Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.

Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in the lower array plate and an upper retention feature undergoing lateral displacement relative to the upper plate probe hole such that it can no longer longitudinally pass through the extension of the upper plate probe hole in the upper array plate.

A wafer inspection system is provided. The wafer inspection system includes: a transfer region in which a transfer device is arranged; an inspection region in which test heads for inspecting a substrate are arranged; and a maintenance region in which the test heads are maintained. The inspection region is located between the transfer region and the maintenance region, a plurality of inspection rooms accommodating the test heads are adjacent to each other in the inspection region, and the test heads are configured to be unloaded from the inspection region to the maintenance region.

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A probe card test apparatus including an insulating substrate; a conductive pattern on the insulating substrate; and a plurality of device under test (DUT) units on the conductive pattern, wherein each of the DUT units includes a merged-probe opening, a probe opening, and a detector in parallel, and an isolator surrounding the merged-probe opening, the probe opening, and the detector.

The present invention relates to a substrate testing cartridge provided for simultaneously testing multiple substrates for which a substrate treatment process has been finished, and a method for manufacturing same. According to an embodiment of the present invention, a substrate testing cartridge comprises: a chuck member on which a substrate is placed; a probe card which contacts and tests the substrate and is positioned to face the chuck member with reference to the substrate; and coupling members which couple the substrate, the chuck member, and the probe card, wherein each coupling member comprises: a substrate coupling part which couples the substrate and the chuck member; and a chuck coupling part which couples the probe card and the chuck member.

A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.

A testing probe system includes probes configured to contact shared probe pads of multi-channel die of a wafer; and a controller configured to generate testing patterns and receive signals from the multi-channel die of the wafer. The controller is configured to contact a probe of the probes with a shared probe pad of the multi-channel die, select a first channel of the multi-channel die to test, select at least one test mode for testing the first channel, stimulate at least the first channel during a single contact period, acquiring a first output of the first channel during the single contact period, select a second channel of the multi-channel die to test, select at least one test mode for testing the second channel, stimulate at least the second channel during the single contact period, and acquire a second output of the first channel during the single contact period.

A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle.

An AC electronic solid-state switch includes an electrically insulating and thermally conductive layer, a first electrically conductive trace, a second electrically conductive trace, and a plurality of semiconductor dies each electrically connected to the first electrically conductive trace and the second electrically conductive trace. Each of the plurality of semiconductor dies forms a MOSFET, IGBT or other types of electronically controllable switch. The AC electronic solid-state switch further includes a common drain conductor that is electrically connected to each drain terminal of the plurality of semiconductor dies. The AC electronic solid-state switch is configured to block between 650 volts and 1700 volts in the off-state in a first direction and a second direction, the second direction being opposite the first direction, and the AC electronic solid-state switch is configured to carry at least 500 A continuously in the on-state with a voltage drop of less than 2V.