A pressing force sensor includes a sensor area, individual electrodes arranged in a matrix in a first direction and a second direction crossing the first direction in the sensor area, a common electrode opposed to the individual electrodes, first spacers arranged between the individual electrodes and the common electrode and overlapping the individual electrodes, and second spacers disposed in the sensor area and formed of a different material from the first spacers. With that arrangement, the dynamic range of the pressing force sensor is increased.

A motor vehicle control case includes an outer shell with several control areas, each of the control areas assigned to a specific function of the vehicle, a printed circuit board supporting elementary sensors to generate an electrical signal in response to an action such as an approach movement, a contact or a pressure exerted by a user by having his fingers on at least one of the control areas. The elementary sensors are connected to an electronic control unit, the electrical signal generated by the elementary sensors being transmitted to the electronic control unit to be analyzed therein and converted into a control of a function of the vehicle. Each elementary sensor includes at least one insulating substrate on which are deposited conductive tracks forming a capacitive sensor and an assembly of conductive or semi-conductive nanoparticles in colloidal suspension in an electrically insulating ligand, the assembly forming a force sensor.

A hybrid strain sensing system and the method of making such a system provides a thin semiconductor film with strain sensors and signal processing circuits integrated deposited thereon. The semiconductor film may be further processed and then mounted onto a substrate to be used for strain, force, or other related measurements. The system combines the high sensitivity of a semiconductor strain gauge with the high level of integration of semiconductor integrated circuits (IC)s. Both are highly desirable features for applications where miniaturization and/or flexibility are important requirements.

Sensors that include carbon nanotubes, and articles that include the sensors. The sensors may include a buckypaper. The sensors may be flexible. Methods of making sensors, which may include printing an electrode on a substrate. The printing of an electrode may be achieved with an inkjet printer.

The present application discloses a strain sensing film, a pressure sensor, and a strain sensing system; the strain sensing film includes a semiconductor film, and by arranging a temperature sensor in the semiconductor film, the sensitivity of the strain sensing film is adjusted according to an effective gauge factor obtained from a calibration test and a correlation table reflecting a correlation between an effective gauge factor and a temperature, a better effective gauge factor compensation is achieved, a high sensitivity of the strain gauge of the semiconductor film can be fully utilized. The strain sensing film can be widely used in application scenarios that need to measure local strain or strain variation, force or force variation, pressure or pressure change, displacement, deformation, bending, or bending deformation.

A pressure-sensitive structure and an electronic device are provided in the present application, in the structure of the pressure-sensitive structure, a first elastic carrier is arranged on a first mounting surface of the substrate, a semiconductor film is arranged on the first elastic carrier. When the substrate is deformed, the first elastic carrier is bent and deformed with a deformation of the substrate, a strain signal is amplified by the substrate, so that the semiconductor film can detect an amount of bending deformation of the substrate, and a signal measurement circuit of the semiconductor film is configured to output a recognizable electric signal. The pressure-sensitive structure is a sensor structure being small in size, being high in precision, and being high in reliability and sensitivity. The pressure-sensitive structure is attached to a panel or a side frame of the electronic device.

Described herein is a ruggedized microelectromechanical (“MEMS”) sensor including both fingerprint and force sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs either piezoresistive or piezoelectric sensing elements for detecting force and also capacitive or ultrasonic sensing elements for detecting fingerprint patterns. Both force and fingerprint sensing elements are electrically connected to integrated circuits on the same chip. The integrated circuits can amplify, digitize, calibrate, store, and/or communicate force values and/or fingerprint patterns through output pads to external circuitry.

Provided is a temperature-pressure complex sensor with an anti-radiation property including a first sensing material which is a porous conductive film, and second sensing materials which are dispersedly disposed on a surface of the first sensing material. The second sensing materials may include a conductive structure having a two-dimensional crystal structure, and nanoparticles having a radiation shielding property which are disposed between crystal layers of the conductive structure.

An array substrate, a test method of a film layer stress, and a display panel are provided. The array substrate includes: a base substrate; a first film layer on the base substrate, the first film layer provided with a first mounting groove; and a first strain sensor arranged in the first mounting groove. The first strain sensor is used to detect a stress of the first film layer.

A flexible sensor includes a substrate having flexibility; and a sensor element provided on the substrate, wherein the sensor element includes a transistor having a gate electrode, a source electrode, and a drain electrode; and a variable resistance portion connected to either of the gate electrode, the source electrode, and the drain electrode, and the variable resistance portion has a resistance value changeable due to a strain, and wherein the variable resistance portion includes an extension portion extending in a direction.