An inspection apparatus includes a projector to irradiate an inspection target with light according to pattern image data associated with the inspection target, and an imaging device to capture an image of the inspection target being irradiated with the light from the projector and output image data of the captured image. The pattern image data specifies a pattern of light irradiation of the inspection target.

A semiconductor wafer imaging system for imaging a semiconductor wafer includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

A semiconductor wafer processing system for processing a semiconductor wafer includes a semiconductor wafer processing station for processing the semiconductor wafer and a semiconductor wafer imaging system that images the semiconductor wafer after the semiconductor wafer processing station processes the semiconductor wafer. The semiconductor wafer imaging system includes shroud panels defining a black box, a camera positioned in the black box for imaging the semiconductor wafer, and an illumination panel for directing diffuse light to the semiconductor wafer. A portion of the diffuse light is reflected off the semiconductor wafer and the camera images the semiconductor wafer by detecting the reflected diffuse light.

A method of detecting defects on a semiconductor wafer includes directing diffuse light to the semiconductor wafer and reflecting the diffuse light off of the semiconductor wafer. The method further includes detecting the diffuse light with a camera to generate an image of the semiconductor wafer and analyzing the image to detect defects on the semiconductor wafer.

A system for cosmetic inspection of a test object is disclosed that includes a movable platform for receiving a test object. The movable platform is capable of positioning the test object within a dome. A plurality of cameras arranged oriented to capture different views of a plurality of surfaces of the test object. A plurality lights arranged are outside the dome, the plurality of lights selectively enabled or disabled according to which of the plurality of surfaces of the test object is to be captured.

Methods of and apparatus for inspecting composite layers of a first material formed on a second material are provided including providing an illumination source, illuminating at least a portion of the composite at the layer, receiving light reflected from the sample, determining a spectral response from the received light, and comparing the received spectral response to an expected spectral response.

Disclosed is a defect inspection device for determining anomaly of an inspection object. The defect inspection device may include: a lighting system which includes a light source for transmitting light onto the inspection object; and a dynamic diffuser located between the light source and the inspection object and capable of controlling a diffusivity of light transmitted onto the inspection object; and one or more processors for controlling the dynamic diffuser based on characteristics of the inspection object.

A defect inspection apparatus includes: an illumination unit configured to illuminate an inspection object region of a sample with light emitted from a light source; a detection unit configured to detect scattered light in a plurality of directions, which is generated from the inspection object region; a photoelectric conversion unit configured to convert the scattered light detected by the detection unit into an electrical signal; and a signal processing unit configured to process the electrical signal converted by the photoelectric conversion unit to detect a defect in the sample. The detection unit includes a lens array configured to divide an image to form a plurality of images on the photoelectric conversion unit. The signal processing unit is configured to synthesize electrical signals corresponding to the plurality of formed images to detect a defect in the sample.

An inspection apparatus for inspecting the appearance of an inspection target object is provided. The inspection apparatus according to one embodiment of the present disclosure includes a support part configured to hold an inspection target object such that a side surface of the inspection target object faces a predetermined direction, a light source configured to irradiate light toward the inspection target object, a diffusion reflector configured to diffusely reflect at least a part of the irradiated light to irradiate the reflected light to the side surface of the inspection target object, and at least one inspection part configured to inspect the inspection target object by receiving the light reflected from the inspection target object and the diffusion reflector.

A light projecting device comprises a flat plate shaped light guide plate and a light source that introduces light into the light guide plate from a side peripheral surface thereof. A plurality of concave parts are formed on one plate surface of the light guide plate, and the light entering the light guide plate reflects off the concave parts while spreading out, and the light is emitted outside from the other plate surface of the light guide plate. Each concave part is formed by a smooth concave curved surface. A tangential angle that is an angle between a tangential line at an opening edge of the concave part and the plate surface is set to be ≥50° and ≤85° in a cross-sectional shape of the concave part cut by a plane that is both perpendicular to the plate surface and passing through the center of the concave part.