A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

A wiring board includes an insulation substrate, a wiring conductor, a connection conductor, first and second wiring layers, and a groove. The insulation substrate includes a first face. The wiring conductor is located in or on and the connection conductor is located in the insulation substrate. A part of the wiring conductor is included at each of the first and second wiring layers. The groove includes an opening at the first face. The wiring conductor includes an electrode pad and a solid conductor. The solid conductor is included at the second wiring layer. The connection conductor includes first and second connection conductors, a second connection conductor, and an intersection part. The intersection part intersects the groove at the first wiring layer and is located between the first and second connection conductors. The first and second connection conductors are electrically continuous to the electrode pad and the solid conductor, respectively.

A testing device for electronic dies includes a first support part and a second support part configured to be removably assembled with each other. The first and second support parts together define at least one housing where at least one electronic die can be arranged to be tested. The electronic die has a first surface with contacting elements. The at least one housing includes a first portion. This at least one housing is arranged to enable the at least one electronic die to occupy a first position in the housing where the first surface is spaced apart from the first portion, and is further arrange to enable the at least one electronic die to occupy a second position in the housing where the first surface bears against the first portion.

A test jig for testing electrical characteristics of a semiconductor product includes a conductive ground block for supporting the semiconductor product thereon; a substrate provided on the ground block, and having a first and a second substrate electrodes formed on the substrate for the respective electrodes to be in contact with leads of the semiconductor; and lead pressers for pressing the leads against the first and the second substrate electrodes, respectively, so that electrical connection is established between the respective leads and the first and the second substrate electrodes in testing the semiconductor product.

The present invention provides a measurement equipment configured to be connected to a measurement device. The measurement equipment comprises an HF coaxial connection element and a torque limiter. The torque limiter is configured for connecting the HF coaxial connection element with the measurement device with a predetermined torque. Furthermore, the invention provides an HF coaxial connection element configured to be connected to a corresponding HF coaxial connection element. The HF coaxial connection element comprises a torque limiter configured for detachably connecting the HF coaxial connection element with the corresponding HF coaxial connection element with a predetermined torque. Furthermore, the HF coaxial connection element comprises a centering element for centering the HF coaxial connection element with respect to the corresponding HF coaxial connection element. The HF coaxial connection element comprises a twist protection element for preventing twisting motion between the HF coaxial connection element and the corresponding HF coaxial connection element. In addition, the invention provides a corresponding torque limiter.

A high-voltage test terminal includes a first conductor, a second conductor, and a primary insulator disposed between and coupled to the first and second conductors. A blade is movably connected to the second conductor. The blade is electrically and mechanically connected to the first conductor in a first position and electrically isolated and mechanically disconnected from the first conductor in a second position. A guard insulation layer is disposed between the primary insulator and the first conductor.

A system for managing grid interaction with an energy storage device includes an energy exchange server, a plurality of energy storage devices, a plurality of interconnect socket adapters, and a plurality of energy exchange controllers, each energy exchange controller coupling to one of the plurality of interconnect socket adapters and dictating energy consumption based on energy pricing data received from the energy exchange server. Each interconnect socket adapter electrically couples to the power grid, one or more energy sinks, and an energy storage device, and the energy exchange server receives a real-time energy consumption data set, a real-time energy production data set, a set of environmental parameters and a starting energy price, and generates a current aggregate electricity demand value as a function of the real-time energy consumption data set and the environmental parameters, a current aggregate electricity supply value as a function of the real-time energy production dataset and the environmental parameters, and a current energy price as a function of the starting energy price, the current aggregate electricity demand value, and the current aggregate electricity supply value.

A miniature probe for measuring small voltage signals of a DUT includes a probe body having a flexible substrate and signal transmission lines running a longitudinally, and a first probe connection circuit located at a first end of the probe body and including exposed wires, SMT components coupled between the exposed wires and the signal transmission lines, respectively, and a local mechanical stiffener mounted adjacent the SMT components. The wires are connectable to the DUT for receiving the voltage signals. The probe further includes a second probe connection circuit located at a second end of the probe body, and including transmission line connectors coupled to the signal transmission lines, respectively, and a bent portion of the flexible substrate between the probe body and the transmission line connectors. The bent portion enables the transmission line connectors to exit the probe substantially axially, relative to the longitudinal length of the probe body.

Methods and systems for a universal device multi-function test apparatus are provided. Specifically, the universal device multi-function test apparatus is configured to receive multiple device types, manufacturers, and/or models attached to a nest via an interface module. The device can then be subjected to a battery of tests in a unified and controlled test environment. Information related to the initiated tests, even including results, may be associated with the device and stored in memory, written to the device, and/or forwarded for further processing/repair operations.