A thermocouple temperature sensor has a thermocouple with first and second conductors connected at a junction and a resistance temperature device with first and second conductors. The first conductor of the resistance temperature device is connected to the first conductor of the thermocouple. A first external conductor is connected to the second conductor of the thermocouple, wherein the first external conductor is configured as a voltage sense conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A second external conductor is connected to the first conductors of the thermocouple and the resistance temperature device, wherein the second external conductor is configured as a current conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A third external conductor is connected to the second conductor of the resistance temperature device and is configured as a current conductor for the resistance temperature device.

A thermocouple temperature sensor has a thermocouple with first and second conductors connected at a junction and a resistance temperature device with first and second conductors. The first conductor of the resistance temperature device is connected to the first conductor of the thermocouple. A first external conductor is connected to the second conductor of the thermocouple, wherein the first external conductor is configured as a voltage sense conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A second external conductor is connected to the first conductors of the thermocouple and the resistance temperature device, wherein the second external conductor is configured as a current conductor for the resistance temperature device and a voltage sense conductor for the thermocouple. A third external conductor is connected to the second conductor of the resistance temperature device and is configured as a current conductor for the resistance temperature device.

There is provided a temperature measurement apparatus that differentiates temperature-measurement resolutions and temperature-calculation accuracies in accordance with the difference of the temperature-measurement range so as to make it possible to universalize temperature-calculation processing among two or more models having different temperature-measurement ranges. In a temperature measurement apparatus, for respective identifiers indicating models of an A/D conversion circuit, a temperature calculation circuit stores corresponding polynomials whose powers and the coefficients of the powers are different from one another, and calculates a temperature by use of the polynomial having the powers and the coefficients of the powers corresponding to the identifier for the A/D conversion circuit that is actually provided.

There is provided a temperature measurement apparatus that differentiates temperature-measurement resolutions and temperature-calculation accuracies in accordance with the difference of the temperature-measurement range so as to make it possible to universalize temperature-calculation processing among two or more models having different temperature-measurement ranges. In a temperature measurement apparatus, for respective identifiers indicating models of an A/D conversion circuit, a temperature calculation circuit stores corresponding polynomials whose powers and the coefficients of the powers are different from one another, and calculates a temperature by use of the polynomial having the powers and the coefficients of the powers corresponding to the identifier for the A/D conversion circuit that is actually provided.

A method and system for calculating a cold junction temperature comprises an offline phase comprising: determining an applicable algorithm for calculating a cold junction screw temperature, and deploying the applicable algorithm in firmware; and an online phase comprising: providing at least one measured temperature to the applicable algorithm deployed in firmware, calculating a temperature of a cold junction screw according to the applicable algorithm deployed in firmware, and assigning the calculated temperature of the cold junction screw as a cold junction temperature.

A method and system for calculating a cold junction temperature comprises an offline phase comprising: determining an applicable algorithm for calculating a cold junction screw temperature, and deploying the applicable algorithm in firmware; and an online phase comprising: providing at least one measured temperature to the applicable algorithm deployed in firmware, calculating a temperature of a cold junction screw according to the applicable algorithm deployed in firmware, and assigning the calculated temperature of the cold junction screw as a cold junction temperature.

The present invention relates to a process for measuring the temperature of a fusion furnace, in particular for the production of superalloy components with directional (DS)/monocrystalline (SX) grain structure by means of a lost wax precision casting process by means of a temperature probe, said fusion furnace comprising a melting chamber, a thermal chamber in connection with said melting chamber, and an extraction chamber in connection with said thermal chamber, a valve interposed between said two melting and thermal chambers, said probe comprising a thermocouple for high temperatures, a support element for positioning the temperature probe in the melting chamber of the furnace, displacement and measurement means of the position of the thermocouple for displacing and measuring the position of the thermocouple within the thermal chamber of the furnace, control device to actuate and control said displacement and measuring means.

The present invention relates to a process for measuring the temperature of a fusion furnace, in particular for the production of superalloy components with directional (DS)/monocrystalline (SX) grain structure by means of a lost wax precision casting process by means of a temperature probe, said fusion furnace comprising a melting chamber, a thermal chamber in connection with said melting chamber, and an extraction chamber in connection with said thermal chamber, a valve interposed between said two melting and thermal chambers, said probe comprising a thermocouple for high temperatures, a support element for positioning the temperature probe in the melting chamber of the furnace, displacement and measurement means of the position of the thermocouple for displacing and measuring the position of the thermocouple within the thermal chamber of the furnace, control device to actuate and control said displacement and measuring means.

An input module includes a terminal block defining a plurality of terminals. Each terminal includes an opening to receive an external wire. The electrical connector assembly is received by at least one terminal and includes an internal thermocouple and a pivot member. The internal thermocouple has a first leg and a second leg coupled together at a first end of the internal thermocouple and spaced apart to define a jaw connector at a second end. The pivot member is pivotable to couple the external wire to the first end. The input module includes a printed circuit board to be coupled to the electrical connector assembly via the jaw connector. The printed circuit board includes a processing circuit to perform cold junction compensation based on a temperature of the printed circuit board and a temperature or a voltage of the internal thermocouple.

An input module includes a terminal block defining a plurality of terminals. Each terminal includes an opening to receive an external wire. The electrical connector assembly is received by at least one terminal and includes an internal thermocouple and a pivot member. The internal thermocouple has a first leg and a second leg coupled together at a first end of the internal thermocouple and spaced apart to define a jaw connector at a second end. The pivot member is pivotable to couple the external wire to the first end. The input module includes a printed circuit board to be coupled to the electrical connector assembly via the jaw connector. The printed circuit board includes a processing circuit to perform cold junction compensation based on a temperature of the printed circuit board and a temperature or a voltage of the internal thermocouple.