A method of testing a semiconductor wafer comprising a scribe line and a plurality of dies. The method includes implementing a first landing pad on the scribe line and implementing a first interconnect on the scribe line and between the first landing pad and a first cluster of the plurality of dies, thereby coupling the first landing pad to the first cluster of dies. The method also includes performing the testing of the first cluster of dies using automated test equipment (ATE) coupled to a probe tip by contacting the first landing pad with the probe tip and applying an ATE resource to the first cluster of dies.

The present invention relates to the inspection process which includes providing access to the microdevice contacts, measuring the microdevice and analyzing the data to identify defects or performance of the micro device. The invention also relates to the forming of test electrodes on microdevices. The test electrodes may be connected to hidden contacts. The type of microdevices may be vertical, lateral or a flip chip.

A testing system to provide feedback on the construction of a length of cable includes a testing apparatus having a cable coupler with ports to accept a connector on the end of the length of cable and a tester unit to send a test signal through the ports and length of cable and generate data based on the test signal; a computing device in communication with the testing apparatus to receive the data, process the data to produce a feedback score, associate the score with a discrete instance, store the score; and a display device configured to receive and display information related to the score. The testing system further includes a timer unit to track a time period and provide the time period to the computing device to be stored, used to further rank scores, and displayed by the display device as part of the information related to the score.

An electronic test equipment is adapted to test an electronic component. The electronic component has a circuit body and a plurality of connectors that are electrically connected to the circuit body. The electronic test equipment includes a metallic test seat and a plurality of spring probes. The metallic test seat is adapted to support the circuit body thereon, and is formed with a plurality of spaced-apart probe holes extending therethrough and possessing diameters that are substantially the same. Each of the probe holes is adapted to receive a corresponding one of the connectors. The spring probes are respectively and entirely positioned within the probe holes, and are adapted to electrically contact the connectors.

Various methods and systems are provided for an electrical testing apparatus for an electrical panel and associated wiring harness. In one embodiment, an electrical testing apparatus includes a common housing; a first connector tethered to the housing via a first plurality of wires extending away from and coupled within the housing, where the first connector is adapted to connect to an electrical panel; a second connector mounted to the housing and adapted to connect to a wiring harness of the electrical panel, the wiring harness including a second plurality of wires; and a third connector mounted to the housing and including a plurality of test points for testing an electrical signal passing through each wire of the second plurality of wires.

A high voltage digital voltmeter and wireless phaser includes first and second voltmeters/phasers. Each voltmeter/phaser has a probe for accessing a point in a circuit, circuitry connected to the probe and including a microprocessor, and a ground reference associated with the circuitry. Each microprocessor is programmed to measure line-to-ground voltage of the respective voltmeter/phaser. This information is shared between the microprocessors and is used to determine voltage measurements and phase angle difference.

A method and apparatus for non-intrusively measuring flowing currents and/or voltage on the inner conductor of a coaxial cable is introduced herein. In particular, a resultant low-impedance element is coupled concentrically to the shield at a desired insertion point of the coaxial cable. A pair of conductive leads provided by the resultant low-impedance element is thereafter monitored for derived flowing currents that are in direct proportion to but of opposite polarity to the current within the inner conductor of the coaxial cable.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.

A system and method for determining that a male terminal and a female terminal are becoming disconnected in a connector as a result of the connector becoming loose or the terminals becoming corroded. The connector is a multi-terminal connector including a male terminal housing that houses a plurality of male terminals and a female terminal housing that houses a plurality of associated female terminals. One of the male terminals is a diagnostic terminal that is shorter than the other male terminals so that it is disconnected from its associated female terminal before the other male terminals when the terminal housing separate, which can be used to detect connector failure.

A connector includes a connector body including a hole, a contact disposed in the hole and arranged such that, when the connector is connected to a substrate, the contact is connected to a corresponding electrical pad on the substrate, a conductive elastomeric interface arranged such that, when the connector is connected to the substrate, the conductive elastomeric interface is between the connector body and the substrate, and a cable connected to the contact. The contact includes a ground ferrule and a locking ferrule arranged to mate with the hole, and the hole of the connector body and the locking ferrule are at least partially threaded. When the connector is connected to the substrate and when the locking ferrule is threaded with the hole, the ground ferrule contacts at least one of the conductive elastomeric interface and the upper surface of the substrate.