G01R1/0416

Testing of semiconductor chips with microbumps

A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

MANAGING GRID INTERACTION WITH INTERCONNECT SOCKET ADAPTER CONFIGURED FOR AN ENERGY STORAGE DEVICE

A system for managing grid interaction with an energy storage device includes an energy exchange server, a plurality of energy storage devices, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and an energy storage device, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

PROBE, TEST SYSTEM AND TEST METHOD
20200158755 · 2020-05-21 ·

Probe for testing a radio frequency device, test system and test method. An enhanced probe is used for measuring radio frequency signals provided by the device under test or for providing test signals to the device under test. In particular, the probe comprises a power detector directly connected to the contacting elements of the probe. Accordingly, such a power detector can provide a power signal highly correlated with the power signal of a radio frequency signal at input or output terminals connected to the probe.

Mechanism for securing a module inserted into a module receiving frame to the module receiving frame
10658783 · 2020-05-19 · ·

A mechanism (4) for securing a module (5) inserted into a module receiving frame (1) to the module receiving frame (1) and releasing the module (5) for removal from the module receiving frame (1), comprising a catch (6) arranged on the module (5) or the module receiving frame (1), which catch (6) may be moved to and fro between an open position and a locking position of the catch (6), and a spring (7) for preloading the catch (6) into one of the two positions, the open position or the locking position. The mechanism (4) further comprises a catch holder (11), which may be moved to and fro between a retaining position, in which it holds the catch (6) back against the preloading of the spring (7), and a release position, in which it does not hold the catch (6) back against the preloading of the spring (7).

Probe connector for a probing pad structure around a thermal attach mounting hole
10656177 · 2020-05-19 · ·

A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

Test device and method

A test device and a method are provided in the invention. The test device includes a first connection interface, a storage device, a processor and a second connection interface. The first connection interface is coupled to a device under test (DUT) and obtains power information from the DUT according to a first instruction. The storage device stores the power information. The processor is coupled to the first connection interface and storage device, when the first connection interface is coupled to the DUT, sends the first instruction to the first connection interface, receives the power information from the first connection interface, and stores the power information in the storage device. The second connection interface is coupled to an external controlling system, sends the power information to the external controlling system and receives a test instruction from the external controlling system to test the DUT.

Methods, systems, and apparatuses for transferring power and analysis

Methods, systems, and apparatuses are described for transferring power. A power transfer device may be configured to securely fit in a fuse block, fuse holder, and/or the like. The power transfer device may transfer power from a source to a load connected to the fuse block, fuse holder, and/or the like, while also isolating the power to prevent the power from backfeeding to the source. The power transfer device may be used to perform testing, measurements, and/or analysis (e.g., voltage measurements, power measurements, frequency analysis, system impedance testing, etc.).

SOCKET AND INSPECTION SOCKET
20240019459 · 2024-01-18 · ·

A socket is configured to electrically connect a first electric component including a first terminal and a second electric component including a second terminal that is different from the first terminal in arrangement, the socket including: a contact pin configured to electrically connect the first terminal and the second terminal; a base part where the contact pin is disposed; and a sheet member disposed to face a surface of the base part on a second electric component side, the sheet member including an upper electrode configured to make contact with the contact pin when in use, a lower electrode configured to make contact with the second terminal when in use, and a wiring configured to connect the upper electrode and the lower electrode disposed at different positions in plan view.

TESTING INTERPOSER METHOD AND APPARATUS
20200150149 · 2020-05-14 ·

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

INSERTION/EXTRACTION MECHANISM AND METHOD FOR REPLACING BLOCK MEMBER
20200153189 · 2020-05-14 ·

There is provided an insertion/extraction mechanism for having one or multiple block members being inserted into or extracted from a frame member forming an intermediate connection member that is disposed between a first member having multiple first members and a second member having multiple second terminals and electrically connects the first terminals and the second terminals, the block member having multiple connection terminals for electrically connecting the first terminals and the second terminals. The insertion/extraction mechanism comprises a first engaging unit and a second engaging unit that are engaged with a first engaged portion and a second engaged portion of the block member, respectively, thereby holding the block member.