The method includes detecting a COP in a surface of a reference wafer with a laser surface inspection apparatus to be calibrated and an apparatus for calibration that obtains an X coordinate position and a Y coordinate position of the COP; determining a COP that is detected as the same COP with a determination criterion that a positional difference between a detected position obtained by the laser surface inspection apparatus to be calibrated and a detected position obtained by the apparatus for calibration on the reference wafer surface is within a threshold range; and calibrating the coordinate position identification accuracy of the laser surface inspection apparatus to be calibrated by adopting the X and Y coordinate positions obtained by the apparatus for calibration as true values of the X and Y coordinate positions.

The method includes detecting a COP in a surface of a reference wafer with a laser surface inspection apparatus to be calibrated and an apparatus for calibration that obtains an X coordinate position and a Y coordinate position of the COP; determining a COP that is detected as the same COP with a determination criterion that a positional difference between a detected position obtained by the laser surface inspection apparatus to be calibrated and a detected position obtained by the apparatus for calibration on the reference wafer surface is within a threshold range; and calibrating the coordinate position identification accuracy of the laser surface inspection apparatus to be calibrated by adopting the X and Y coordinate positions obtained by the apparatus for calibration as true values of the X and Y coordinate positions.

An inspection apparatus includes a light source unit, cameras, a keyboard, and a controller that determines a wavelength of the excitation light, based on the information on the emission color received by the keyboard, and that controls the light source unit so that the light source unit generates excitation light with the determined wavelength. The controller determines a wavelength longer than an absorption edge wavelength of the substrate of the sample and shorter than a peak wavelength of an emission spectrum of the light-emitting element, the peak wavelength being specified from the information on the emission color, to be the wavelength of the excitation light.

An inspection apparatus includes a light source unit, cameras, a keyboard, and a controller that determines a wavelength of the excitation light, based on the information on the emission color received by the keyboard, and that controls the light source unit so that the light source unit generates excitation light with the determined wavelength. The controller determines a wavelength longer than an absorption edge wavelength of the substrate of the sample and shorter than a peak wavelength of an emission spectrum of the light-emitting element, the peak wavelength being specified from the information on the emission color, to be the wavelength of the excitation light.

A turbine blade or vane inspection apparatus comprising a controller, mounting for holding a turbine blade or vane, a source of illumination, and a camera. At least two of the source of illumination, the camera, and the mounting are moveable components. The controller is configured to control the moveable components to (a) position the turbine blade or vane mounted thereon relative to the illumination source so as to provide a contrast of illumination between a feature of the turbine blade or vane and an adjacent surface of the turbine blade or vane and (b), position the camera so that the optical axis of the camera is directed towards the feature. The controller is further configured to determine a dimension and/or shape of the feature based on an image obtained by the camera.

Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.

An apparatus includes a main body, circuit assembly, lens, and clamping assembly. The main body includes an aperture that receives a wafer configured to receive a sample under study. The main body is configured to support the circuit assembly, which includes illumination sources that emit light of different colors such that total internal reflection is generated in the wafer. The main body is configured to provide support for the lens, and the clamping assembly mechanically coupled to the main body such that the lens is selectively positionable with respect to a camera lens. A microscopy imaging apparatus includes an illumination source, wafer, and charge-coupled device. The illumination source is configured to emit white light such that total internal reflection is generated in the wafer. The sample under study is disposed between the wafer and the charge coupled device, and the charge coupled device is configured to obtain an image of the sample under study upon illumination of the wafer by the illumination source.

Methods and systems for determining one or more characteristics of light in an optical system are provided. One system includes first detector(s) configured to detect light having one or more wavelengths shorter than 190 nm emitted from a light source at one or more first angles mutually exclusive of one or more second angles at which the light is collected from the light source by an optical system for illumination of a specimen and to generate first output responsive to the light detected by the first detector(s). In addition, the system includes a control subsystem configured for determining one or more characteristics of the light at one or more planes in the optical system based on the first output.

Methods and systems for determining one or more characteristics of light in an optical system are provided. One system includes first detector(s) configured to detect light having one or more wavelengths shorter than 190 nm emitted from a light source at one or more first angles mutually exclusive of one or more second angles at which the light is collected from the light source by an optical system for illumination of a specimen and to generate first output responsive to the light detected by the first detector(s). In addition, the system includes a control subsystem configured for determining one or more characteristics of the light at one or more planes in the optical system based on the first output.

The invention provides a defect inspection apparatus. The defect inspection apparatus includes: an illumination optical system configured to irradiate a sample with an illumination spot; a detection unit configured to detect, from a plurality of directions, reflected light from the sample irradiated with the illumination spot of the illumination optical system; a control unit configured to control a scan of the sample with the illumination spot of the illumination optical system by overlapping detection regions such that the detection regions partially overlap, the detection regions being detected by the detection unit configured to execute a detection from the plurality of directions when the sample is scanned with the illumination spot of the illumination optical system; and a signal processing unit configured to process a signal obtained by detecting the reflected light from the sample by the detection unit to detect a defect. The signal processing unit includes: a data integration unit configured to synthesize an integrated signal by processing the signal detected a plurality of times by overlapping the reflected light of the sample for each detection region by the detection unit; and a defect detection unit configured to detect the defect on a surface of the sample based on the integrated signal synthesized by the data integration unit.