A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.

A hermetically-sealed multi-directional single-proof-mass accelophone that demonstrates a high sensitivity to micro-gravity level accelerations in a wide operational bandwidth by utilizing nano-scale transductions gaps and vacuum packaging. Stable operation of the wafer-level-packaged sensor is validated over a wide operational bandwidth greater than 10 kHz. Developing a noise-matched custom interface IC should enable a sensor noise performance near the Brownian noise floor of below 10 μg/√Hz. The sensor can be applied in detection of vital mechano-acoustic signals emanating from the body and can be easily incorporated in existing wearable health monitoring devices for multi-faceted health monitoring using a single integrated sensor.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

A physical quantity sensor includes a substrate provided with a first fixed electrode, a movable body provided to be swingable with respect to the substrate about a rotation axis along a Y axis, and a stopper restricting rotation of the movable body. The movable body is provided with an elastic portion at a position overlapping the stopper in a plan view viewed from the Z axis direction. The first mass portion includes a first region, and a second region far from the rotation axis. A first gap distance of a first gap between the first mass portion and the first fixed electrode in the first region is smaller than a second gap distance of a second gap between the first mass portion and the first fixed electrode in the second region.

A physical quantity sensor includes a substrate and a movable body. A first region to an n-th region in which a step is provided between adjacent regions are provided on a first surface of a first mass portion of the movable body. Ends of the first region to the n-th region on a side far from the rotation axis are referred to as a first end to an n-th end. In a state in which the movable body is maximally displaced around the rotation axis AY, when a virtual straight line passing through two ends of the first end to the n-th end and having a smallest angle with respect to the X axis is set as a first virtual straight line, and a straight line along a main surface of a first fixed electrode is set as a second virtual straight line, the first virtual straight line and the second virtual straight line do not intersect with each other in a region between a first normal line intersecting with an end of the first fixed electrode of the substrate closest to the rotation axis AY and a second normal line intersecting with an end of the first fixed electrode farthest from the rotation axis.

A microelectromechanical systems (MEMS) accelerometer comprises a compliant spring structure with a first beam, a second beam, and a rigid structure. One end of the first beam and one end of the second beam are coupled to the rigid structure and a proof mass is coupled to another end of the second beam. Further, a spring anchor is coupled to another end of the first beam. In response to the proof mass moving, an extension coupled to the rigid structure moves in an opposite direction to motion of the proof mass to contact the proof mass and stop the movement of the proof mass.

A microelectromechanical system (MEMS) device includes a substrate and a movable element at least partially suspended above the substrate and having at least one degree of freedom. The MEMS device further includes a protrusion extending from the substrate and configured to contact the movable element when the movable element moves in the at least one degree of freedom, wherein the protrusion comprises a surface having a water contact angle of higher than about 15° measured in air.

A physical quantity sensor includes a substrate that has a first fixed electrode and a movable body that has a first mass portion facing the first fixed electrode. The first mass portion includes a first region, and a second region farther from the rotation axis than the first region, a first through-hole group is provided in the first region, and a second through-hole group is provided in the second region, and the movable body has a first surface on a substrate side, and a second surface. The first surface of the first mass portion is provided with a step or a slope such that a first gap distance of a first gap between the first mass portion and the first fixed electrode in the first region is smaller than a second gap distance of a second gap between the first mass portion and the first fixed electrode in the second region. A depth of through-holes of the first through-hole group and the second through-hole group is smaller than a maximum thickness of the movable body.

Angular accelerometers are described, as are systems employing such accelerometers. The angular accelerometers may include a proof mass and rotational acceleration detection beams directed toward the center of the proof mass. The angular accelerometers may include sensing capabilities for angular acceleration about three orthogonal axes. The sensing regions for angular acceleration about one of the three axes may be positioned radially closer to the center of the proof mass than the sensing regions for angular acceleration about the other two axes. The proof mass may be connected to the substrate though one or more anchors.

A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.