An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (T) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.

An infrared thermal sensor for sensing infrared radiation is disclosed. The infrared thermal sensor comprises a substrate and a cap structure together forming a sealed cavity, a membrane arranged in said cavity for receiving infrared radiation (IR) through a window or aperture and a plurality of beams for suspending the membrane. At least one beam has a thermocouple arranged therein or thereon for measuring a temperature difference (T) between the membrane and the substrate, the plurality of beams. Furthermore at least one beam is mechanically supporting the membrane without a thermocouple being present therein or thereon.

Some aspects of the technology described herein are directed to a thermal sensor and corresponding systems and methods for mitigating errors arising from non-radiative heat flow. The thermal sensor system, comprising: a thermal sensor comprising and a housing. The thermal sensor comprising: a thermal detection region of a sensor substrate; a thermal reference region of the sensor substrate; and an array of thermocouples configured to detect a thermal differential between the thermal detection region and the thermal reference region. The housing configured to support the thermal sensor within the housing and beneath a windowed aperture of the housing, wherein the windowed aperture is configured such that radiative energy may transmit through the windowed aperture and be received by the thermal sensor.

Some aspects of the technology described herein are directed to a thermal sensor and corresponding systems and methods for mitigating errors arising from non-radiative heat flow. The thermal sensor system, comprising: a thermal sensor comprising and a housing. The thermal sensor comprising: a thermal detection region of a sensor substrate; a thermal reference region of the sensor substrate; and an array of thermocouples configured to detect a thermal differential between the thermal detection region and the thermal reference region. The housing configured to support the thermal sensor within the housing and beneath a windowed aperture of the housing, wherein the windowed aperture is configured such that radiative energy may transmit through the windowed aperture and be received by the thermal sensor.

An infrared detector based on carbon nanotubes is provided. The infrared detector includes a detecting element, a first electrode and a second electrode. The detecting element includes an absorbing part and a non-absorbing part. A first end is located in the absorbing part. A second end is located in the non-absorbing part. An angle between the absorbing part and the non-absorbing part is less than 90 degrees. A first electrode is electrically connected with the first end. A second electrode is electrically connected with the second end.

An infrared detector based on carbon nanotubes is provided. The infrared detector includes a detecting element, a first electrode and a second electrode. The detecting element includes an absorbing part and a non-absorbing part. A first end is located in the absorbing part. A second end is located in the non-absorbing part. An angle between the absorbing part and the non-absorbing part is less than 90 degrees. A first electrode is electrically connected with the first end. A second electrode is electrically connected with the second end.

An inexpensive thermopile temperature detector is particularly adapted to monitoring of electrical equipment, such as a power bus bar, within an enclosed area such as a cabinet. The detector may have a plastic housing, a thermopile sensor and a plastic Fresnel lens. Each sensor also includes a calibrated element such that, but for calibration, the same sensor may be used for various applications for different target sizes and distance or, more generally, with respect to effective target percentage of field of view.

An inexpensive thermopile temperature detector is particularly adapted to monitoring of electrical equipment, such as a power bus bar, within an enclosed area such as a cabinet. The detector may have a plastic housing, a thermopile sensor and a plastic Fresnel lens. Each sensor also includes a calibrated element such that, but for calibration, the same sensor may be used for various applications for different target sizes and distance or, more generally, with respect to effective target percentage of field of view.

A method of normalizing FPA system gain for varying temperature includes determining an FPA temperature and calculating an FPA system gain as a function of the FPA temperature, system gain for the FPA at a reference temperature, and empirically derived coefficients. The method also includes applying the FPA system gain at the FPA temperature to condition output of the FPA to produce temperature independent image data. An imaging system includes a focal plane array (FPA). A temperature sensor is operatively connected to measure temperature of the FPA. A module is operatively connected to the FPA and temperature sensor to calculate FPA system gain for the FPA as described above, and to apply the FPA system gain to condition output of the FPA to produce temperature independent image data. There need be no temperature control device, such as a thermoelectric cooling device, connected for temperature control of the FPA.

The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.