A method serves for determining particles (3), in particular bacteria in fluid and operates using an imaging optical device with a light source (1), with an optical sensor (4) with a field of light-sensitive pixels and with a fluid sample, which is to be examined, arranged between the light source (1) and the sensor (4). Characteristics of at least one particle (3), which is detected with regard to imaging, are compared to characteristics of a characteristics collection for determining the detected particle (3). The image acquisition is effected with darkfield technology and a light-sensitive pixel comprises several subpixels which are used for image acquisition.

Provided is a method, system, and apparatus for inspecting a substrate. The method comprises illuminating the substrate with a singular laser beam, the singular laser beam forming an illuminated spot on the substrate and a bright fringe at a surface of the substrate, the bright fringe extending over at least a portion of the illuminated spot, and detecting, by an optical detection system, scattered light from nano-defects present on the substrate within the illuminated spot.

A structure of interest (T) is irradiated with radiation for example in the x-ray or EUV waveband, and scattered radiation is detected by a detector (19, 274, 908, 1012). A processor (PU) calculates a property such as linewidth (CD) or overlay (OV), for example by simulating (S16) interaction of radiation with a structure and comparing (S17) the simulated interaction with the detected radiation. The method is modified (S14a, S15a, S19a) to take account of changes in the structure which are caused by the inspection radiation. These changes may be for example shrinkage of the material, or changes in its optical characteristics. The changes may be caused by inspection radiation in the current observation or in a previous observation.

An inspection apparatus for performing inspection of an object includes an illumination device configured to illuminate the object, an imaging device configured to image the object illuminated by the illumination device, and a processor configured to perform processing for the inspection based on an image obtained by the imaging device. The processor is configured to perform the processing based on a first image obtained by the imaging device under dark field illumination by the illumination device with light having a first wavelength and a second image obtained by the imaging device under dark field illumination by the illumination device with light having a second wavelength different from the first wavelength.

A defects evaluation system and method are provided in the present invention. Based on the principle of the microscopic scattering dark-field imaging, the present invention implements a sub-aperture scanning for the surface of spherical optical components and then obtains surface defects information with image processing. Firstly, the present invention takes full advantage of the characteristic that the surface defects of spherical optical components can generate scattering light when an annular illumination beam irradiates on the surface, to implement the sub-aperture scanning and imaging that covers the entire spherical surface. Then, a series of procedures such as the global correction of sub-apertures, the 3D stitching, the 2D projection and the digital feature extraction are taken to inspect spherical surface defects. Finally, actual size and position information of defects are evaluated quantitatively with the defects calibration data. The present invention achieves the automatic quantitative evaluation for surface defects of spherical optical components, which considerably enhance the efficiency and precision of the inspection, avoiding the influence of subjectivity on the results. Eventually, reliable numerical basis for the use and process of spherical optical components is provided.

A system may include illumination optics to direct an illumination beam to a sample at an off-axis angle, collection optics to collect scattered light from the sample, and a phase mask located at a first pupil plane to provide different phase shifts for light in two or more pupil regions of a collection area to reshape a point spread function of light scattered from one or more particles on a surface of the sample. The system may further include a polarization rotator located at a second pupil plane, where the polarization rotator provides a spatially-varying polarization rotation angle selected to rotate light scattered from the surface of the sample to a selected polarization angle, a polarizer to reject light polarized along the selected polarization angle, and a detector to generate a dark-field image of the sample based on light passed by the polarizer.

A method for reviewing a defect including a light capturing step that illuminates a sample with light under plural optical conditions, while varying only at least one of illumination conditions, sample conditions, or detection conditions, and detects plural lights scattering from the sample; a signal obtaining step that obtains plural signals based on the lights detected; and a processing step that discriminates a defect from noise according to a waveform characteristic quantity, an image characteristic quantity, or a value characteristic quantity created using the signals and derives the coordinates of defect.

The methods herein utilize polarized light for detecting through holes in substrates. A light source directs light through a first polarization filter having a first polarization axis, wherein polarized light travels from the first polarization filter and toward a substrate. The orientation of the polarized light is changed while traveling through substrate material, and is scattered. However, polarized light traveling through a hole in the substrate remains unscattered. A second polarization filter receives unscattered light and scattered light traveling away from the substrate. The second polarization filter includes a second polarization axis angularly offset from and not parallel with the first polarization axis. As such, the second polarization filter blocks the advancement of unscattered light while the scattered light is not blocked by the second polarization filter. The hole is detected based on an absence of unscattered light surrounded by light traveling from the second polarization filter.

An overlay metrology system may include an illumination sub-system to sequentially illuminate an overlay target with a first illumination lobe and a second illumination lobe opposite the first illumination lobe, where the overlay target includes grating-over-grating features formed from periodic structures on a first sample layer and a second sample layer. The system may further include an imaging sub-system to generate a first image and a second image of the overlay target. The first image includes an unresolved image of the grating-over-grating structures formed from a single non-zero diffraction order of the first illumination lobe. The second image includes an unresolved image of the one or more grating-over-grating structures formed from a single non-zero diffraction order of the second illumination lobe. The system may further include a controller to determine an overlay error between the first layer and the second layer based on the first image and the second image.

An aperture stop that includes a non-circular region that comprises at least one opaque region and at least one opening region; wherein each point in the at least one opening region is (a) mapped to an angle of illumination and (b) is associated with a corresponding point in the at least one opaque region that. mapped to an angle of specular reflectance from the angle of illumination mapped to the opening point.