A rubber socket comprises a lower film, an upper film, an electrical connection member, and a rubber layer. The lower film comprises a plurality of lower electrode parts coupled to a synthetic resin film. The upper film is arranged in parallel with and spaced apart from the lower film, and comprises a plurality of upper electrode parts. The electrical connection member comprises: a soft substrate, which physically connects the lower electrode parts and the upper electrode parts, has a flat plate shape, and is easily bent by an external force; and a plurality of electrical connection patterns, which are longitudinally formed on one side surface of the soft substrate to electrically connect the lower electrode parts and the upper electrode parts. The rubber layer comprises an elastic material, is disposed between the lower film and the upper film, has all the electrical connection members buried therein, and constantly maintains a distance between the lower film and the upper film.

A semiconductor inspection jig includes: a jig body having a recessed part provided on a top surface of the jig body; a printed circuit board provided on the top surface of the jig body; a GND block provided in the recessed part and having first and second side faces opposite to each other; first and second blocks provided in the recessed part and sandwiching the GND block; a push-up part pushing up the GND block from a bottom surface of the recessed part; a first press part pressing the first block against the first side face of the GND block; and a second press part pressing the second block against the second side face of the GND block.

The present document describes an assembly for connecting a test unit to a wiring harness or equipment to be tested, and a method for testing using the assembly. The assembly may comprise a test box unit, a generic mate-in interface, and at least one specific mate-in interface. The generic mate-in interface is for connection to the test box unit on one end, and to the at least one specific mate-in interfaces at the other end. The mate-in interfaces are for testing different existing wiring harnesses or equipment. Each one of the generic and specific mate-in interfaces has a specific ID comprised in an ID support on the electrical path of the generic mate-in interface and the specific mate-in interface, for example, on any one of the end connectors of the interfaces or on their wiring. Information relating to the IDs of the connectors and the contact configuration of each mate-in interface is stored in a database of the test unit for identifying the appropriate test contacts that should be used for testing.

A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

A mechanism (4) for securing a module (5) inserted into a module receiving frame (1) to the module receiving frame (1) and releasing the module (5) for removal from the module receiving frame (1), comprising a catch (6) arranged on the module (5) or the module receiving frame (1), which catch (6) may be moved to and fro between an open position and a locking position of the catch (6), and a spring (7) for preloading the catch (6) into one of the two positions, the open position or the locking position. The mechanism (4) further comprises a catch holder (11), which may be moved to and fro between a retaining position, in which it holds the catch (6) back against the preloading of the spring (7), and a release position, in which it does not hold the catch (6) back against the preloading of the spring (7).

A connector assembly for a portable field device testing includes a two-wire communication line to provide communication between a handheld maintenance tool and a field device, a first two-prong plug to provide power and communication signals to the field device and a shunt plug to provide power to the field device using the two-wire communication line.

The present invention relates to a measurement or inspection apparatus which can be adjusted depending on a color of a plugged-in cable. In this manner the display of measurement values and the colour of the plugged-in cable can be coordinated to each other such that a simple assignment between measurement values and cable can be performed.

A coaxial inspection connector comprises an outer conductor including first and second housings having tubular shapes extending in a first direction, and a center conductor including first and second center conductor portions extending in the first direction, with the first conductor portion fixed to the first housing by a first bushing. The first housing supporting the second housing with an end portion of the second housing on one side in the first direction swinging in a second direction perpendicular to the first direction. The second center conductor portion includes a swing portion supported by the first center conductor portion with an end portion of the second center conductor portion on the one side in the first direction swinging in the second direction, and a tip portion including the end portion on the one side in the first direction and movable in the first direction relative to the swing portion.

A medium or high voltage electrical device includes a housing, a central conductor provided within the housing, and a sacrificial cap configured for mounting on the housing. The sacrificial cap includes an outer housing, an insulated body, and a sacrificial conductor provided within the insulated body, wherein the sacrificial conductor electrically communicates with the central conductor within the housing when the sacrificial cap is mounted on the housing. A voltage test point terminal is provided within the insulated body and accessible via the outer housing of the sacrificial cap to capacitively couple with the sacrificial conductor. The sacrificial cap includes a portion configured to be physically severed to confirm that the electrical connector is de-energized.

The present disclosure describes a semiconductor wafer testing environment for routing signals used for testing integrated circuits formed onto a semiconductor wafer. The semiconductor wafer testing environment includes a semiconductor wafer tester to control overall operation and/or configuration of the semiconductor wafer testing environment and a semiconductor wafer prober to test the integrated circuits formed onto the semiconductor wafer. The semiconductor wafer prober includes a probe card having a transmission line coupler formed onto a flexible substrate. The transmission line coupler includes multiple transmission line coupling blocks that extend radially from a central point of the flexible substrate in a circular manner.