In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

A contact socket module for use in an automated test equipment (ATE) for testing electronic components (DUTs) being carried by a carrier comprises: a plurality of groups of spring contacts, wherein each spring contact comprises a DUT sided contact tip, a retracting plate being moveable, and a controller controlling the movement of the retracting plate, wherein the retracting plate and the spring contacts act mechanically on each other. In a first position the DUT sided contact tips are adapted to contact to contact portions of the electronic components, and in a second position, the DUT sided contact tips are adapted to release the contact to the contact portions of the electronic components.

The present disclosure discloses an assembly for carrying a chip, and a device and a method for testing a chip. The assembly for carrying a chip is configured to fasten chips of different sizes, and includes a rotatable vertical rod, a cross beam, a first sidewall, and a second sidewall. The rotatable vertical rod is provided with a gear that surrounds the rotatable vertical rod with gear teeth. The cross beam is internally provided with a first through hole and a first chute. A top of the first sidewall is connected to a first connecting rod located in the first chute. A top of the second sidewall is connected to a second connecting rod located in the first chute. A side surface of the first connecting rod is provided with a plurality of first tooth grooves arranged linearly.

In some embodiments, apparatuses and methods are provided herein useful for testing a touchscreen electronic device. In some embodiments, an attachment for an end effector for use with testing a touchscreen electronic device comprises a body, wherein the body includes a connection portion configured to secure the attachment to the end effector, a first end, an opening, wherein the opening is located adjacent to the first end, and a conductive contact member, wherein the conductive contact member is wrapped about the first end, and wherein the conductive contact member is configured to contact the touchscreen during testing and simulate a touch of a human finger.

Various technologies to facilitate coupled electrical and mechanical measurement of conductive materials are disclosed herein. A gripping device simultaneously holds a specimen in place and causes contact to be made between the specimen and a plurality of electrodes connected to an electrical measuring device. An electrical characteristic of the specimen is then measured while a mechanical load is applied to the specimen, and a relationship between the mechanical load and changes in the electrical characteristic can be identified.

The embodiments of the present disclosure provide an apparatus, system and method for testing electrical functions. The apparatus for testing electrical functions comprises: at least one clamping tool configured to be capable of being clamped in the vicinity of at least one bonding area of an electronic device; at least one row of probes configured to be electrically connected to multiple pins in the at least one bonding area respectively when the at least one clamping tool is clamped; and at least one multiplex switch. Each multiplex switch has a first terminal comprising multiple ports, and a second terminal comprising at least one port and capable of being connected to a measurement instrument, and the at least one multiplex switch is configured to turn on or turn off an electrical connection between the multiple ports of the first terminal and at least one port of the second terminal.

A test instrument probe that encompasses the dual alternate action of a point or a clamp-grip within the same probe. This probe has approximately the same dimensions as a conventional probe, and allows either the point or clamp action to be used without the necessity of removing the probe from the hand. This alternate action requires only using a thumb and finger pressure to change from a point to a clamp or the clamp to a point. One embodiment allows a clamp jaw opening of up to a nominal inch that is usually sufficient to grip onto the leads of an electronic component such as resistor, capacitor or integrated circuit pin. The probes are also designed so that when not in use, the two probes can be connected together by a snap-in action that minimizes the potential loss of a probe and importantly allows the points to become safely enclosed to minimize a sharp point hazard.

An insulator for a test clip is described. The insulator includes a first clip cover configured to removably attach to a top portion of a test clip. The test clip comprises a top portion and a bottom portion pivotally attached to the top portion along a pivot axis. The insulator also comprises a second clip cover configured to removably attach to the bottom portion of the test clip. Each of the first and the second clip cover comprises one or more retaining elements configured to secure the clip cover to its respective portion of the test clip. In some implementations, each of the first and the second clip cover comprises one or more cantilevered retaining segments configured to extend over a portion of the test clip in order to secure the first and the second clip covers to the test clip.