The present invention relates to a coaxial socket of an impedance matching structure for semiconductor chip testing and a manufacturing method thereof. The coaxial socket includes a test socket locating substrate, a test socket body, a test socket cover, and a test probe. A polymer I and a polymer II are installed and fastened in the test socket body and the test socket cover respectively. A probe slot I and a probe slot II are provided in the polymer I and the polymer II respectively. The test probe is inserted through the probe slot I and the probe slot II. In the present invention, the test socket body and the test socket cover are made of conductive metal, and single-end impedance matching of 50 ohms or differential impedance matching of 100 ohms is performed between them and the probe, to achieve superb signal transmission and heat conduction.

A coaxial terminal includes a signal terminal, a tubular ground terminal that covers the signal terminal, and an insulating member interposed between the signal terminal and the ground terminal. The signal terminal includes a main body that is covered by the insulating member, an upper contact piece that extends from the main body to +Z direction side, and a lower contact piece that extends from the main body to −Z direction side. The insulating member has an opening through which a part of the main body is exposed. A following formula (1) is satisfied:

L.sub.2≥½×L.sub.1  (1)

where L.sub.1 is a length of the insulating member along an axial direction of the coaxial terminal, L.sub.2 is a length of the opening along the axial direction.

A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

An electrical assembly comprising an electrical connector assembly that may include: a utility device comprising a plurality of pins; a socket attached to a cord, the socket comprising a plurality of receptacles to receive the plurality of pins; and one or more metal-oxide varistors (MOVs) disposed inside the socket, where the one or more MOVs are electrically connected to the plurality of pins when the plurality of pins are received by the plurality of receptacles.

A method (200) and a connection test device (100; 300) for checking an intermittent impedance variation in a first and/or a second line (110; 302, 334) are described. The connection test device (100; 300) comprises a transmitter (102; 308) having a test signal generator (106) for generating a test signal and a first test point (108; 304) for connecting the first (110; 302) or the second line (334), wherein the test signal generator (106) supplies the test signal to the first (110; 302) or the second line (334) via the first test point (108; 304). The connection test device (100; 300) further comprises a first receiver (104; 310) having a second test point (112; 306, 336) for connecting the first (110; 302) or second line (334) and a receiver front end (114; 326, 328) which receives an incoming signal from the first (110; 302) or second line (334) via the second test point (112; 306, 336). The connection test device (100; 300) has, in addition, an evaluation logic (116), which is connected to the receiver front end (114; 326, 328) and which compares the input signal to a threshold value in order to identify an intermittent impedance variation in the first (110; 302) and/or the second line (334).

The methods and apparatus allow one user to test cable continuity using a wire-configurable directional connector. The methods and apparatus may transmit a first and second voltage pulse through a first and second wire of a cable under test, respectively, having a wire-configurable directional connector attached. Both voltage pulses travel through the wire-configurable directional connector. The first voltage pulse selectively leaves at least one of the second wire and a third wire of the cable under test and the second voltage pulse selectively leaves the third wire. The methods and apparatus may store a pre-determined pattern of a returning voltage pulse specific to the cable under test, and determine a state of the first, second, and third wires in response to receiving the first and second voltage pulses.

A contact terminal includes a tubular body extending in an axial direction of the contact terminal and having conductivity; a bar-shaped first conductor having conductivity and capable of coming into contact with an inspection target; and a bar-shaped second conductor having conductivity. The first conductor includes: a first protrusion that protrudes from the tubular body toward one side in the axial direction; and a first insertion portion provided at the other end of the first conductor in the axial direction and disposed in the tubular body. The second conductor includes a second insertion portion disposed in the tubular body. The tubular body includes: a spring portion configured in a spiral shape along a peripheral surface of the tubular body; and a first body portion connected to one side in the axial direction of the spring portion. The first insertion portion is fixed to the first body portion.

The disclosure is directed to an observation circuit for observing an input impedance at a high frequency connector of a mobile device terminal, the observation circuit comprising a measurement circuitry, wherein the measurement circuitry comprises the high frequency connector, a reference impedance, a voltage source, and a voltage meter. A first output electrode of the voltage source is connected to both a first electrode of the high frequency connector and a first input electrode of the voltage meter over the reference impedance, and a second output electrode of the voltage source is connected to both a second electrode of the high frequency connector and a second input electrode of the voltage meter.

An electrical testing device includes a housing having a base and a cover. The base and the cover define a cavity. The electrical testing device includes an input connector and a plurality of output connectors in electrical communication with the input connector. A fuse is in electrical communication with the input connector and the plurality of output connectors. The input connector and each output connector of the plurality of output connectors is adapted to connect to an interchangeable test lead. The input connector and each output connector of the plurality of output connectors is in electrical communication with an activation mechanism.

The disclosure describes a novel method and apparatus for improving silicon interposers to include test circuitry for testing stacked die mounted on the interposer. The improvement allows for the stacked die to be selectively tested by an external tester or by the test circuitry included in the interposer.