This document describes techniques for, and systems that enable, in-ear health monitoring. The techniques described herein enable early detection of health conditions (e.g., contagious disease) through use of an in-ear health-monitoring and audio device. These techniques prompt a user, often through the user's smart phone, to listen to audio content through the device, which also takes the user's temperature. Through repetitive use, the techniques are capable of determining a temperature differential for the user, which aids in early detection of a contagious disease or other malady.

A layered infrared emitter structure includes only semi-transparent metal layers, preferably one semi-transparent metal layer, and one or more dielectric layers on both sides of the semi-transparent metal layer. Further, an electric heating wiring is arranged in or between any of the dielectric layers to heat the semi-transparent metal layer up to a required infrared emission temperature, preferably to a temperature within a range from 400? C. to 1000? C.

A semiconductor device for measuring IR radiation is disclosed. It comprises a substrate and a cap enclosing a cavity, a sensor pixel in the cavity, comprising a first absorber for receiving said IR radiation, a first heater, first temperature measurement means for measuring a first temperature; a reference pixel in the same cavity, comprising a second absorber shielded from said IR radiation, a second heater, and second temperature measurement means for measuring a second temperature; a control circuit for applying a first/second power to the first/second heater such that the first temperature equals the second temperature; and an output circuit for generating an output signal indicative of the IR radiation based on a difference between the first and second power.

An infrared camera includes a lens unit including a lens and a lens barrel, a heater that is provided at the lens unit and heats the lens, an infrared image sensor that captures an image using infrared light focused by the lens, a chassis that is fixed to an external surface side of the lens barrel while being thermally insulated from the lens unit and contains the infrared image sensor, and a light-blocking member that is located between the lens barrel and the infrared image sensor inside the chassis as viewed in a direction of an optical axis of the lens and blocks infrared light radiated toward the infrared image sensor and coming without passing through the lens, thus reducing the influence of infrared light coming without passing through the lens on capturing of an image.

A layered infrared emitter structure includes only semi-transparent metal layers, preferably one semi-transparent metal layer, and one or more dielectric layers on both sides of the semi-transparent metal layer. Further, an electric heating wiring is arranged in or between any of the dielectric layers to heat the semi-transparent metal layer up to a required infrared emission temperature, preferably to a temperature within a range from 400? C. to 1000? C.

A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

Disclosed in the present invention are a camera module and an electronic device. The camera module includes a housing, a temperature sensor, a temperature adjusting device, and an infrared detector, the temperature sensor is configured to sense a first temperature in the interior of the housing, the temperature adjusting device is configured to adjust the first temperature to a target temperature when the first temperature is not equal to the target temperature, the infrared detector is configured to detect infrared rays of an object when the first temperature reaches the target temperature.

Disclosed herein is calibration tool, system, and method for performing multi-sensor calibration. A sensor system calibration tool includes a plurality of geometric objects disposed adjacent to each other, the geometric objects are configured to be perceived in one of two different ways for a first type of sensor and one of two different ways for a second type of sensor.

Disclosed is an integrated circuit (IC) chip incorporating a temperature-sensitive element and temperature stabilization circuitry for ensuring that the temperature of the temperature-sensitive element (TSE) remains essentially constant. The IC chip comprises a temperature-sensitive element and, within at least one region adjacent to the temperature-sensitive element, a first circuit that radiates a first heat amount to the TSE and a second circuit that radiates a second heat amount to the TSE. The second circuit senses changes in a first current amount in the first circuit and, thereby changes in the first heat amount. In response to those changes, the second circuit also automatically adjusts a second current amount in the second circuit and, thereby the second heat amount in order to ensure that the total heat amount radiated by the first circuit and the second circuit, in combination, to the TSE remains constant. Also disclosed is an associated method.

Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. A protective housing may encase an IR sensor, which may include a sensing element or IR element, a circuit or signal processor, and a housing seal plug. The IR element may be thermally bonded with a frame or conductive top hat.