An inspection device with improved inspection accuracy of electrical characteristics of a component, including a holding table, a pair of measuring elements configured to grip a component held on the holding table 32 and measure electrical characteristics of the component; and a relative movement device configured to relatively move the holding table and the pair of measuring elements. In a state in which component is clamped by the pair of measuring elements, by moving holding table, component and the holding table are separated by at least a set value, and in that state the electrical characteristics are measured. Therefore, even if the holding table is made of a conductive material, effects on the component are reduced, and the electrical characteristics can be measured accurately.

After measuring electrical characteristics, a component favorably drops from a measuring element. An inspection device includes a pair of measuring elements configured to measure electrical characteristics of a component by gripping the components due to being capable of approaching and separating from each other; and air supply device configured to supply air to at least one of a pair of opposing surfaces that oppose each of the pair of measuring elements, and by supplying air to at least one of the opposing surfaces from air supply device, a component s adhered to the at least one opposing surface can be caused to drop favorably.

A method and a system for testing various types of chips includes: registering, by a tester connected to a chip, a model pattern of signals; receiving, by the tester via no more than a single cable, an output signal generated by the chip based on a test signal generated by the tester or by an image sensor connected to the chip; comparing, by the tester, a pattern in the output signal with the model pattern of signals; and displaying, by a display, a test result based on a comparison of the pattern in the output signal with the model pattern of signals.

The present invention belongs to the technical field of electric automobiles and particularly relates to a fault tolerance decision-making method and system for sensor failure of a vehicular wheel hub driving system. The method comprises a current sensor failure diagnostic process, a position/velocity sensor failure diagnostic process and a selection process for a wheel hub motor fault tolerance control method. The system comprises a current sensor failure diagnostic module, a position/velocity sensor failure diagnostic module and a selection module for a wheel hub motor fault tolerance control method. The position/velocity sensor failure diagnostic module further comprises a fault tolerance control switching module. The present invention has the characteristics of establishing a control strategy decision-making mechanism oriented to random complicated current and position sensor failure conditions and designing a multivariable decision-making model according to a vehicular velocity range and a sensor fault condition to realize a fault tolerance control process compatible with a full velocity range.

End launch termination devices are shown and disclosed. In one embodiment, the device includes a housing, a first clamp fixedly attached to the housing, and a second clamp opposed to the first clamp and movably attached to at least one of the first clamp or the housing, the first and second clamps defining a gap therebetween to receive a test substrate. The device additionally includes a conductor received in the cavity and fixedly attached to the housing, a center pin attached to the conductor and extending into the gap, and a rod resistor received in the cavity, attached to the conductor, and extending out of the housing.

A method and system are provided for implementing user configurable probing with magnetic connections and printed circuit board (PCB) features. A first magnet is located at a desired probe point on the PCB, a probe having a second magnet of suitable polarity and an electrical contact is moved to the probe point. The first and second magnets attract each other, and the probe point makes electrical contact with an electrical conductor at the probe point.

An electrical contact for use in an integrated circuit testing apparatus with a very short conducting contact pin. The shortness of the contact pin is made possible due to the unique design and coupling of the contact pin with an elastomer, and both supported by a housing in such a way that the contact pin test height is brought down to 0.5 mm, while providing a deflection of 0.1 mm with is sufficient in order to provide adequate penetration to matte tin plated devices. The contact pin of this invention looks almost like the letter F, rotated 90 to the left, so that it lies on its left side. The rectangular shaped elastomer is placed between the prongs of the F. The bottom part of the F is curved upwards so that it is almost parallel to the prongs.

A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.

A testing unit including a substrate, a plurality of vias located in the substrate, a plurality of pin traces having a height and a width and each extending from a respective via towards an edge of the substrate and terminating at an end point, a plurality of termination points adjacent to the end points of the pin traces, a plurality of end traces having a height and a width with each end trace extending from an end point of a respective pin trace towards to a corresponding termination point near to the pin trace, a plurality of traces extending from the end of a respective end point or termination point to the edge of the substrate.

A probe includes a self-aligning connector set, a moveable probe tip, a cable, a housing, and a spring. When the probe tip is pressed to a test point on a device-under-test, the probe tip moves within the housing to cause a first connector and a second connector of the self-aligning connector set to be connected through an adapter of the self-aligning connector set, thereby establishing a signal path through the probe. The first connector, second connector, and adapter are structured so that their respective ground conductors become connected prior to their respective signal conductors becoming connected. Electro-static charge present at the test point is safely discharged through a resistor to ground before the signal path through the probe is established, thereby preventing damage to the probe and connected host instrument. When the probe tip is removed from the device-under-test, the spring forces a disconnection of the first and second connectors.