A testing apparatus includes a pressing device and a chip carrying device. The chip carrying device includes a circuit board and a plurality of electrically connecting units. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure, a supporting structure, an elastic assembly sandwiched between the lift structure and the supporting structure, and a plurality of probe assemblies, the latter four of which are arranged in the accommodating slot. The lift structure has a chip receiving slot for receiving a chip. When the chip receiving slot receives the chip and the lift structure is not pressed, the probe assemblies are not connected to the chip. When the chip receiving slot receives the chip and the lift structure is pressed by the pressing device to move toward the accommodating slot, the probe assemblies are connected to the chip.

An electronic power connector including at least one contact configured to electrically connect a power supply to a load. The electronic power connector further including an insulating sleeve configured to receive the at least one contact. The insulating sleeve includes a sensor slot located at a first end of the insulating sleeve.

There is described a method for testing equipment using a test box unit and a mate-in interface having a unique mate-in interface ID, the equipment comprising a plurality of contacts. The method comprises connecting a mate-in interface to the test box unit, connecting the mate-in interface to the contacts of the equipment; selecting a mate-in interface for testing using the unique mate-in interface ID; in the mate-in interface as selected, selecting any one of the contacts for testing; and testing the any one of the contacts of the selected mate-in interface to ground and against each other one of the contacts by inputting a signal and measuring the signal through the selected mate-in interface. There can then be automatically created a list of connections for the equipment making use of the detected or otherwise obtained unique mate-in interface ID.

A scalable test platform can include one or more of a plurality of different device interface boards and a plurality of primitives. The different device interface boards can be configured to provide a uniform interface to couple different types of DUTs and or DUTs with different form factors to the plurality of primitives. The plurality of primitives can be configured to distribute power to the DUTs, and to perform system level testing of the respective DUTs. The plurality of primitives can be configurable by a user to perform any number of system level tests on a number of different types of DUTs and or DUTs with different form factors.

A method for testing a multicore cable including a single common shield covering plural insulated wires to identify a correspondence relation between one end portion and the other end portion of the insulated wires exposed from both ends of the multicore cable. The testing method includes allowing the common shield to have a same potential as a measurement system ground, inputting a test signal, by capacitive coupling, to an end portion of the insulated wire under test among end portions of the insulated wires exposed at one end of the multicore cable, and measuring voltages of output signals output by capacitive coupling respectively from end portions of the insulated wires exposed at the other end of the multicore cable, and identifying the other end portion of the insulated wire under test based on the measured voltages.

An interface having a frame with a plurality of slots, a first pass-through insert in the frame and a second pass-through insert in the frame. The first pass-through insert and the second pass-through insert each have a housing and a contact with the type of contact in the first pass-through insert is different than the type of contact in the second pass-through housing.

A connector includes: a casing that has a housing space, a through hole communicating the housing space with an external space, and an electric wire insertion hole, and that holds a connection terminal connected to a counterpart device; a wiring material that has a distal end part inserted into the housing space via the electric wire insertion hole and a conductor part exposed from a covering at the distal end part, the exposed conductor part being curved at a curved part and connected to the connection terminal; and a conductive voltage detection terminal that has a connection part connected to the exposed conductor part at a position closer to the covering than a curved part and a voltage detection part facing the through hole, and that is provided by branching from a conduction path between the connection terminal and the conductor part.

Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.