A strain gauge assembly includes: a strain gauge comprising a plurality of resistive elements connected as a Wheatstone bridge or half Wheatstone bridge; an excitation signal generator arranged to provide an excitation signal to two resistive elements of the strain gauge; phase shifting circuitry arranged to determine phase shifts in the excitation signal responsive to changes in resistance of the two resistive elements and an end stage configured to output a measure indicative of the phase shift as an indication of strain on the assembly.

A device of force sensing, which includes a rigid structure and force sensors. The rigid structure includes rigid blocks spaced apart, and a strain amplification area is formed between two adjacent rigid blocks, every two force sensors in four force sensors are used as a group, and two groups of the force sensors are selectively arranged corresponding to two of the mounting surfaces of the strain amplification area, the four force sensors are connected to form different bridge circuits.

Apparatus and associated methods relate to sensing a physical parameter and verifying correct operation of a system used to sense the physical parameter. A sensing device includes four resistive elements configured in a Wheatstone bridge configuration is configured to sense the physical parameter. A biasing network selectively provides first and second biasing conditions to the sensing device. First and second output electrical signals are generated by the sensing device in response to the first and second biasing conditions, respectively, selectively provided to the sensing device. The first and second output electrical signals are each indicative of the parameter value of the physical parameter, but not necessarily equal to one another. A verification module verifies correct operation of the system based on a consistency determination of first and second output electrical signals.

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

A functional component capable of stably detecting information indicative of a usage state of a tire, including an electronic component capable of acquiring information on a tire is housed and which is attachable to an inner circumferential surface of the tire; a housing having a housing part in which the electronic component is housed and a bottom surface to be opposed to the inner circumferential surface of the tire; a strain detection means provided on the bottom surface and configured to detect strain of the tire; a support part extending from the bottom surface toward the inner circumferential surface of the tire and more protruding than a surface of the strain detection means; and an elastic part made of an elastomer having a rigidity smaller than that of a material forming the support part and interposed between the bottom surface and the inner circumferential surface of the tire.

A pressure sensing device is provided. In the pressure sensing device, the rigid structure includes rigid blocks arranged at intervals, and strain amplification zones are formed between every two adjacent rigid blocks. The force sensors include first sensors and second sensors. The first sensors are arranged on the two installation surfaces of the strain amplification zones and capable of following the deformation of the measured object, the second sensors are arranged on the two installation surfaces of the rigid blocks and located close to corresponding first sensors. At least four force sensors are connected to form a bridge circuit, and the bridge circuit is electrically connected to a signal processing circuit, so as to detect deformation of the rigid structure and obtain a force acted on the measured object. An output signal of each of the second sensors serves as a temperature compensation signal of the corresponding first sensors.

The present invention discloses a six-dimensional force sensor with high sensitivity and low inter-dimensional coupling, including a clockwise or counterclockwise swastika-shaped beam, vertical beams, a rectangular outer frame, and strain gauges; the clockwise or counterclockwise swastika-shaped beam includes a cross-shaped transverse beam and four rectangular transverse beams; a center of the cross-shaped transverse beam is provided with several force application holes used for applying forces and moments; four tail ends of the cross-shaped transverse beam are each connected to one of the rectangular transverse beams to form a clockwise or counterclockwise swastika-shaped structure; a top end of a vertical beam is connected to a tail end of a corresponding rectangular transverse beam, and bottom ends of the vertical beams are connected to the rectangular outer frame; and there are a plurality of strain gauges to form six groups of Wheatstone bridges that are respectively used for measuring an X-direction force, a Y-direction force, a Z-direction force, an X-direction moment, a Y-direction moment, and a Z-direction moment. Strain gauges for measuring the forces are all pasted on the cross-shaped transverse beam, strain gauges for measuring the X-direction moment and the Y-direction moment are all pasted on the four rectangular transverse beams, and strain gauges for measuring the Z-direction moment are all pasted on the four vertical beams. According to the present invention, the structure is simple, and inter-dimensional coupling is low while high sensitivity is ensured.

A method for fabricating a strain sensing film, a strain sensing film, and a pressure sensor are provided in the present application. A semiconductor wafer is firstly thinned to form a semiconductor film. A die attach film is attached onto the semiconductor film. A resulting semiconductor film is diced to form a plurality of independent strain films. The plurality of independent strain films are transferred to a substrate, and the plurality of independent strain films are completely attached to the substrate. A metal pad of each of the plurality of independent strain films is electrically connected with a corresponding metal pad of the substrate. The plurality of independent strain films are packaged. In this way, the package process of the strain sensing film is completed, which tackles the problem that the existing COB packaging has defects when being applied to package the sensor film.

An information output device that can output the position of a load applied to the pedal is provided. A strain gauge is provided on the inner face of a crank of a bicycle and detects strain occurring in the crank. A cycle computer display unit displays an image showing the center position of the load applied to the pedal connected to the crank based on the tangential force and the torsional torque calculated based on the output values of the first strain gauge to the sixth strain gauge.

The present invention refers to a bottom bracket load sensor designed to measure the deformation of the end bearings of the bottom bracket as a result of the pedalling force. This sensor requires a special, customized design with deformation sensors arranged to measure the effective force ignoring parasitic forces. It is very important to have a true measurement, among other cases, for the optimization of the performance of electric motors on bicycles.