A pressure sensing assembly, a pressure sensing method, and a device having the pressure sensing assembly are disclosed. The detection circuit and the signal generating circuit are connected to a signal processing circuit, the detection circuit includes a first bridge circuit constituted by connecting at least four force sensors R1, R2, R3 and R4. During use, the rigid structure is attached on an object to be detected which is deformed under action of an acting force, the detection circuit and the signal generating circuit are cooperated so as to generate different output signals that pass through the signal processing circuit, so that a direction and a magnitude of the acting force is recognized. The pressure sensing assembly has an integrated structure, is prone to be assembled, has a simple circuit configuration, and is low in cost.

An integrated circuit comprises a semiconductor substrate having a surface. A lateral resistor is arranged in a first plane parallel to the surface of the substrate. A vertical reference resistor comprises a layer arranged in a second plane parallel to the surface of the substrate and deeper than the first plane. This layer is doped to promote current flow in the second plane. The vertical reference resistor further comprises a first trench and a second trench coupled between the layer and the surface of the substrate. The first and second trenches are arranged in a vertical direction orthogonal to the first and the second planes and are doped to impede current flow in the vertical direction. A cross-section of the first and second trenches is two-fold rotationally symmetric around the vertical direction, and the lateral resistor and the first and second trenches have the same temperature coefficient.

A controller configured for monitoring disturbances of a pressure sensor assembly includes at least two sensors. The at least two sensors are configured for measuring a pressure and wherein the at least two sensors have a sensor dependent measurement sensitivity for the pressure, and at least one of the sensors is sensitive for a disturbance with a sensor dependent disturbance sensitivity. A ratio of the measurement sensitivity and the disturbance sensitivity is different for the at least two sensors. The controller is configured for detecting the disturbance by comparing outputs of the at least two sensors.

The load cell for measuring a force in both push and pull includes a body assembly having a body element defining a measurement chamber with a closed end and an opposite open end, a protruding member positioned within the measurement chamber and extending from the closed end toward the open end. The load cell also includes a base assembly secured at the open end of the body element, including a base element; and a sense die attached to the base element and aligned with the protruding member, where a top surface of the sense die supports a Wheatstone bridge circuit configured to generate a signal based on a force exerted by the protruding member on the sense die. The body element, the protruding member and the base element are integrally formed from a common material which has a CTE close to the CTE of the sense die.

The present invention features a stretchable strain sensor for detecting minute amounts of strain or pressure. The stretchable strain sensor may comprise a first soft polymer layer, a wrinkled conductive layer disposed on the first soft polymer layer, and a second soft polymer layer disposed on the wrinkled conductive layer. Strain applied to the sensor may cause the wrinkled conductive layer to stretch and crack and send a signal based on resistance. Pressure applied to the sensor may cause the wrinkled conductive layer to deform and crack and send a signal based on resistance. The stretchable strain sensor may be capable of measuring contractions of a tissue, detecting fluid flowing through a microfluidic channel, and detecting whether a microfluidic valve is closed or not.

The sensor assembly comprises a sensor die comprising first and second members. The first member accommodates an actuation element on a second surface of the first member and in contact with a diaphragm that is integral with the first member. The second member is bonded to a first surface of the first member opposite the second surface, and sensing elements are positioned adjacent the diaphragm along the first surface and interposed between the first and second members. The second member also includes a recessed section that forms a cavity adjacent the diaphragm to accommodate and/or limit diaphragm deflection. An internal electrical connection is made between first and second member electrical contacts disposed along the interface between the first and second members to avoid external wires. The second member further includes external electrical terminals to facilitate an electrical surface connection with the sensor assembly without the need for external wires.

A control device to control a motor vehicle function, includes a touch screen element having an external surface equipped with one or more control zones assigned to a specific function of the vehicle, the touch screen element supporting one or more elementary sensors positioned in line with one of the control zones. The elementary sensor(s) being capable of generating at least one signal in response to an action performed by the user on at least one of the control zones, - at least one actuator configured to provide a user with haptic feedback through a translational movement of the touch screen element, and in just-one direction of travel, - a control unit configured to receive the signal generated by the elementary sensor(s) and to control the actuator in response to the signal, wherein the control device has components to keep the touch screen element aligned in the vibration plane.

The load cell for measuring a force in both push and pull includes a body assembly having a body element defining a measurement chamber with a closed end and an opposite open end, a protruding member positioned within the measurement chamber and extending from the closed end toward the open end. The load cell also includes a base assembly secured at the open end of the body element, including a base element; and a sense die attached to the base element and aligned with the protruding member, where a top surface of the sense die supports a Wheatstone bridge circuit configured to generate a signal based on a force exerted by the protruding member on the sense die. The body element, the protruding member and the base element are integrally formed from a common material which has a CTE close to the CTE of the sense die.

Embodiments relate to systems and methods for sensing a force using a sense die. A sense die may comprise a chip comprising a slab; an actuation element configured to contact the slab at or near the center of the slab, and configured to apply a force to the slab; and one or more sense elements supported by the slab, wherein the ratio of the width of the slab to the distance between the one or more sense elements is at least 2/1. A method may comprise providing a sense die comprising a chip having a slab formed thereon; applying a force to the slab of the sense die; and determining the magnitude of the force applied to the slab via one or more sense elements attached to the slab, wherein the ratio of the width of the slab to the distance between the sense elements is greater than 2/1.

The present application relates to a pressure sensing device and a pressure sensing apparatus. The pressure sensing device (20) includes: one or more pressure sensing sheet (10), and a first substrate (22) configured for carrying the pressure sensing sheet (10); the pressure sensing sheet (10) is connected with the first substrate (22) by welding, and welding points are configured for transmitting a deformation and transmitting an electrical signal, and the pressure sensing sheet includes at least one semiconductor film (12), and a signal measurement circuit is integrated in the at least one semiconductor film (12), and the signal measurement circuit is configured for detecting an amount of the deformation and outputting the electrical signal that is able to be identified. Integrating the signal detection circuit in the semiconductor film (12) is greatly reduce the volume of the structure, which is beneficial to improve the integration degree of the product, and is beneficial to the miniaturization of the product.