A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction.

A probe card assembly is disclosed. The probe card assembly includes a probe card plate, a probe core, and an expansion gap defined in the probe card plate. The probe core includes a bonding portion for fixing the probe core to the probe plate. The expansion gap surrounds the probe core. Another probe card assembly is disclosed. The another probe card assembly includes a probe card plate, a tube, and a probe core. The tube is configured to be inserted into an opening of the probe card plate and configured to be securely fixed to the probe card plate. The probe core includes a bonding portion for fixing the probe core to the tube.

A method for testing a workpiece (3), in particular a circuit board, by a test pin (2) arranged on a holder (1), the test pin (2) approaching a predetermined position on or in the workpiece (3), a position of the test pin (2) with respect to the holder (1) is intended to be changed.

There is provided a prober chuck capable of carrying out low leakage evaluation on a magnetic memory under environment in which a magnetic field is applied. A prober chuck 1 for a magnetic memory retains a wafer W having a magnetic memory formed thereon. The chuck 1 includes: a chuck top 10 that is made of a conductive material and has a wafer W placed thereon; an insulating layer 11 that is made of an insulating material and is adapted to support the bottom surface of the chuck top 10; and a guard layer 12 that is made of a conductive material and is arranged under the insulating layer 11, the guard layer being insulated from the chuck top 10 via the insulating layer 11. All of the members constituting the chuck 1 including the chuck top 10 and the guard layer 12 are made of a non-magnetic material.

A nontransitory computer-readable program storage medium storing program instructions. The program, when executed by a processor, has the processor capable of receiving a set of input data, the input data relating to devices on a test board for testing a device under test. The program, when executed by a processor, also is capable of transforming the set of input data into test board mapping data. The test board mapping data comprises an ordered listing of potential test points along a path that couples to a conductive surface, wherein the potential test points are derived from at least one of the test board attributes. Further, the program, when executed by a processor, is capable of identifying a selected test point from among the one or more potential test points, the selected test point for spike check probing of the device under test.

A circuit board tester and method that precisely aligns the probe plate and circuit board is disclosed. With a circuit board and probe plate mounting within a housing having a top and bottom, hinged together, at closure there may be slight misalignments of the two. By making one of the two plates floating, or laterally slideable with respect to each other, it is possible to make final alignment at closure. One of the two plates can be provided with a pin and the other with a pin receiving alignment block. With the lateral slideability, the pin and block can insure proper probe alignment. Additional systems for correcting misaligned pins or blocks are also disclosed.

A wafer probe station system for reliability testing of a semiconductor wafer. The wafer probe station is capable of interfacing with interchangeable modules for testing of semiconductor wafers. The wafer probe station can be used with different interchangeable modules for wafer testing. Modules, such as probe card positioners and air-cooled rail systems, for example, can be mounted or docked to the probe station. The wafer probe station is also provided with a front loading mechanism having a rotatable arm that rotates at least partially out of the probe station chamber for wafer loading.

A first signal line pattern has one end electrically connected to a first connector. A second signal line pattern has one end electrically connected to a second connector. The second signal line pattern has the other end facing the other end of the first signal line pattern. A conductive block has a convex portion. The convex portion of the conductive block is electrically connected to a third portion of the conductive pattern positioned between the other end of the first signal line pattern and the other end of the second signal line pattern of the wiring board.

The probe apparatus has a probe (first metal plate) as a signal terminal and a probe (second metal plate) as a ground terminal. A probe holder has a holder main body formed of a conductor, clamps that are formed of a dielectric and capable of clamping the probes and a fixing member and a male screw capable of fixing both clamps, which have clamped the probes, to the holder main body. The probes are clamped by the two clamps in a state where the probes have been aligned along the plate surface direction, parts at front-end portion sides of the probes protrude from the two clamps, and the parts at front-end portion sides are capable of elastic deformation along the plate thickness direction.

A test fixture (20) for testing continuity in at least one electrode of a neuromodulation device. The test fixture may comprise a substrate (22), at least one electrically conductive pad (24a) disposed on the substrate for reducing pressure applied to the at least one electrode when the electrically conductive pad makes contact with an exposed surface of the electrode, and a wire (26a) extending from the at least one electrically conductive pad. The pad may be formed of a non-abrasive material, such as conductive foam or smooth metal. The substrate may be a probe formed with a number of slots for holding pads and routing wires, a mandrel with openings for holding pads and routing wires, and a flexible circuit with exposed smooth metal surfaces. The test fixture may be suitable for testing cuff-like and paddle-like devices.