Patent classifications
G01J5/0821
Thermal Radiation Detection Device and System, as Well as Electronic Device Comprising Such a Device or System
A thermal radiation detection device (1), said device comprising a sensor array (2) comprising a plurality of sensor elements (3) and an optical waveguide (4) having a radiation input end (5) and a radiation output end (6). The radiation input end (5) is configured to receive thermal5 radiation, and the radiation output end (6) is operatively connected to the sensor array (2). The optical waveguide (4) is configured to transmit the received thermal radiation as a plurality of simultaneous thermal radiation signals. By decoupling the sensor array from the radiation input end, the relatively large sensor array can be placed in a position optimal for electronic functionality and optimal in view of mechanical constraints, independent of the radiation input position.
Apparatus for distance and location of a stress attack on an entity
A system that provides detection, annunciation, mitigation, and alleviation of stress attacks by executing algorithms based on measurement of intensity of light. The system determines to execute algorithms to take programmed action based on potential effects of a detected stress attack. The system can be used, for example, to determine the position of potential attacks to conduits that transport electricity, oil, gas, foodstuffs, water, people, and materials.
METHOD FOR OPTICALLY DETERMINING THE TEMPERATURE OF A MOLTEN METAL, AND REELING DEVICE FOR CARRYING OUT SAID METHOD
A method for optically determining the temperature of a molten metal with a measuring device, including calibrating a replacement measuring chain by a measuring chain as a system-internal measuring standard. The measuring device includes an optical waveguide, to guide electromagnetic radiation emitted from the metal or from the tip of the optical waveguide to an optical detector, at least one replacement optical waveguide, an optical detector for determining the temperature of the metal from an analysis of the electromagnetic radiation, a measuring chain, in which the optical waveguide is the measurement recorder, and at least one replacement measuring chain, in which a replacement optical waveguide is the measurement recorder. A reeling device includes a conveying device for successive reeling of the optical waveguide from a stock and of the replacement optical waveguide from a replacement stock, a receiving device for a stock and at least one replacement stock.
Method and apparatus for measuring the temperature of a molten metal
A method, device and apparatus are provided for measuring the temperature of a melt, particularly of a molten metal, with an optical fiber, fed into the melt through a disposable guiding tube. The optical fiber and an immersion end of the tube are immersed into the melt and have feeding speeds which are independent from each other. An elastic plug is arranged within the tube or at an end of the tube opposite the immersion end. The optical fiber is fed through the elastic plug, and the elastic plug reduces a gap between the optical fiber and the tube, which has a larger inner diameter than the outer diameter of the optical fiber. The apparatus includes a fiber coil and a feeding mechanism for feeding the optical fiber and the tube, including at least two independent feeding motors, one for feeding the optical fiber and one for feeding the tube.
Apparatus and method for measuring the surface temperature of a substrate
An apparatus for measuring surface temperature of a substrate being illuminated by a pulsed light beam configured to heat the substrate and by a beam of probing light, wherein the heated substrate emits a radiated beam of thermal radiation, wherein the apparatus includes an optical system configured to collect the radiated beam and a reflected beam of probing light propagating in substantially close directions, wherein the collected radiated beam and the collected reflected beam are separately routed to a respective detector via a respective routing element, the respective detectors being configured to measure the intensity of the collected radiated beam and collected reflected beam simultaneously and at the same wavelength, wherein the surface temperature is calculated based on the collected radiated beam and on the collected reflected beam.
Apparatus and method for measuring the surface temperature of a substrate
An apparatus for measuring surface temperature of a substrate being illuminated by a pulsed light beam configured to heat the substrate and by a beam of probing light, wherein the heated substrate emits a radiated beam of thermal radiation, wherein the apparatus includes an optical system configured to collect the radiated beam and a reflected beam of probing light propagating in substantially close directions, wherein the collected radiated beam and the collected reflected beam are separately routed to a respective detector via a respective routing element, the respective detectors being configured to measure the intensity of the collected radiated beam and collected reflected beam simultaneously and at the same wavelength, wherein the surface temperature is calculated based on the collected radiated beam and on the collected reflected beam.
Device and Method for Measuring a Temperature of a Molten Metal
A device for measuring a temperature of a molten metal bath, comprising: an optical cored wire; a tube, wherein the optical cored wire is at least partly arranged in the tube, wherein the tube has an outer diameter in the range of 4 mm to 8 mm, and a wall-thickness in the range of 0.2 mm to 0.5 mm; and a plurality of separating elements comprising more than two separating elements arranged in the tube spaced apart from each other, and forming at least one compartment between two of the more than two separating elements.
The invention also relates to a system and method for measuring a temperature of a molten metal bath.
Systems and methods for bond-selective transient phase imaging
A method includes directing a first plurality of probe laser pulses through a sample, dividing each of the first plurality of probe laser pulses to generate a first interferogram, and generating first image data reproducible as a first phase image of the sample. A plurality of pump laser bursts are directed onto the sample to heat the sample. A second plurality of probe laser pulses are directed through the sample at a predetermined time delay. Each of the second plurality of probe laser pulses are divided to generate a second interferogram. Second image data is generated that is reproducible as a second phase image of the sample. A transient phase shift is determined in the second phase image relative to the first phase image. A vibrational spectroscopy property is determined of the sample based on the transient phase shift, thereby allowing an identification of chemical bond information of within the sample.
Microbolometer apparatus, methods, and applications
A polarization and color sensitive pixel device and a focal plane array made therefrom. Each incorporates a thick color/polarization filter stack and microlens array for visible (0.4-0.75 micron), near infrared (0.75-3 micron), mid infrared (3-8 micron) and long wave infrared (8-15 micron) imaging. A thick pixel filter has a thickness of between about one to 10× the operational wavelength, while a thick focal plane array filter is on the order of or larger than the size or up to 10× the pitch of the pixels in the focal plane array. The optical filters can be precisely fabricated on a wafer. A filter array can be mounted directly on top of an image sensor to create a polarization camera. Alternatively, the optical filters can be fabricated directly on the image sensor.
Microbolometer apparatus, methods, and applications
A polarization and color sensitive pixel device and a focal plane array made therefrom. Each incorporates a thick color/polarization filter stack and microlens array for visible (0.4-0.75 micron), near infrared (0.75-3 micron), mid infrared (3-8 micron) and long wave infrared (8-15 micron) imaging. A thick pixel filter has a thickness of between about one to 10× the operational wavelength, while a thick focal plane array filter is on the order of or larger than the size or up to 10× the pitch of the pixels in the focal plane array. The optical filters can be precisely fabricated on a wafer. A filter array can be mounted directly on top of an image sensor to create a polarization camera. Alternatively, the optical filters can be fabricated directly on the image sensor.