The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

The present invention relates to MEMS (microelectromechanical systems) accelerometers, in particular to an accelerometer designed to reduce error in the accelerometer output. The MEMS accelerometer includes a proof mass, which is capable of movement along at least two perpendicular axes and at least one measurement structure. The proof mass is mechanically coupled to the measurement structure along the sense axis of the measurement structure, such that movement of the proof mass along the sense axis causes the moveable portion of the measurement structure to move, and is decoupled from the measurement structures along an axis or axes perpendicular to the sense axis of the measurement structure, such that movement of the proof mass perpendicular to the sense axis of the measurement structure does not cause the moveable portion of the measurement structure to move.

A MEMS inclinometer includes a substrate, a first mobile mass and a sensing unit. The sensing unit includes a second mobile mass, a number of elastic elements, which are interposed between the second mobile mass and the substrate and are compliant in a direction parallel to a first axis, and a number of elastic structures, each of which is interposed between the first and second mobile masses and is compliant in a direction parallel to the first axis and to a second axis. The sensing unit further includes a fixed electrode that is fixed with respect to the substrate and a mobile electrode fixed with respect to the second mobile mass, which form a variable capacitor.

The present invention discloses a three-axis accelerometer. The three-axis accelerometer comprises: a substrate; at least one anchor block fixedly disposed on the substrate; a first X-axis electrode, a second X-axis electrode, a first Y-axis electrode, a second Y-axis electrode, a first Z-axis electrode and a second Z-axis electrode all fixedly disposed on the substrate; a framework suspended above the substrate and comprising a first beam column, a second beam column disposed opposite to the first beam column and at least one connecting beam connecting the first beam column and the second beam column; a proof mass suspended above the substrate; and at least one elastic connection component configured to elastically connect to the at least anchor block, the connecting beam, and the proof mass. The three-axis accelerometer can realize high-precision acceleration detection on three axes with only one proof mass, and in particular, can provide a fully differential detection signal for the Z axis, thereby greatly improving detection precision.

A vibration rectification error correction circuit includes a first correction circuit that obtains a digital value based on a signal to be measured output from a sensor element configured to measure a physical quantity and corrects a vibration rectification error of the digital value by a correction function based on a product of values obtained by biasing the digital value.

Microelectromechanical and/or nanoelectromechanical device comprising a support and at least one moveable element so as to be able to be displaced translationally with respect to the support, a means (G1) for translationally guiding said element, said guiding means (G1) comprising two rigid arms (6), a rotating articulation (12, 10) between each arm (6, 8) and the moveable element (4) and a rotating articulation (10, 14) between each arm (6, 8) and the support, the guiding means (G1) also comprising a coupling articulation (18) between the two arms having at least rotating articulation, said rotating articulations having axes of rotation at least parallel with each other such that during a translational displacement of the moveable element (4) the arms (6, 8) pivot with respect to each other in opposite directions, the rotating articulations being made by torsionally deformable beams.

A microelectromechanical device structure comprises a supporting structure wafer. A cavity electrode is formed within a cavity in the supporting structure wafer. The cavity electrode forms a protruding structure from a base of the cavity towards the functional layer, and the cavity electrode is connected to a defined electrical potential. The cavity electrode comprises a silicon column within the cavity in the supporting structure wafer, which is partially or entirely surrounded by a cavity. One or more cavity electrodes may be utilized for adjusting a frequency of an oscillation occurring within the functional layer.

Microelectromechanical and/or nanoelectromechanical device comprising a support and at least one moveable element so as to be able to be displaced translationally with respect to the support, a means (G1) for translationally guiding said element, said guiding means (G1) comprising two rigid arms (6), a rotating articulation (12, 10) between each arm (6, 8) and the moveable element (4) and a rotating articulation (10, 14) between each arm (6, 8) and the support, the guiding means (G1) also comprising a coupling articulation (18) between the two arms having at least rotating articulation, said rotating articulations having axes of rotation at least parallel with each other such that during a translational displacement of the moveable element (4) the arms (6, 8) pivot with respect to each other in opposite directions, the rotating articulations being made by torsionally deformable beams.

A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

A dynamic quantity sensor includes: a support portion with a fixed electrode; a plate-shaped fixing portion fixed to the support portion; a beam portion supported by the fixing portion and extending in one direction; a first weight on one side of the fixing portion in an other direction, coupled to the beam portion, and providing a space between a connecting portion and a tip portion by coupling the connecting portion connecting to the beam portion and the tip portion opposite to the beam portion through a coupling portion extending in the other direction; and a second weight portion opposite to the first weight portion and coupled to the beam portion. The first weight portion has a length larger than the second weight portion. A dynamic quantity is detected based on a change in a capacitance between the fixed electrode and each of the first and second weight portions.