Disclosed is a differential test probe tip. The probe tip comprises a socket of electrically conductive material at a proximate end of the probe tip. The socket includes a concavity to receive a signal pin. The probe tip also comprises a reference body of conductive material surrounding the socket. The probe tip further comprises a insulating spacer element of non-conductive material surrounding the reference body at the proximate end of the probe tip. The insulating spacer element includes a signal port to receive the signal pin into the socket. The insulating spacer element further includes a reference port to receive a reference pin and maintain the reference pin in electrical communication with a proximate end of the reference body.

A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

A connection interface for connecting one or more devices under test (DUTs) to one or more remote test and measurement instruments includes a device-under-test connector for connecting a DUT to the interface, a host-instrument connector for connecting the interface to a host test and measurement instrument, and an electrical path between the device-under-test connector and the host-instrument connector. The connection interface also includes a display that has a first portion visually associated with the device-under-test connector and configured to display an identifier for a particular connection point on the DUT. In some embodiments, the first portion of the display is configured to display measurement data from the particular connection point on the DUT. In some embodiments, the display has a second portion that is configured to display information related to the host test and measurement instrument, or to display a name for a particular measurement of the DUT.

The illustrative embodiments pertain to a test fixture having low insertion inductance for large bandwidth monitoring of current signals. In one exemplary embodiment, the test fixture includes a baseplate with each resistor of a set of resistors embedded inside a respective non-plated through slot in the baseplate. A first terminal of each resistor is soldered to a top metallic zone of the baseplate and a second terminal soldered to a first of two bottom metallic zones of the baseplate. The top metallic zone is connected by plated-through holes to a second of the two bottom metallic zones. When mounted upon a PCB, the test fixture allows current flow from the first bottom metallic zone, upwards through the set of resistors to the top metallic zone, and downwards to the second bottom metallic zone. An observation instrument may be coupled to a coaxial connector that is mounted on the baseplate.

A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.

The present invention relates to a substrate testing cartridge provided for simultaneously testing multiple substrates for which a substrate treatment process has been finished, and a method for manufacturing same. According to an embodiment of the present invention, a substrate testing cartridge comprises: a chuck member on which a substrate is placed; a probe card which contacts and tests the substrate and is positioned to face the chuck member with reference to the substrate; and coupling members which couple the substrate, the chuck member, and the probe card, wherein each coupling member comprises: a substrate coupling part which couples the substrate and the chuck member; and a chuck coupling part which couples the probe card and the chuck member.

Coaxial microwave transistor test fixtures provide lowest insertion loss possible and include, as part of the input and output sections, transformer networks either in form of single stage /4 segments, or, for larger bandwidth, multiple step segments or ramped transitions from 50 to the impedance closer to the internal impedance of the power transistor. The transforming networks are flat or cylindrical and can be made exchangeable in order to accommodate various transforming ratios using the same fixture body and coaxial adapters. The fixtures can be calibrated using standard TRL method.

A probe structure for inspecting characteristics of a connector having at least one terminal includes a plunger, a coaxial probe, a flange, a housing, and a spring. A first end portion of the housing and the flange are configured to restrict rotation of the housing in the circumferential direction in a state in which the first end portion of the housing is fitted into the through-hole of the flange. Thus, inspection of characteristics of the terminal of the connector can be performed with higher accuracy.

An electric meter socket includes: a first plurality of connection points within the electric meter socket configured to form electrical connections to line voltage wirings of an electric distribution system; a second plurality of connection points within the electric meter socket configured to form electrical connections to output voltage wirings of a DER device; one or more connection points within the electric meter socket configured to form an electrical connection of neutral wires of the electric distribution system, the DER device, and a load; and a plurality of receptacles, each of the plurality of receptacles electrically connected to a corresponding connection point and configured to accept a mating connector of an electric meter.

A method for assembling a connectorized electrical equipment comprises a connectivity list required for the connectorized electrical equipment, comprising an origin connector and its identifier; a destination electrical equipment subpart and its identifier thereof; and a list of connections between the origin connector and the destination electrical equipment subpart. By querying a database comprising a library of connectors, a construction plan is generated for the connectorized electrical equipment. The construction plan includes diagrams for assembly, images to assist the assembler, a list of material for managing inventory and instructions. An ATE can be connected to the connectorized electrical equipment to be assembled. Based on the construction plan, instructions are provided for a connection between the origin connector and the destination electrical equipment subpart. Connections can be made manually or using the ATE. All connections are registered in real time for progression tracking and instruction updates.