Patent classifications
G01N2021/8845
Apparatus and method for recognizing stamped character and system for detecting stamped depth of character using the same
An apparatus and a method recognizes stamped characters, detects stamped depths of characters using the same, and/or accurately recognizes characters even when an image distortion occurs at stamped portion due to different stamped depths of characters.
Device and method for providing sorted stopper elements
The invention relates to a device for providing stopper elements that are sorted in order to feed a downstream workstation. The devices comprising a lifting means; a means or referencing said stopper elements one by one, located downstream from the lifting means; a conveyor for bringing the referenced elements to said workstation, positioned at the outlet of said referencing means; a vision means for verifying the conformance of said elements in an inspection zone extending at the level of the referencing means and/or of the conveyor; and a means for expelling those elements that do not conform located downstream of said vision means. The inspection zone comprises at least two successive sections each including a distinct color. The invention also relates to a corresponding method.
Active real-time characterization system
A system for providing active real-time characterization of an article under test is disclosed. An infrared light source, a first visible light source and a second visible light source each outputs and directs a beam of coherent light at a particular area on the article under test. A visible light camera and a visible light second harmonic generation camera, an infrared camera and an infrared second harmonic generation camera, a sum frequency camera and a third order camera are each configured to receive a respective predetermined return beam of light from the particular area on the article under test. A processor receives signals from the cameras and calculates in real time respective spectroscopic signals and compares each calculated signal with each other calculated signal and with a predetermined baseline signal to ensure that the article under test conforms to an expected value.
DEFECT IDENTIFICATION USING MACHINE LEARNING IN AN ADDITIVE MANUFACTURING SYSTEM
An additive manufacturing system comprises an apparatus arranged to distribute layer of metallic powder across a build plane and a power source arranged to emit a beam of energy at the build plane and fuse the metallic powder into a portion of a part. The system includes a processor configured to steer the beam of energy across the build plane and receive data generated by one or more sensors that detect electromagnetic energy emitted from the build plane when the beam of energy fuses the metallic powder. The received data is converted into one or more parameters that indicate one or more conditions at the build plane while the beam of energy fuses the metallic powder. The one or more parameters are used as input into a machine learning algorithm to detect one or more defects in the fused metallic powder.
System and method for capturing illumination reflected in multiple directions
An optical inspection system in accordance with the disclosure can be configured to simultaneously capture illumination reflected in multiple directions from the surface of a substrate, thereby overcoming inaccurate or incomplete characterization of substrate surface aspects as a result of reflected intensity variations that can arise when illumination is captured only from a single direction. Such a system includes a set of illuminators and an image capture device configured to simultaneously capture at least two beams of illumination that are reflected off the surface. The at least two beams of illumination that are simultaneously captured by the image capture device have different angular separations between their reflected paths of travel. The set of illuminators can include a set of thin line illuminators positioned and configured to supply one or more beams of thin line illumination incident to the surface. For instance, two beams of thin line illumination can be directed to the surface at different angles of incidence to a normal axis of the surface.
METHOD AND DEVICE FOR OPTICALLY INSPECTING CONTAINERS
The disclosure relates to a method for optically inspecting containers, wherein the containers are transported to an inspection unit with an illumination unit and with a camera, wherein the illumination unit emits light from a flat light-emitting surface, wherein the light is transmitted or reflected via the containers, wherein the camera captures a respective at least one of the containers and the light transmitted or reflected via same in at least one camera image, and wherein the at least one camera image is analysed by an image processing unit for intensity information in order to identify foreign bodies and/or defects in the container.
ILLUMINATING UNIT
An illuminating unit for illuminating an imaging range of a monochromatic camera mounted on a board work machine for working on a board includes a red light source configured to emit a red light, a green light source configured to emit a green light, a blue light source configured to emit a blue light, and a lighting controller configured to adjust independently respective light amounts of the red light source, the green light source, and the blue light source in the same number of gradations within a predetermined dimming range. In the red light source, the green light source, and the blue light source, the upper limit of the dimming range of the light source having the strong light amount is smaller than the upper limit of the dimming range of the light source having the weak light amount.
System and method for defect detection and photoluminescence measurement of a sample
Defect detection and photoluminescence measurement of a sample directing a beam of oblique-illumination wavelength light onto a portion of the sample, directing a beam of normal-illumination wavelength light for causing one or more photoluminescing defects of the sample to emit photoluminescent light onto a portion of the sample, collecting defect scattered radiation or photoluminescence radiation from the sample, separating the radiation from the sample into a first portion of radiation in the visible spectrum, a second portion of radiation including the normal-illumination wavelength light, and at least a third portion of radiation including the oblique-illumination wavelength light, measuring one or more characteristics of the first portion, the second portion or the third portion of radiation; detecting one or more photoluminescence defects or one or more scattering defects based on the measured one or more characteristics of the first portion, the second portion or the third portion of radiation.
DETECTING DAMAGE TO A CONVERTER DEVICE
A method for detecting damage to a converter device of a lighting apparatus is provided. The method may include irradiating the converter device with input light, detecting a useful light portion emitted principally by a first section of the converter device by means of a first sensor element. A first detection signal is obtained, detecting a useful light portion emitted principally by a second section of the converter device, said second section being different than the first section, by means of a second sensor element. A second detection signal is obtained. The method further may include automatically obtaining damage information about the converter device from a ratio or a difference of the first detection signal with respect to either the second detection signal or a comparison signal formed therefrom.
SiC substrate evaluation method and method for manufacturing SiC epitaxtal wafer
A SiC epitaxial wafer, including: a SiC substrate; and an epitaxial layer stacked on a first surface of the SiC substrate, wherein an area occupied by bar-shaped stacking faults on the first surface of the SiC substrate is identified, and the area occupied by bar-shaped stacking faults on the first surface of the SiC substrate is equal to or less than ¼ of the first surface area of the SiC substrate.