environment. The second canister is engageable with the first canister to drive movements of the internal can between the first position and the second positions following activation and hermetic sealing of the getter.

An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

A temperature sensor and a disc brake having the temperature sensor are provided. According to an aspect of the present disclosure, the temperature sensor for measuring the temperature of a first surface may include: a housing having a second surface receiving heat from the first surface and a third surface formed on one side of a first inner space formed inside to receive heat from the second surface; a temperature sensing module sensing the temperature of the third surface; and a connector transmitting temperature information sensed by the temperature sensing module to the outside.

Provided is a long-wave infrared (LWIR) sensor including a substrate, a magnetic resistance device on the substrate, and an LWIR absorption layer on the magnetic resistance device, wherein a resistance of the magnetic resistance device changes based on temperature, and wherein the LWIR absorption layer is configured to absorb LWIR rays and generate heat.

An infrared sensor uses an infrared lens with infrared filtering and focusing functions. Thus, an infrared filter can be omitted to reduce the costs and volume. In addition, a getter on the inside of a metal cover of the infrared sensor can be activated when the metal cover is soldered to the substrate of the infrared sensor. Therefore, the packaging process of the infrared sensor can be simplified.

An infrared temperature sensor comprises a thermopile sensor and an infrared reflector, wherein the infrared reflector reflects the infrared ray radiated by a target to a first thermopile sensing element of the thermopile sensor to sense the temperature of the target. By appropriately designing the reflecting surface of the infrared reflector, a horizontal viewing angle of a sensing range of the infrared temperature sensor can be larger, while a vertical viewing angle is smaller. The thermopile sensor further comprises a second thermopile sensing element, which can sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by the temperature variation of the package structure, which results from the variation of the environmental temperature. Thus, the measurement accuracy is increased.