An optically transparent force sensor element compares a force reading from a first strain-sensitive film element with a second strain-sensitive film element, having a compliant and thermally conductive intermediate layer positioned therebetween to compensate for temperature changes. While in the idle state, the optically transparent force sensor can be periodically calibrated to account for additional changes in temperature.

A method includes identifying a plurality of measured strain gauge values of interest from a plurality of measured strain gauge values. The plurality of measured strain gauge values of interest corresponds to a plurality of temperature values of interest. The method further includes comparing the plurality of measured strain gauge values of interest to a plurality of expected strain gauge values of interest to determine a plurality of strain gauge correction values. The plurality of strain gauge correction values corresponds to the plurality of temperature values of interest. The method further includes correlating the plurality of strain gauge correction values to the plurality of temperature values of interest to determine a correction value-temperature relationship. The method also includes determining a corrected real-time strain gauge value by applying the correction value-temperature relationship to a real-time strain gauge value and a corresponding real-time temperature.

MEMS force sensors for providing temperature coefficient of offset (TCO) compensation are described herein. An example MEMS force sensor can include a TCO compensation layer to minimize the TCO of the force sensor. The bottom side of the force sensor can be electrically and mechanically mounted on a package substrate while the TCO compensation layer is disposed on the top side of the sensor. It is shown the TCO can be reduced to zero with the appropriate combination of Young’s modulus, thickness, and/or thermal coefficient of expansion (TCE) of the TCO compensation layer.

A pressure sensor and an electronic device are disclosed. The pressure sensor includes a flexible printed circuit board (110) and multiple pressure sensitive adhesive resistors. The multiple pressure sensitive adhesive resistors include pressure sensitive adhesive resistors R1, R2, R3, R4, R5, and R6. The flexible printed circuit board (110) includes a first surface (A) and a second surface (B) that are opposite each other. The pressure sensitive adhesive resistors R1, R3, and R5 are disposed on the first surface (A), and the pressure sensitive adhesive resistors R2, R4, and R6 are disposed on the second surface (B). The flexible printed circuit board (110) is provided with a through hole (C) that allows the first surface (A) to communicate with the second surface (B), and the through hole (C) is at least partially covered by the pressure sensitive adhesive resistors R1, R2, R3, and R4.

A strain gauge includes a substrate formed of resin and having flexibility and a functional layer formed of a metal, an alloy, or a metal compound, directly on one surface of the substrate. The strain gauge includes a resistor formed as a film that contains Cr, CrN, and Cr.sub.2N and into which an element contained in the functional layer is diffused. The resistor is provided on one surface of the functional layer. A first substance having a function of controlling growth of crystal grains as a main component of the resistor, is added to the resistor.

A force sensor is disclosed. The force sensor includes a force-sensitive structure that compensates for temperature and other environmental changes through the use of a strain-sensitive element and one or more reference elements. An array of such force-sensitive structures forms a force-sensing layer.

Apparatus and associated methods relate to sensing a physical parameter and verifying correct operation of a system used to sense the physical parameter. A sensing device includes four resistive elements configured in a Wheatstone bridge configuration is configured to sense the physical parameter. A biasing network selectively provides first and second biasing conditions to the sensing device. First and second output electrical signals are generated by the sensing device in response to the first and second biasing conditions, respectively, selectively provided to the sensing device. The first and second output electrical signals are each indicative of the parameter value of the physical parameter, but not necessarily equal to one another. A verification module verifies correct operation of the system based on a consistency determination of first and second output electrical signals.

An electrical circuit includes an SG full bridge circuit, a first resistor series connection connected between the terminals of an energy supply gate of the SG full bridge circuit and having a first tap between two resistors, and a second resistor series connection connected between the terminals of a signal gate of the SG full bridge circuit and having a second tap between two resistors.

A resistance adjustment circuit has a plurality of conductive patterns placed in parallel to one another on a flat surface formed from an insulating body so as to extend in a first direction, and also has a resistive element that spans two conductive patterns and is electrically connected to the conductive patterns at superimposing parts superimposed on the conductive patterns. A plurality of resistive elements are provided so as to be spaced in the first direction and are connected in parallel to one another across the two conductive patterns. Part of the conductive patterns can be selectively cut between the superimposing parts of resistive elements disposed adjacently. The combined resistance of the resistance adjustment circuit can be adjusted by reducing parallel connections of resistive elements or combining parallel connections of resistive elements with their series connections.

Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.