Methods of and apparatus for inspecting composite layers of a first material formed on a second material are provided including providing an illumination source, illuminating at least a portion of the composite at the layer, receiving light reflected from the sample, determining a spectral response from the received light, and comparing the received spectral response to an expected spectral response.

Methods of and apparatus for inspecting composite layers of a first material formed on a second material are provided including providing an illumination source, illuminating at least a portion of the composite at the layer, receiving light reflected from the sample, determining a spectral response from the received light, and comparing the received spectral response to an expected spectral response.

An inspection system for detecting defects in a workpiece can include an illumination source for illuminating a first section of the workpiece with a patterned light, wherein the illumination source does not illuminate a second section of the workpiece. The inspection system further includes a feedback camera for imaging the first section and producing a first output, and a background camera for imaging the second section and producing a second output. A processor compares the first output with the second output, and a controller alters the patterned light that is output by the illumination source based on the comparison. This feedback control continues until the background is suitably homogeneous or camouflaged compared to the defect, such that the visibility and/or detectability of the defect is increased.

An inspection system of an embodiment includes: a planar illumination unit that temporally and spatially varies intensities of light in a periodic manner; a time-correlation image generator that generates a time-correlation image with a time-correlation camera or an image capturing system that performs an operation equivalent to that of the time-correlation camera; and a calculation processor that calculates a characteristic from the time-correlation image, the characteristic corresponding to a distribution of normal vectors to an inspection target surface and serving to detect an abnormality based on at least either a difference from a surrounding area or a difference from a reference surface.

The disclosed technology relates to an inspection apparatus that includes a stage configured to retain a specimen for inspection, an imaging device having a field of view encompassing at least a portion of the stage to view a specimen retained on the stage, and a plurality of lights disposed on a moveable platform. The inspection apparatus can further include a control module coupled to the imaging device, each of the lights and the moveable platform. The control module is configured to perform operations including: receiving image data from the imaging device, where the image data indicates an illumination landscape of light incident on the speciment; and automatically modifying, based on the image data, an elevation of the moveable platform or an intensity of one or more of the lights to adjust the illumination landscape. Methods and machine-readable media are also contemplated.

An inspection apparatus includes an inspection optical system configured to a direct an inspection beam onto a surface of a substrate, the inspection optical system having an objective, a focus measurement optical system configured to receive a focus measurement beam, redirected by the substrate, from the objective, the focus measurement optical system having a movable reflective element configured to receive the focus measurement beam, and a control system configured to cause movement of the reflective element with a direction component along a beam path of the focus measurement beam and configured to determine whether the substrate surface is in the focus of the objective based on the focus measurement beam.

An illumination device for use in an optical sensor of a coordinate measuring machine. The illumination device has first light-emitting diode chips (H11, H21, H31, H41, H51 . . . H161), arranged around a center axis (M) along a virtual outline (A1) of a first geometric figure, second light-emitting diode chips (H12, H22, H32, H42, H52 . . . H162), arranged around the center axis (M) along a virtual outline (A2) of a second geometric figure (A2), and third light-emitting diode chips (H13, H23, H33, H43, H53 . . . H163), arranged around the center axis (M) along a virtual outline (A3) of a third geometric figure. Each of the light-emitting diode chips is connected to a bond wire at a connection point on the light-emitting diode chip. The connection point is located in a peripheral region of the light-emitting diode chip. The light-emitting diode chips are grouped into a plurality of groups (G1, G2, G3, G4 . . . G16).

A component-mounting machine including an LED lighting device configured to illuminate an imaging target that is to be imaged by a camera loaded on the component-mounting machine; and an illumination light amount adjusting device configured to adjust in steps with a specified gradation quantity an illumination light amount of the LED lighting device. The LED lighting device uses two types of LED elements with different brightness levels, and the illumination light amount adjusting device is configured to adjust in steps with a specified gradation quantity a pulse width or a current value of a current flowing through low-brightness LED elements that are the LED elements with a lower brightness level out of the two types of LED elements so as to adjust in steps with a specified gradation quantity an emitted light amount of the low-brightness LED elements while maintaining a specified level of illumination light amount.

A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

An optical detecting device includes an image capturing device and a processor. The processor is coupled to a light source and an image capturing device. The processor is configured to adjust a light intensity of the light source for irradiating a correction object in order that a gray value of at least one image block, captured by the image capturing device, of the correction object matches a target correction value, and record a target light intensity while the target light intensity matches the target correction value; control the light source to irradiate light on a testing object with the target light intensity, and control the image capturing device to capture a testing object image of the testing object; and calculate ratios of a target gray value to the gray value of a plurality of pixels of the testing object image to obtain a mapping table.