An electrochemical ion sensor and a method for sensing a presence of at least one ion species in a solution are provided. The electrochemical sensor includes a solid-state electrolyte medium doped with an organometallic material, having an electrochemical affinity with the ion species, and a pair of electrodes electrically contacting the solid-state electrolyte. The electrochemical sensor also includes an electrical circuit configured to drive the pair of electrodes with an AC electrical excitation and to measure at least one parameter related to a complex electrical impedance of the doped solid-state electrolyte medium in response to the AC electrical excitation. The parameter may be an electrical resistance, an inductance or a combination of both, and represents the presence of the ion species in the solution when the solid-state electrolyte medium is exposed to the solution.

A device for measuring pH levels and contaminant concentration includes an electrode assembly that is electrically coupled to a control unit. The electrode assembly includes a FLUID first contact electrically coupled to a reference electrode, a second contact electrically coupled to a working electrode, and a third contact electrically coupled to a counter electrode. The working electrode may be modified to include a cysteine functionalized graphene oxide with polypyrrole nanocomposite. In operation, the control unit may apply a complex signal to the working electrode via the second contact in order to adhere and subsequently strip contaminant ions from the fluid sample to the working electrode. During this process, a current may be measured across the reference electrode and the counter electrode to measure contaminant ion concentration. The pH of the fluid sample may also be determined by a current measured across the reference electrode and the counter electrode. In some examples, the pH may be used to calibrate the measured levels of the contaminant ions.

An IC includes a source region and a drain region in a semiconductor layer. A channel region is between the source region and the drain region. A sensing well is on a back surface of the semiconductor layer and over the channel region. An interconnect structure is on a front surface of the semiconductor layer opposite the back surface of the semiconductor layer. A biosensing film lines the sensing well and contacts a bottom surface of the sensing well that is defined by the semiconductor layer. A coating of selective binding agent is over the biosensing film and configured to bind with a cardiac cell.

In one implementation, a method for manufacturing a chemical detection device is described. The method includes forming a chemical sensor having a sensing surface. A dielectric material is deposited on the sensing surface. A first etch process is performed to partially etch the dielectric material to define an opening over the sensing surface and leave remaining dielectric material on the sensing surface. An etch protect material is formed on a sidewall of the opening. A second etch process is then performed to selectively etch the remaining dielectric material using the etch protect material as an etch mask, thereby exposing the sensing surface.

A field effect transistor and a sensor using the field effect transistor is provided. The field effect transistor can be manufactured so as to have uniform properties by simple steps at low costs, and can stably detect, when used as a sensor, a very small amount of analyte with a high sensitivity while the properties are hardly deteriorated. A channel of the field effect transistor is constituted by a single-walled carbon nanotube thin film that is grown, by a chemical vapor deposition method, using particles of a nonmetallic material as growth nuclei, the nonmetallic material containing 500 mass ppm or less metallic impurities that contain a metal and its compounds.

In some examples, an integrated circuit comprises: a semiconductor die including a semiconductor substrate, a dielectric layer on the semiconductor substrate, and a metallization structure encapsulated in the dielectric layer, in which the semiconductor substrate includes a transistor having a first current terminal, a second current terminal, and a channel region between the first and second current terminals, and the dielectric layer has a sensing side facing away from the semiconductor substrate; an insulation layer on the sensing side; a sensor terminal on the sensing side and over the channel region; and a restriction structure including an opening and a rigid silicon-based fluidic structure, in which the silicon-based fluidic structure is on the sensing side and encapsulates a fluid cavity on the sensing side, the sensor terminal is in the fluid cavity, and the restriction structure is configured to transport a fluid by microfluidic diffusion.

According to an aspect of the present inventive concept there is provided a method for manufacturing a fluid sensor device comprising: bonding a silicon-on-insulator arrangement comprising a silicon wafer, a buried oxide, a silicon layer, and a first dielectric layer, to a CMOS arrangement comprising a metallization layer and a planarized dielectric layer, wherein the bonding is performed via the first dielectric layer and the planarized dielectric layer; forming a fin-FET arrangement in the silicon layer, wherein the fin-FET arrangement is configured to function as a fluid sensitive fin-FET arrangement; removing the buried oxide and the silicon wafer; forming a contact to the metallization layer and the fin-FET arrangement, wherein the contact comprises an interconnecting structure configured to interconnect the metallization layer and the fin-FET arrangement; forming a channel comprising an inlet and an outlet, wherein the channel is configured to allow a fluid comprising an analyte to contact the fin-FET arrangement.

Nanopore structures are provided. In one aspect, a nanopore structure includes: an oxide shell surrounding a nanopore, wherein openings on both ends of the nanopore have a diameter D1, and a center of the nanopore has a diameter D2, wherein D1>D2. In another aspect, the nanopore structure includes: a first film disposed on a substrate; a second film disposed on the first film; at least one pore extending through the first film and the second film; a dielectric material disposed in the at least one pore; and a nanopore at a center of the dielectric material in the at least one pore, wherein a top opening to the nanopore has a first diameter d1, and a bottom opening to the nanopore has a second diameter d2, wherein d2>d1. Methods of forming the nanopore structures are also provided.

In one implementation, a chemical device is described. The sensor includes a chemically-sensitive field effect transistor including a floating gate structure having a plurality of floating gate conductors electrically coupled to one another. A conductive element overlies and is in communication with an uppermost floating gate conductor in the plurality of floating gate conductors. The conductive element is wider and thinner than the uppermost floating gate conductor. A dielectric material defines an opening extending to an upper surface of the conductive element.

Structures, apparatuses, and methods are provided for fabricating a semiconductor device structure. An example semiconductor device structure includes a first substrate, a first device layer, a second device layer and a third device layer. The first device layer may be on the first substrate and include a switch. The second device layer may be on the first device layer and include a sensing device. The third device layer may include one or more inter-level connection structures configured to electrically connect the switch to the sensing device. The switch may be configured to be electrically turned on in response to a selection signal. The sensing device may be configured to generate an output signal in response to the switch being turned on.