A detection apparatus improves abnormality detection accuracy after start of an inspection operation while reducing the amount of work that is done before the start of the operation. The apparatus includes an object characteristic storage device that stores a parameter indicating a characteristic of an abnormal object, an object detection unit that detects an abnormal object candidate from image information by using the parameter, an object storage unit that stores the abnormal object candidate, an object display unit that displays the abnormal object candidate stored in the object storage unit, a calibration input unit that receives input of calibration information on the abnormal object candidate, and, based on the calibration information, corrects the abnormal object candidate stored in the object storage unit, and an object characteristic calibration unit that calibrates the parameter stored in the object characteristic storage device, based on the calibration information received by the calibration input unit.

A polarized image acquisition apparatus includes a division type half-wave plate, located opposite to the mask substrate with respect to an objective lens and near an objective lens pupil position, to arrange P and S polarized waves of the transmitted light having passed through the objective lens to be mutually orthogonal, a Rochon prism to separate trajectories of P and S polarized waves, an imaging lens to form images of P and S polarized waves having passed through the Rochon prism at image formation positions different from each other, a mirror, in a case where one of P and S polarized waves is focused/formed at one of the different image formation positions, to reflect the other wave at the other position, a first sensor to capture an image of one of P and S polarized waves, and a second sensor to capture an image of the other wave.

An object of the invention is to provide a defect inspection device capable of correcting image forming position deviation due to displacement of a sample surface in a Z direction while enabling image forming detection from a direction not orthogonal to a longitudinal direction of illumination. The defect inspection device according to the invention is configured to determine on which lens in a lens array scattered light is incident according to a detection elevation angle of the scattered light from a sample, and an image position of the scattered light having a small elevation angle is corrected more than an image position of the scattered light having a large elevation angle.

Self-leveling inspection systems for use in inspecting buried pipes or other cavities are disclosed. A camera head may include an image sensor, an orientation sensing module, and an image processing module configured to adjust an image or video provided from the image sensor, based at least in part on information provided from the orientation sensor, in the camera head.

The purpose of the present invention is to accurately detect structures from a remote location without contact while distinguishing between defects such as cracking, separation, and internal cavities. This status determination device includes: a displacement calculation unit that calculates a two-dimensional spatial distribution of displacement in time-series images, said time-series images being taken before and after a load is applied to a surface of a structure; a correction amount calculation unit that calculates a correction amount from the two-dimensional spatial distribution of displacement in the time-series images, said correction amount being based on the amount of movement of the structure surface in the normal direction as induced by said loading; a displacement correction unit that subtracts the correction amount from the two-dimensional spatial distribution of displacement in the time-series images, and extracts a two-dimensional spatial distribution of displacement of the structure surface; and an abnormality determination unit for identifying defects in the structure on the basis of a comparison of the two-dimensional spatial distribution of displacement of the structure surface and a pre-prepared spatial distribution of displacement.

A wafer scanning system includes imaging collection optics to reduce the effective spot size. Smaller spot size decreases the number of photons scattered by the surface proportionally to the area of the spot. Air scatter is also reduced. TDI is used to produce a wafer image based on a plurality of image signals integrated over the direction of linear motion of the wafer. An illumination system floods the wafer with light, and the task of creating the spot is allocated to the imaging collection optics.

An in-situ system for a gas turbine engine blade inspection including a sensor system configured to capture images of a forward surface of at least one gas turbine engine blade; a processor coupled to the sensor system, the processor configured to determine damage to the at least one gas turbine engine blade based on video analytics; and a tangible, non-transitory memory configured to communicate with the processor, the tangible, non-transitory memory having instructions stored therein that, in response to execution by the processor, cause the processor to perform operations comprising receiving, by the processor, data for the forward surface of at least one gas turbine engine blade from the sensor system; determining, by the processor, a rotational speed of a fan; and determining, by the processor, a fan synchronization.

Self-leveling inspection system methods and devices for use in inspecting buried pipes or other cavities are disclosed. The system includes a camera head with an image sensor, an orientation sensor, and a signal processing module including a processing programmed to receive an image from the image sensor, and an orientation signal from the orientation sensor, generate a second image based at least in part on information provided from the orientation sensor, and store the second image in a non-transitory memory.

A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing collectors for collecting light scattered from the surface, to greatly improve the measurement capabilities of the system. The light channel assembly has a switchable edge exclusion mask and a reflected light detection system for improved detection of the reflected light.

An inspection system (1600), a lithography apparatus, and an inspection method are provided. The inspection system (1600) includes an illumination system (1602), a detection system (1606), and processing circuitry (1622). The illumination system generates a first illumination beam (1610) at a first wavelength and a second illumination beam (1618) at a second wavelength. The first wavelength is different from the second wavelength. The illumination system irradiates an object (1612) simultaneously with the first illumination beam and the second illumination beam. The detection system receives radiation (1620) scattered by a particle (1624) present at a surface (1626) of the object at the first wavelength. The detection system generates a detection signal. The processing circuitry determines a characteristic of the particle based on the detection signal.