A physical quantity detection element includes: a substrate; first and second fixed electrode portions on the substrate; a movable body on the upper portion of the substrate; and a beam on the movable body, the movable body includes a first movable body on a first side of the beam, and a second movable body on a second side of the beam, the first movable body includes a first movable electrode portion facing the first fixed electrode portion and a first mass portion disposed in an opposite direction of the beam from the first movable electrode portion, the second movable body includes a second movable electrode portion facing the second fixed electrode portion, a mass of the first movable body is greater than a mass of the second movable body, and a mass of the first mass portion is greater than a mass of the first movable electrode portion.

Sensing devices are described. A sensing device includes an inertial sensor, a read-out circuit configured to determine first data indicative of an acceleration of the structure using an output of the inertial sensor, an energy harvester configured to capture energy, and a power management unit. The power management unit comprises a plurality of energy storage components coupled to the energy harvester and a plurality of switches coupled to respective energy storage components of the plurality of energy storage components. The power management unit monitors energy levels stored in the energy storage components, selectively charges the plurality of energy storage components by selectively activating the plurality of switches, and provides power to one or more of the inertial sensor and the read-out circuit based on the monitored energy levels.

A physical quantity sensor includes a substrate that has a first fixed electrode and a movable body that has a first mass portion facing the first fixed electrode. The first mass portion includes a first region, and a second region farther from the rotation axis than the first region, a first through-hole group is provided in the first region, and a second through-hole group is provided in the second region, and the movable body has a first surface on a substrate side, and a second surface. The first surface of the first mass portion is provided with a step or a slope such that a first gap distance of a first gap between the first mass portion and the first fixed electrode in the first region is smaller than a second gap distance of a second gap between the first mass portion and the first fixed electrode in the second region. A depth of through-holes of the first through-hole group and the second through-hole group is smaller than a maximum thickness of the movable body.

Selective self-assembled monolayer patterning with sacrificial layer for devices is provided herein. A sensor device can include a handle layer and a device layer that comprises a first side and a second side. First portions of the first side are operatively connected to defined portions of the handle layer. At least one area of the second side comprises an anti-stiction area formed with an anti-stiction coating. The device can also include a Complementary Metal-Oxide-Semiconductor (CMOS) wafer operatively connected to second portions of the second side of the device layer. The CMOS wafer comprises at least one bump stop. The anti-stiction area faces the at least one bump stop.

A sensor includes a first substrate, a first protruding portion provided on an upper surface of the first substrate, a support portion provided on the upper surface of the first substrate, a beam portion supported at a first end of the beam portion by the support portion, and a weight portion provided to a second end of the beam portion. The upper surface of the first protruding portion has a first surface and a second surface. The second surface is located above the first surface with the upper surface of the first substrate as a reference.

A MEMS sensor includes a movable element positioned in spaced apart relationship above a surface of a substrate and a single centrally located suspension anchor formed on the surface of the substrate. First and second rigid beams are coupled to opposing sides of the suspension anchor and are suspended above the surface of the substrate. A first torsion spring is interconnected between the movable element and the first rigid beam, and a second torsion spring is interconnected between the movable element and the first rigid beam. The rigid beams and the torsion springs are stiff in a lateral direction relative to the surface of the substrate so as to limit slide displacement of the movable element under the condition of a multi-directional overload situation.

A microelectromechanical device includes a semi-flexible proof-mass comprising a primary part, a secondary part and a stiff spring suspending the primary part and the secondary part. The spring causes the parts to move as a single entity when the device is in its normal range. A first stopper structure stops the primary part. The proof-mass is configured to deform through deflection of the spring, when the device is subjected to a shock having a force that is beyond the normal operation range. While the shock causes motion of the proof-mass in one direction along an axis of movement, the spring is configured to cause a restoring force causing the secondary part of the proof-mass to be driven into a restoring motion in a direction opposite to motion along an axis caused by the shock. Momentum of the secondary part causes the primary part to dislodge from the first stopper structure.

A physical quantity sensor includes a base substrate, a movable portion that is oscillatably provided around an axis while facing the base substrate and that is divided into a first movable portion and a second movable portion, a first fixed electrode that is disposed on the base substrate facing the first movable portion, and a second fixed electrode that is disposed on the base substrate facing the second movable portion. The first fixed electrode and the second fixed electrode are configured so as to offset at least a part of a difference between a first fringe capacitance, which is between the first movable portion and the first fixed electrode, and a second fringe capacitance, which is between the second movable portion and the second fixed electrode.

A method of controlling exposed glass charging in a micro-electro-mechanical systems (MEMS) device is disclosed. The method includes providing a MEMS device comprising a proof mass positioned apart from at least one sense plate and at least one outboard metallization layer, wherein at least one conductive glass layer is coupled to the sense plate and the outboard metallization layer, the conductive glass layer including at least one exposed glass portion near the proof mass; and applying a first voltage to the sense plate and a second voltage to the outboard metallization layer. The first voltage is separated from the second voltage by a predetermined voltage level such that the exposed glass portion has an average voltage corresponding to a voltage midway between the first voltage and the second voltage.

An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.