A test assembly for testing an antenna-in-package (AiP) device includes a socket over a circuit board, where the socket includes an opening for receiving the AiP device; a plunger configured to move along sidewalls of the opening, where during testing of the AiP device, the plunger is configured to cause the AiP device to be pressed towards the circuit board such that the AiP device is operatively coupled to the circuit board via input/output connections of the AiP device and of the circuit board; and a loadboard disposed within the socket and between the plunger and the AiP device, where the loadboard includes a coupling structure configured to be electromagnetically coupled to a transmit antenna and to a receive antenna of the AiP device, so that testing signals transmitted by the transmit antenna are conveyed to the receive antenna externally relative to the AiP device through the coupling structure.

A modular pressing device capable of generating stage downward forces is provided. The modular pressing device comprises a non-exchangeable pressing module and an exchangeable pressing module. The non-exchangeable pressing module includes a first downward force generating unit. The exchangeable pressing module includes a second downward force generating unit. The first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module. The second downward force generating unit applies a second downward force to the electronic device. Thereby, the modular pressing device is capable to generate two different downward forces to reduce the downward surge force. In addition, as the exchangeable pressing module is worn, the exchangeable pressing module can be replaced quickly such that the maintenance cost can be effectively reduced and the stability of the apparatus can be enhanced.

An apparatus includes a clip mounted to a base that pivots about a first pivot axis between a first position and a second position. An abutment surface of the clip is spaced from a path of a carrier structure when the clip is in the first position. The abutment surface engages the carrier structure to secure the carrier structure and a device to the apparatus when the clip is in the second clip position. A cam includes a first surface that pivots the clip to the first clip position when the cam is in the first cam position. The cam includes a second surface that extends into an opening of the base when the cam is in a first position to allow a stop plate pin to engage the cam to rotate the cam from the first position to a second position when a stop plate is installed.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

An apparatus includes a clip mounted to a base that pivots about a first pivot axis between a first position and a second position. An abutment surface of the clip is spaced from a path of a carrier structure when the clip is in the first position. The abutment surface engages the carrier structure to secure the carrier structure and a device to the apparatus when the clip is in the second clip position. A cam includes a first surface that pivots the clip to the first clip position when the cam is in the first cam position. The cam includes a second surface that extends into an opening of the base when the cam is in a first position to allow a stop plate pin to engage the cam to rotate the cam from the first position to a second position when a stop plate is installed.

The present invention is related to a clipped testing device, comprising a first clamping member, a second clamping member, a shaft, and a conducting member. The first clamping member has a first pin joint member and a first substrate, the second clamping member has a second pin joint member and a second substrate. The shaft detachably pivoted to a first pin joint member and a second pin joint member. The conducting member is disposed on the first clamping member and is located between the first substrate and the second substrate. The conducting member has an upper surface and a lower surface. The lower surface of the conducting member faces toward the first substrate, and at least a part of the conducting member is wavy-shaped and has a first scraping structure on the upper surface thereof.

Provided is a semiconductor chip test socket configured to be coupled to a test circuit board for testing a semiconductor chip and provided with an integrated circuit (IC) chip having unique information and an algorithm for counting the number of times the semiconductor chip test socket is used, such that the number of times the semiconductor chip test socket is used may be exactly counted, and the IC chip may be easily installed and removed and securely protected from external impacts.

The embodiments of the present disclosure provide an apparatus, system and method for testing electrical functions. The apparatus for testing electrical functions comprises: at least one clamping tool configured to be capable of being clamped in the vicinity of at least one bonding area of an electronic device; at least one row of probes configured to be electrically connected to multiple pins in the at least one bonding area respectively when the at least one clamping tool is clamped; and at least one multiplex switch. Each multiplex switch has a first terminal comprising multiple ports, and a second terminal comprising at least one port and capable of being connected to a measurement instrument, and the at least one multiplex switch is configured to turn on or turn off an electrical connection between the multiple ports of the first terminal and at least one port of the second terminal.

A modular pressing device capable of generating stage downward forces is provided. The modular pressing device comprises a non-exchangeable pressing module and an exchangeable pressing module. The non-exchangeable pressing module includes a first downward force generating unit. The exchangeable pressing module includes a second downward force generating unit. The first downward force generating unit applies a first downward force to at least one of a testing seat and an electronic device through the exchangeable pressing module. The second downward force generating unit applies a second downward force to the electronic device. Thereby, the modular pressing device is capable to generate two different downward forces to reduce the downward surge force. In addition, as the exchangeable pressing module is worn, the exchangeable pressing module can be replaced quickly such that the maintenance cost can be effectively reduced and the stability of the apparatus can be enhanced.