Patent classifications
G01P2015/0871
Physical quantity sensor, physical quantity sensor device, and inclinometer, inertia measurement device, structure monitoring device, and vehicle using physical quantity sensor device
A physical quantity sensor includes a base, at least two arms, a movable plate, a hinge, and a physical quantity measurement element. Four quadrants of the sensor are defined by first and second orthogonal lines. The first line passes through the center of the sensor and crosses the hinge. The second line extends along the hinge. Fixed regions of the sensor are located in the first and second quadrants. No fixed regions are located in at least one of the third and fourth quadrants. The third and fourth quadrants are closer to the base than the first and second quadrants in a plan view.
Physical quantity sensor, physical quantity sensor device, electronic apparatus, portable electronic apparatus, and vehicle
A physical quantity sensor includes a substrate, a pair of first elements detecting acceleration in a first direction, and a pair of second elements detecting an acceleration in a second direction. The first element portion includes a first movable portion displaceable in the first direction, first and second movable electrode fingers disposed in the first movable portion, first and second fixing electrode fingers disposed to face the first and second movable electrode fingers, and first and second support portions supporting the first and second fixing electrode fingers. The second element includes a second movable portion displaceable in the second direction, third and fourth movable electrode fingers disposed in the second movable portion, third and fourth fixing electrode fingers disposed to face the third and fourth movable electrode fingers, and third and fourth support portions supporting the third and fourth fixing electrode fingers.
Active stiction recovery
A device includes a micro-electromechanical system (MEMS) device layer comprising a proof mass. The proof mass includes a first proof mass portion and a second proof mass portion. The first proof mass portion is configured to move in response to a stimuli. The second proof mass portion has a spring attached thereto. The device further includes a substrate disposed parallel to the MEMS device layer. The substrate comprises a bumpstop configured to limit motion of the first proof mass portion. The device includes a first electrode disposed on the substrate facing the second proof mass portion. The first electrode is configured to apply a pulling force onto the second proof mass portion and to move the second proof mass portion towards the first electrode.
Physical quantity sensor, electronic apparatus, and vehicle
A physical quantity sensor includes, when three directions orthogonal to one another are defined as a first direction, a second direction, and a third direction, a substrate; and a moving member facing the substrate in the third direction via a gap and becoming displaced in the third direction in relation to the substrate. The moving member has a first region that has a plurality of penetration holes penetrating the moving member in the third direction and having a square opening shape as viewed from the third direction, and a second region having no penetration hole. At least one of a length in the first direction and a length in the second direction of the second region is equal to or greater than S0+2×S1, where S0 is a length of one side of the penetration hole, and S1 is a space between the penetration holes next to each other.
Micromechanical sensor system, method for using a micromechanical sensor system
A micromechanical sensor system, in particular, an acceleration sensor, including a substrate having a main extension plane, the sensor system including a first mass and a second mass. The first and second masses are each designed to be at least partially movable in a vertical direction, perpendicular to the main extension plane of the substrate. The first mass includes a stop structure, wherein the stop structure has an overlap with the second mass in the vertical direction.
Microelectromechanical device with stopper
This disclosure describes a microelectromechanical device comprising at least one mobile rotor. The rotor comprises a rotor measurement region and a rotor stopper region and a rotor isolation region which connects the rotor measurement region mechanically to the rotor stopper region and isolates the rotor measurement region electrically from the rotor stopper region.
MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION
An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a substrate, a beam, a movable structural body, a first stopper member, a second stopper member and a third stopper member. The first stopper member is arranged with a first gap from the movable structural body in an in-plane direction. The second stopper member is arranged with a second gap from the movable structural body in an out-of-plane direction. The third stopper member is arranged opposite to the second stopper member with the movable structural body interposed therebetween in the out-of-plane direction, and is arranged with a third gap from the movable structural body. Consequently, there can be provided a semiconductor device in which excessive displacement of the movable structural body can be suppressed to thereby suppress damage to and breakage of the beam supporting the movable structural body, and a method of manufacturing the same.
Inertial sensor, electronic apparatus, and vehicle
An inertial sensor includes a substrate, a first supporting beam being a first rotation axis extending along a first direction, a first movable member swingable around the first rotation axis, a second supporting beam being a second rotation axis extending along a second direction crossing the first direction, a second movable member swingable around the second rotation axis, a third rotation axis extending along a second direction, a third movable member swingable around the third rotation axis, and a projection, wherein the second and third movable members are line-symmetrically placed with a center line of the first movable member along the second direction as an axis of symmetry, a center of gravity of the second movable member is closer to the center line than the second supporting beam, and a center of gravity of the third movable member is closer to the center line than the third supporting beam.
MEMS Device, Electronic Apparatus, And Vehicle
A MEMS device includes: a substrate as a base including a support portion and a detection electrode as a fixed electrode; a movable body supported to the support portion with a major surface of the movable body facing the fixed electrode; and an abutment portion facing at least a portion of an outer edge of the movable body and restricting rotational displacement in an in-plane direction of the major surface. The abutment portion includes an abutment surface including an abutment position at which the movable body abuts against the abutment portion due to the rotational displacement of the movable body, and a hollow portion provided opposing the abutment surface.