A photoacoustic apparatus may include: a ring transducer configured to measure a photoacoustic signal generated from an object, and including a hollow space that is provided as a travel path of light and ultrasonic waves; a mirror part disposed along a light path of the light transmitted from the ring transducer, and configured to reflect the light transmitted from the ring transducer, and the ultrasonic waves generated from the object, and to adjust magnification of the mirror part according to a number of apertures of the photoacoustic apparatus; and a fluid tank including a transparent film that allows the photoacoustic signal to pass through the fluid tank, and accommodating a fluid, the ring transducer, and the mirror part inside the fluid tank.

Methods and systems for subsurface imaging of nanostructures buried inside a plate shaped substrate are provided. An ultrasonic generator at a side face of the substrate is used to couple ultrasound waves (W) into an interior of the substrate. The interior has or forms a waveguide for propagating the ultrasound waves (W) in a direction (X) along a length of the substrate transverse to the side face. The nanostructures are imaged using an AFM tip to measure an effect (E) at the top surface caused by direct or indirect interaction of the ultrasound waves (W) with the buried nanostructures.

A device for imaging defects in a structure includes N transmitters and P receivers to be distributed over at least one surface of the structure and a central unit controlling the transmitters and receivers to sequentially record Q≤N×P signals (S) obtained from electrical signals provided by the receivers of Q different transmitter/receiver pairs, after reception of mechanical waves transmitted by the transmitters of these Q pairs. It further stores Q first and Q second corresponding reference signals (S.sub.REF1, S.sub.REF2), representative of the structure without defects and differing by random noise. A central processing unit is programmed to: correlate each signal obtained with the corresponding first reference signal, in such a way as to construct an image of probabilities of defects; correlate each first reference signal with the corresponding second reference signal, in such a way as to construct a reference noisy image; and subtract the reference noisy image from the image of probabilities of defects.

A photoacoustic and optical microscopy combiner. The combiner is configured to support a transducer defining an axis. The combiner includes a body including a base and an opening extending through the base, and a glass member at least partially positioned within the opening. The glass member includes a surface positioned at an angle relative to the base and the axis of the transducer. A sample slide is supported on the body and at least partially over the opening. The sample slide is positioned such that a sample on the sample slide is configured to receive light from a laser and redirect the light to an ultrasound transducer to generate a real-time image of a sample.

A sensor is disclosed, wherein a transducer generates acoustic waves, which are received by a lens assembly. The lens assembly transmits and directs at least a part of the acoustic waves to a target. The lens assembly then receives at least a part of acoustic waves, after interaction with the target. The sensor further comprises an optical detector that comprises at least one optically reflective member located at a surface of the lens assembly, which surface is arranged opposite to a surface of the lens assembly which faces a focal plane of the lens assembly, wherein the at least one optically reflective member is mechanically displaced in response to the acoustic waves, which are received and transmitted by the lens assembly.

A coupler and a chuck are described. The chuck is configured to secure an article while the wafer is undergoing an inspection process. The chuck has a plurality of vacuum areas. Some vacuum areas hold the wafer in place while other vacuum areas suction couplant from the edge surface of the wafer. The coupler is used to inspect a surface and subsurface of the wafer for defects and includes a sensing device, which may be a transducer. One or more couplant inlet couplings are disposed on a second portion of the coupler, the couplant inlet couplings provide a couplant to a portion of the wafer inspected by the sensing device. A plurality of vacuum inlet couplings is disposed on a third portion of the coupler. At least one of the vacuum inlet couplings provide suction through a recessed portion of a lower surface of the coupler to remove couplant that is outside the portion of the wafer that is being inspected by the sensing device.

A method for measuring damage (D) of a substrate (1) caused by an electron beam (2). The method comprises using an atomic force microscope (AFM) to provide a measurement (S2) of mechanical and/or chemical material properties (P2) of the substrate (1) at an exposure area (1a) of the electron beam (2). The method further comprises calculating a damage parameter (Sd) indicative for the damage (D) based on the measurement (S2) of the material properties (P2) at the exposure area (1a).

A photoacoustic apparatus may include: a ring transducer configured to measure a photoacoustic signal generated from an object, and including a hollow space that is provided as a travel path of light and ultrasonic waves; a mirror part disposed along a light path of the light transmitted from the ring transducer, and configured to reflect the light transmitted from the ring transducer, and the ultrasonic waves generated from the object, and to adjust magnification of the mirror part according to a number of apertures of the photoacoustic apparatus; and a fluid tank including a transparent film that allows the photoacoustic signal to pass through the fluid tank, and accommodating a fluid, the ring transducer, and the mirror part inside the fluid tank.

A method and system for performing subsurface atomic force microscopy measurements, the system comprising: a signal source for generating an drive signal; a transducer configured to receive the drive signal for converting the drive signal into vibrational waves and coupling said vibrational waves into a stack comprising a sample for interaction with subsurface features within said sample; cantilever tip for contacting the sample for measuring surface displacement resulting from the vibrational waves to determine subsurface features; wherein the system includes a measurement device for measuring a measurement signal returning from the transducer during and/or in between the subsurface atomic force microscopy measurements.

A cantilever (30) for an ultrasound acoustic microscopy device is provided comprising a transmission tip (31) to contact a sample (11) to therewith transmit an ultrasound acoustic signal as an ultrasound acoustic wave into the sample. The cantilever further comprises a reception tip (32) separate from the transmission tip (31) to contact the sample to receive an acoustic signal resulting from reflections of the ultrasound wave from within the sample.