A socket includes: a contact probe; and an insulating support body supporting the contact probe. The contact probe includes: a first plunger to be connected with an object to be inspected; a second plunger to be connected with an inspecting board; and a spring configured to urge the first plunger and the second plunger in a direction apart from each other. In a state where a tip end of the first plunger is released, a projecting amount of the second plunger from the insulating support body is zero with a natural length of the spring.

To provide a socket for electrical component that allows an electrical component to be easily accommodated and to be able to be accommodated and be used even if the electrical component is large. The IC socket 10 comprises a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the IC package 11; and a lever member 17 for pressing the cover member 15. The cover member 15 and the lever member 17 are rotatably connected to the same side end side of the socket body 13, and a pressing means 25, for pushing down the cover member 15 by closing the lever member 17 at the state that the cover member 15 is closed, is provided.

Provided is a handler apparatus that conveys a device under test to a test socket, including: an actuator that, prior to fitting of a device holder to the test socket, fits the device holder, and adjusts a position of the device under test on the device holder; and a conveyer that conveys the device holder in which a position of the device under test has been adjusted, to fit the test socket, where the device holder includes: an inner unit to mount the device under test; an outer unit to retain the inner unit to be movable; and a release button to release a lock of movement of the inner unit, in response to being pressed from a side to which the device under test is mounted, and the actuator sets the inner unit to be movable by pressing the release button and adjusts a position of the inner unit.

The present disclosure provides a test device and a test method using the test device. The test device includes a first fastener structure for fastening a to-be-tested substrate with first touch lines, a second fastener structure for fastening a test match panel with second touch lines, and the first touch lines and the second touch lines forming a touch module, a third fastener structure for supporting a change-over flexible printed circuit board, a signal input structure for electrically connecting to one of a circuit board in the test match panel and the first touch lines through the change-over flexible printed circuit board, and inputting trigger data signals, a sensing signal capture structure for capturing touch sensing signals in the first touch line or the second touch lines.

The present invention relates to a test socket that is disposed between a blood test device and a test apparatus to electrically connect a terminal of the blood test device and a pad of the test apparatus with each other. Conduction units that are arranged at positions corresponding to the terminal of the blood test device and show conductivity in a thickness direction have: conduction units that are arranged in such a manner that multiple conductive particles are arranged in the thickness direction in an elastic insulating material; and an insulating support unit that supports and insulates each of the conduction units. The conductive particles are provided with through-holes bored through one surface and another surface other than the one surface, and the through-holes are filled with the elastic insulating material.

A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.

A testing apparatus for testing an integrated circuit package having a plurality of electrical terminals includes a base, a socket, a plurality of conductive pins and a plurality of conductive pillars. The base includes a plurality of electrical contacts. The socket is disposed on the base and includes a bended portion bended away from the base and a plurality of through holes distributed in the socket. The conductive pins are disposed in the through holes respectively and electrically connected to the electrical contacts, wherein each of the conductive pins protrudes from an upper surface of the socket for forming temporary electrical connections with one of the electrical terminals. The conductive pillars are disposed on the base and connected to the bended portion, wherein each of the conductive pillars electrically connects one of the conductive pins and one of the electrical contacts.

The present invention relates to a test socket configured to electrically connect a tester generating a test signal and a device under inspection to each other includes a nonelastic electrically-conductive housing having a plurality of housing holes passing therethrough in a thickness direction, an insulating coating layer applied on at least an upper surface of the nonelastic electrically-conductive housing and a circumference of each of the plurality of housing hole, and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, disposed in the housing hole such that a lower end portion thereof may be connected to a signal electrode of the tester placed below the nonelastic electrically-conductive housing.

The socket 20 comprises a first contact probe 21 which has a first end which is to contact with a first terminal 91 of the DUT 90, a second contact probe 22 which has a second end which is to contact with a second terminal 92 of the DUT 90, and an inner housing 23 which holds the first and second contact probes 21, 22 so that the first end and the second end are located on substantially the same virtual plane VP, and the length L.sub.2 of the second contact probe 22 is shorter than the length L.sub.1 of the first contact probe 21. The interposer 30 comprises a substrate 31 which has a through hole 311 into which the first contact probe 21 is to be inserted, and a wiring pattern 32 which is disposed on the substrate 31, and the wiring pattern 32 has a pad 321 with which the second contact probe 22 is to contact.

A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming a dielectric layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, bonding a device die to the dielectric layer and a first portion of the plurality of bond pads through hybrid bonding, and bonding a die stack to through-silicon vias in the device die.