A sensor including a detection film formed from a resin composition, a first electrode provided on a first surface of the detection film, and a second electrode provided on a second surface of the detection film, wherein the first surface of the detection film includes a rough surface having fine irregularities with a root mean square roughness (Rq) of 0.3 m to 3.0 m in a portion that is in contact with the first electrode.

Disclosed is a humidity sensing element that includes an insulation section made of an insulating material, an application electrode to which a voltage is applied, and an output electrode which outputs a voltage signal corresponding to an electrical current flowing through an electrical path via water molecules adhering to a surface of the insulating material in response to the voltage applied to the application electrode. A distance between the application electrode and the output electrode is equal to or greater than a predetermined value, and/or a total sum of lengths of portions where the application electrode and the output electrode face each other is less than a predetermined value.

A radio frequency identification (RFID) tag includes a power harvesting circuit that operates generate power for the RFID tag from a continuous wave of a radio frequency (RF) signal. The RFID tag further includes a tuning circuit that is tuned based on a capacitance setting, where the capacitance setting is indicative of a power level of the power. The RFID tag further includes a processing module operably coupled to the tuning circuit, where the processing module operates to generate the capacitance setting to obtain a desired power level for the power.

A wireless sensor includes a radio frequency (RF) front end and a sensing integrated circuit (IC). The RF front end includes an antenna that is operable to transceive RF signals and a tuning circuit. The sensing IC includes a power supply. The sensing IC is operable to detect an impedance change of the power supply. The sensing IC is further operable to convert the impedance change into a digital value. The sensing IC is further operable to output, via the antenna, the digital value.

A humidity meter includes a humidity sensor, a heating device oriented towards the humidity sensor, a signal generator capable of modulating a power output of the heating device, and a lock-in amplifier capable of demodulating a response signal of the humidity sensor as induced by the modulated heating device. A method of measuring humidity includes the steps of providing a humidity sensor positioned along a channel, a heating device positioned opposite the humidity sensor along the channel, and a controller including a signal generator and a lock-in amplifier; providing an airflow along the channel; modulating a power supply to the heating device using the signal generator; and demodulating a response signal of the humidity sensor induced by the modulated heating device.

A chip substrate, a manufacturing method thereof, a gene sequencing chip, and a gene sequencing method. The chip substrate includes a base substrate; first electrode, located on the base substrate in an array; an insulating layer, located at gaps between two adjacent ones of the first electrodes, and partially covering the two adjacent ones of the first electrodes to form containing spaces being in one-to-one correspondence with the first electrodes; a capacitive dielectric layer, located on a side of the first electrodes away from the base substrate, and located in the containing spaces; and second electrodes, located on a side of the capacitive dielectric layer away from the base substrate, the capacitive dielectric layer includes a first region and a second region, an orthographic projection of the second electrodes on the base substrate is overlapped with an orthographic projection of the first region on the base substrate.

A method of manufacturing a relative humidity sensor includes the steps of providing a substrate, providing a first electrode and an electrical connection element on or over the substrate, providing an insulating layer to electrically isolate the first electrode from the electrical connection element, providing an inorganic porous dielectric layer over the first electrode or the insulating layer in an area of the first electrode, and depositing a second electrode in or over the inorganic porous dielectric layer by grazing incidence deposition. The second electrode is porous and is electrically connected to the electrical connection element.

A wireless sensor includes an antenna, a sensing integrated circuit (IC), and a power supply impedance altering element. The antenna is operable to receive an inbound radio frequency (RF) signal and to transmit an outbound RF signal. The sensing IC includes a power supply, a first power supply connection, and a second power supply connection. The power supply impedance altering element is coupled to the first and second power supply connections and is coupled to sense a condition of an item. The sensing IC is operable to detect an impedance change of the power supply based on an effect of the power supply impedance altering element. The sensing IC is further operable to convert the impedance change into a digital value that represents the condition of the item. The sensing IC is further operable to output, via the antenna, the digital value or a representation of the condition.

A radio frequency identification (RFID) tag includes a power harvesting circuit, an RF front-end, and a processing module. The power harvesting circuit generates power for the RFID tag from a continuous wave of an inbound radio frequency (RF) signal. The RF front-end receives the inbound RF signal and transmits an outbound RF signal. The RF front-end includes a tuning circuit that is tuned based on a capacitance setting. The tuning of the tuning circuit effects a characteristic of the RF front-end. The processing module generate the capacitance setting to adjust the characteristic of the RF front-end to a desired characteristic.

Noncontact sensing components are provided herein, in an aspect, they can be for an electronic device. The noncontact sensing components can contain a semiconductor layer having a r-GO portion and a CNT portion. The noncontact sensing components can be used to detect the presence or movement of a humidity source in the vicinity of the noncontact sensing component. The resistance/humidity response of the component can be based on the combined contribution of carbon nanotube (positive resistance variation) and reduced-graphene oxide (negative resistance variation) behaviors.