The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

An assembly for interfacing an existing harness connector of an installed wiring harness to a test module. The assembly comprises: a harness-specific connector which is connectable to the existing harness connector, a test box connector module connected to the harness-specific connector, for connecting to a test module, and a unique identifier which is readable on the assembly and which is unique to the test box connector module; wherein the unique identifier is used to identify the test box connector module and to determine, from a list of unique mate-in interface IDs and associated connector configurations, which one of the associated connector configurations corresponds to the identifier of the assembly, and within the one of the associated connector configurations corresponding to the unique mate-in interface ID of the mate-in interface, to determine the correspondence between contacts of the test module to contacts of the existing harness connector.

A sensor for a separable connector includes an elongate plug body extending along an axis and includes an insulating resin. The plug body includes a high voltage connection at least partially encased by the insulating resin and includes a low voltage connection spaced along the axis from the high voltage connection. The plug body also includes a substrate at least partially encased in the insulating resin and extending around the axis between a high voltage portion and a low voltage portion of the substrate. A circuit is disposed on the substrate and extends from the high voltage portion to the low voltage portion of the substrate. The circuit includes a plurality of first impedance elements electrically coupled between the high and low voltage connections. One or more second impedance elements are electrically coupled to the circuit via the low voltage connection to form a voltage divider.

An inspection apparatus includes: a stage on which an inspection target is mounted; a temperature adjustment mechanism configured to adjust a temperature of the stage; an inspecting part configured to exchange electrical signals for an electrical characteristics inspection with the inspection target; a probe card having terminals in contact with the inspection target; an intermediate connection member having connectors electrically connecting the inspecting part and the probe card; a position adjustment mechanism configured to adjust a relative position between the stage and the probe card; a temperature measurement member configured to measure a temperature of the intermediate connection member; a preliminary temperature adjusting part configured to adjust a temperature of the probe card prior to the electrical characteristics inspection; and a determining part configured to determine whether or not the temperature of the probe card is stabilized, based on the temperature of the intermediate connection member.

A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.

A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor. An end of the first outer conductor and an end of the first inner conductor protrude out of the housing via the first opening, the first outer conductor and the first inner conductor both have an elastic deformation capacity along an axial direction to enable the end of the first outer conductor and the end of the first inner conductor both to retract inwards to be in close contact with the planar contact to form a signal-conductive connection between the planar contact and the connection end when the contact surface is in contact with the circuit board.

A line isolating power connector can include a housing for connecting with a power cable and a power source, and wires positioned through the housing that include at least a line wire and a neutral wire. The housing is separated by an aperture into a line conduit and a neutral conduit, and the aperture is sized to receive a portion of a contactless power quality probe such that the power quality probe can be connected around the first line conduit or neutral conduit in order to measure power quality in either the line wire or the neutral wire.

The present disclosure discloses a test apparatus for testing a package-on-package (POP) type semiconductor package includes a lower socket mounted to a tester board providing a test signal, and provided with a plurality of socket pins connected to a lower terminal of a lower package to electrically connect the lower package and the tester board to each other; a pusher to which an upper package is coupled, the pusher having a pusher body which may be moved to approach the lower socket or to be moved away from the lower socket; and an upper socket coupled to the pusher body, and provided with an insulating pad formed of a nonelastic insulating material and a plurality of electrically-conductive parts supported on the insulating pad, the electrically-conductive part being formed of an elastic insulating material containing a plurality of electrically-conductive particles.

A measuring assembly for measuring a temperature and a voltage includes a contact element including a temperature sensor and an electrically conductive portion, a voltage measurement conductor electrically connected to the conductive portion of the contact element, and an electrically conductive fixation element electrically connected to the conductive portion of the contact element, the electrically conductive fixation element extending through a fixation hole of a busbar in a fixed state to connect to the busbar by an elastic force provided by the electrically conductive fixation element in the fixed state, and the electrically conductive fixation element pressing the contact element to a measuring surface of the busbar by the elastic force in the fixed state.