A system includes a sensor housing and a sensor processor external to the sensor housing. The sensor housing includes an infrared detection module and a thermoelectric module proximate to the infrared detection module. The infrared detection module is configured to detect infrared radiation of a scene and generate a measurement associated with the infrared radiation. The thermoelectric module is configured to provide thermal control to the infrared detection module based on a modulated power signal. An accuracy of the measurement is based on the thermal control provided to the infrared detection module. The sensor processor is configured to transmit a power signal to the infrared detection module and transmit a direct current power signal to the thermoelectric module. The direct current power signal is based on the modulated power signal.

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant.

A multi-physical field measurement device for a metal solidification process and a housing and a measurement method thereof are provided. The device includes: a sealed housing provided with a light-through hole; a heater provided inside the housing and located behind the light-through hole along an X-ray; a diffraction detector used for receiving the X-ray which penetrates through a sample sheet and is scattered; a CMOS camera located behind the heater along the X-ray (11) and used for receiving a visible light signal which penetrates through the sample sheet; a silicon drift X-ray detector located at one side of the X-ray and used for receiving a fluorescent signal sent by interaction between the X-ray and the sample sheet; and an infrared thermal imager located at the other side of the X-ray and used for receiving an infrared signal sent by the sample sheet.

An optical sensor circuit of an optical sensor device to be disposed on and to be heated by a heater device is provided. The optical sensor device further includes a printed circuit, a first heat shielding portion, and a heat conduction device. The optical sensor circuit is disposed on a top surface of the printed circuit. The first heat shielding portion has a top surface contacting a bottom surface of the printed circuit. The heat conduction device has a first portion and a second portion, and the first portion of the heat conduction device is disposed between the first heat shielding portion and a top surface of the heater device. The second portion of the heat conduction device surrounds the optical sensor circuit.

Systems and methods for thermal processing of a workpiece at low temperatures are disclosed. In one example implementation, a thermal processing apparatus includes a processing chamber having a workpiece support. The workpiece support can be configured to support a workpiece. The apparatus can include one or more heat sources configured to emit electromagnetic radiation in a first wavelength range to heat the workpiece to a processing temperature. The processing temperature can be in the range of about 50 C. to 150 C. The apparatus can include one or more sensors configured to obtain a measurement of electromagnetic radiation in a second wavelength range when the workpiece is at the processing temperature. The second wavelength range can be different from the first wavelength range.

Disclosed in the present invention are a camera module and an electronic device. The camera module includes a housing, a temperature sensor, a temperature adjusting device, and an infrared detector, the temperature sensor is configured to sense a first temperature in the interior of the housing, the temperature adjusting device is configured to adjust the first temperature to a target temperature when the first temperature is not equal to the target temperature, the infrared detector is configured to detect infrared rays of an object when the first temperature reaches the target temperature.

A system includes a camera configured to detect thermal radiation emitted from a target. The system also includes an optical assembly configured to be disposed between the camera and the target. The system further includes a hot stop assembly disposed between the camera and the optical assembly. The hot stop assembly includes a hot aperture having a first surface configured to face the target and a second surface configured to face an interior portion of the hot stop assembly. The hot stop assembly also includes a cold aperture having a first surface configured to face the camera and a second surface configured to face the interior portion of the hot stop assembly. The hot aperture is thermally isolated from the cold aperture and reduces transient temperature changes from the environment on the images.

An extended area cavity type blackbody for use as a radiometric reference for imaging systems may have a well in the form of a cube having four sidewalls and a back wall, and open at the front. The temperature of the back wall may be controlled independently of the temperature(s) of the sidewalls. This system may produce infrared radiance closer to an ideal radiator than typical extended area sources. A simple blackbody is disclosed, having a source plate with a front emitting surface; a ledge element disposed in front of and below the source plate for heating air in front of the source plate; and (optionally) another ledge element disposed in front of and above the source plate for cooling air in front of the source plate. A housing may support the source plate and ledge element, and a vent may be provided in front of and above the source plate. A resistive heater may be associated with the ledge element; and (optionally) TECs may be associated with the other (cooling) ledge element. Angles of the ledges may be adjustable to optimize the best uniformity for a particular implementation. Temperature control of the ledges may be in unison with or independent from the source plate.

An element array circuit includes a row line, a column line, a thermistor element connected to the row and column lines, power supplies connected to the row line, and control units connected to the row and column lines. A control unit maintains the thermistor element at a temperature within a specified range, acquires a base output value output via the column line, acquires a measured output value output via the column line, and obtains a difference between the measured output value and the base output value.